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SM32C6713BGDPS20EP

Texas Instruments

SM32C6713BGDPS20EP by Texas Instruments

Texas Instruments SM32C6713BGDPS20EP is a 32-bit DSP with integrated cache, 200 MHz clock frequency, and 272 terminals. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption. Features include 22-bit address bus width, 32-bit external data bus width, and boundary scan capability.

Median Price

$100.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

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$100.940

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Digiode

USA . 710 parts In-Stock

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$95.893

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710

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Vyrian

USA . 1,943 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 286 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$24.975

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$22.727

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$20.480

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$24.975

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Microchip USA

USA . 2,566 parts In-Stock

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$53.180

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$52.250

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$51.790

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$51.330

2,566

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$51.330

Parana Technologies

USA . 589 parts In-Stock

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$75.027

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Corohmni

South Africa . 666 parts In-Stock

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$78.315

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ChromeModa Solutions

Germany . 4,814 parts In-Stock

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$84.300

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$69.126

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IDEA Electronic Components Group

UK . 1,097 parts In-Stock

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$84.300

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$80.085

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$75.870

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1,097

$84.300

$80.085

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Corphita

USA . 2,200 parts In-Stock

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$90.846

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Lixinc

USA . 8,546 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 2,324 parts In-Stock

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$76.005

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Alle Elektronik GmbH

Germany . 959 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SM32C6713BGDPS20EP by Texas Instruments, a high-quality Digital Signal Processor (DSP) that delivers unparalleled performance and reliability. Crafted by a renowned manufacturer, this DSP is designed for a wide range of applications, offering seamless integration and efficient data processing. Elevate your projects with integrated cache, multiple power supplies, and a wide array of features that ensure optimal functionality. Embrace innovation and efficiency with the SM32C6713BGDPS20EP, the ultimate solution for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the DSP, making it suitable for a variety of applications.

Integrated Cache: YES

Integrated cache helps improve processing speeds and efficiency by storing frequently accessed data, enhancing overall performance of the DSP.

Maximum Supply Voltage: 1.32 V

Having a maximum supply voltage of 1.32V allows for efficient power usage and prevents damage to the DSP by keeping the voltage within safe limits.

Address Bus Width: 22

A wider address bus width of 22 bits allows for larger memory addressing capabilities, enabling the DSP to handle complex algorithms and data processing tasks effectively.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it easier to integrate the DSP into different electronic systems.

Bit Size: 32

With a bit size of 32, the DSP can handle data processing with higher precision and accuracy, making it suitable for applications that require complex calculations.

Power Supplies (V): 1.3,3.3

Multiple power supply options of 1.3V and 3.3V provide flexibility in powering the DSP according to the specific requirements of the application, ensuring compatibility and efficient operation.

No. of Terminals: 272

Having a high number of terminals allows for connectivity with various external components and interfaces, enabling versatile usage of the DSP in different systems.

Package Style (Meter): GRID ARRAY

Grid array package style provides reliable connections and mechanical stability, ensuring proper functioning and durability of the DSP in harsh operating environments.

Minimum Supply Voltage: 1.2 V

A minimum supply voltage of 1.2V ensures that the DSP can operate efficiently even with lower power input, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the DSP to function reliably in elevated temperature conditions, expanding its usability in various industrial settings.

No. of External Interrupts: 4

Having multiple external interrupts allows the DSP to respond quickly to external events or signals, improving real-time responsiveness and performance in time-critical applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures that the DSP can operate effectively in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability, facilitating easy assembly and maintenance of the DSP in electronic systems.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and integration of the DSP into compact electronic devices, optimizing space utilization and enhancing design flexibility.

Maximum Seated Height: 2.57 mm

Low maximum seated height of 2.57mm minimizes the overall profile of the DSP, making it suitable for applications with space constraints or limited clearance.

RAM Words: 65536

Having a high number of RAM words enables the DSP to store and access a larger amount of data, enhancing its processing capabilities and efficiency in handling complex algorithms.

Width: 27 mm

Compact width of 27mm allows for easy integration of the DSP into various electronic systems, making it a versatile choice for applications with limited space.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the DSP during manufacturing or maintenance, ensuring high quality and reliability of the product.

External Data Bus Width: 32

A wide external data bus width of 32 bits enables fast data transfer and processing, improving the overall performance and speed of the DSP in handling data-intensive tasks.

Maximum Clock Frequency: 200 MHz

High maximum clock frequency of 200MHz allows the DSP to execute instructions at a fast rate, enhancing its processing speed and efficiency for demanding applications.

Peak Reflow Temperature °C: 220

The high peak reflow temperature of 220°C ensures reliable soldering and assembly of the DSP onto PCBs, preventing solder joint failures and ensuring long-term product durability.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architecture enhances data throughput and parallel processing capabilities of the DSP, enabling efficient execution of multiple tasks simultaneously.

Length: 27 mm

Compact length of 27mm allows for easy integration of the DSP into electronic systems with limited space, ensuring versatile usage and flexibility in design.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with other peripheral IC types, the DSP offers versatile functionality and compatibility with a wide range of external devices, making it a versatile choice for various applications.

No. of Timers: 2

Having multiple timers allows the DSP to perform time-critical operations and scheduling tasks efficiently, enhancing its functionality in applications that require precise timing control.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the DSP energy-efficient and suitable for battery-powered devices or applications with power constraints.

Terminal Form: BALL

Ball terminal form provides reliable connections and mechanical strength, ensuring robust performance and longevity of the DSP in demanding operating conditions.

Nominal Supply Voltage: 1.26 V

Having a nominal supply voltage of 1.26V ensures stable and efficient power delivery to the DSP, optimizing its performance and reliability in different operating conditions.

No. of DMA Channels: 16

Having multiple DMA channels allows for efficient data transfer and handling without CPU intervention, improving overall system performance and enabling faster data processing by the DSP.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm provides easy connectivity and assembly of the DSP onto PCBs, facilitating efficient integration into electronic systems and reducing manufacturing complexity.

Format: FLOATING POINT

Floating-point format enhances the processing capabilities of the DSP by enabling high-precision mathematical calculations and complex algorithms, making it suitable for applications that require accurate computation.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the level of protection needed during handling and assembly to prevent damage from moisture, ensuring the reliability and longevity of the DSP in humid environments.

Low Power Mode: YES

Low power mode feature allows the DSP to operate with reduced power consumption during idle or standby periods, prolonging battery life and enhancing energy efficiency in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6713BGDPS20EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SM32C6713BGDPS20EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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