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SN54ALS2968JD

Texas Instruments

SN54ALS2968JD by Texas Instruments

SN54ALS2968JD by Texas Instruments is a Memory Controller with 18-bit Address Bus, 1M X 16 Memory Organization, and operates at -55 to 125 °C. It is designed for MILITARY applications requiring DRAM control, featuring a max supply voltage of 5.5 V and package style IN-LINE.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,916 parts In-Stock

1+ parts

-

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7,916

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Digiode

USA . 829 parts In-Stock

1+ parts

-

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-

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829

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 867 parts In-Stock

1+ parts

$7.041

100+ parts

-

1k+ parts

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10k+ parts

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867

$7.041

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Corohmni

South Africa . 2,443 parts In-Stock

1+ parts

$19.847

100+ parts

-

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2,443

$19.847

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One Stop Electronics

USA . 1,594 parts In-Stock

1+ parts

$21.000

100+ parts

-

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1,594

$21.000

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Parana Technologies

USA . 1,829 parts In-Stock

1+ parts

$37.392

100+ parts

-

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10k+ parts

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1,829

$37.392

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ChromeModa Solutions

Germany . 1,552 parts In-Stock

1+ parts

$42.014

100+ parts

$34.451

1k+ parts

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10k+ parts

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1,552

$42.014

$34.451

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IDEA Electronic Components Group

UK . 170 parts In-Stock

1+ parts

$42.014

100+ parts

$39.913

1k+ parts

$37.813

10k+ parts

-

170

$42.014

$39.913

$37.813

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Corphita

USA . 3,986 parts In-Stock

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3,986

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DigiPath Technology Company

USA . 1,109 parts In-Stock

1+ parts

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100+ parts

$37.880

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1,109

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$37.880

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Overview

Discover the superior quality of the SN54ALS2968JD by Texas Instruments, a top-of-the-line Memory Controller that offers unmatched reliability and performance. Manufactured with precision and expertise by Texas Instruments, this product is designed to meet the highest standards in the industry. Ideal for a wide range of applications, this Memory Controller provides seamless operation and efficient memory organization. With its advanced technology and military-grade temperature tolerance, the SN54ALS2968JD ensures optimal functionality in any environment. Experience the value and benefits of this exceptional product, delivering unparalleled advantages to customers seeking reliable memory control solutions.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable and high-quality package material ensures the longevity and reliability of the memory controller.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power input, making it suitable for a wide range of applications.

Address Bus Width: 18

With a wide address bus width, this memory controller can support a large amount of memory, making it ideal for demanding tasks.

Minimum Operating Temperature: -55 °C

The wide temperature range of operation ensures that this memory controller can perform reliably in extreme conditions.

No. of Banks: 4

Having multiple banks allows for more efficient memory access and management, enhancing overall performance.

Technical Specifications

Memory Controllers SN54ALS2968JD attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

18

Boundary Scan:

NO

External Data Bus Width:

0

JESD-30 Code:

R-CDIP-T48

Low Power Mode:

NO

Memory Organization:

1M X 16

No. of Banks:

4

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Memory Controllers

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SN54ALS2968JD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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