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SM32C6416TBGLZI1EP

Texas Instruments

SM32C6416TBGLZI1EP by Texas Instruments

Texas Instruments SM32C6416TBGLZI1EP DSP features 32-bit architecture, 4096 RAM words, and 100 MHz clock frequency. Ideal for industrial applications requiring high-speed processing with low power consumption. Offers integrated cache, boundary scan support, and multiple internal bus architecture for efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,004 parts In-Stock

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4,004

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Digiode

USA . 2,355 parts In-Stock

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2,355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 348 parts In-Stock

1+ parts

$19.724

100+ parts

-

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348

$19.724

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Parana Technologies

USA . 277 parts In-Stock

1+ parts

$25.197

100+ parts

-

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$25.840

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277

$25.197

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$25.840

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DigiPath Technology Company

USA . 1,666 parts In-Stock

1+ parts

$27.745

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1,666

$27.745

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ChromeModa Solutions

Germany . 2,715 parts In-Stock

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$28.311

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$23.215

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2,715

$28.311

$23.215

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IDEA Electronic Components Group

UK . 1,330 parts In-Stock

1+ parts

$28.311

100+ parts

$26.895

1k+ parts

$25.480

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1,330

$28.311

$26.895

$25.480

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One Stop Electronics

USA . 1,234 parts In-Stock

1+ parts

$34.000

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1,234

$34.000

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Component Stockers USA

USA . 278 parts In-Stock

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$99.990

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278

$99.990

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Microchip USA

USA . 2,523 parts In-Stock

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$139.500

100+ parts

$137.070

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$135.860

10k+ parts

$134.650

2,523

$139.500

$137.070

$135.860

$134.650

Corohmni

South Africa . 9 parts In-Stock

1+ parts

$321.165

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9

$321.165

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Kepictronics

USA . 3,000 parts In-Stock

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Corphita

USA . 2,748 parts In-Stock

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Overview

Experience unmatched performance and reliability with the SM32C6416TBGLZI1EP from Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) is designed for a wide range of applications, providing integrated cache, high clock frequency, multiple DMA channels, and low power mode for efficient operation. Whether you're working on audio processing, telecommunications, or industrial automation, this product offers exceptional value, benefits, and advantages to meet your specific needs. Trust in Texas Instruments to deliver top-quality solutions for your digital processing requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Integrated Cache: YES

Having an integrated cache improves processing efficiency and reduces latency, making the product suitable for high-performance applications.

Maximum Supply Voltage: 1.24 V

The low maximum supply voltage helps in minimizing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 32

With a wide address bus width of 32, the product can access a large memory space efficiently, enhancing overall performance.

Package Shape: SQUARE

The square package shape allows for easier integration and placement on circuit boards, optimizing space utilization.

Bit Size: 32

The 32-bit architecture allows for processing larger chunks of data at a time, improving the speed and efficiency of the product.

No. of Terminals: 532

Having a high number of terminals enables connectivity to a wide range of external devices, expanding the product's versatility and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style offers high density and reliability in the interconnection of components, ensuring stable performance.

Minimum Supply Voltage: 1.16 V

The low minimum supply voltage further enhances the product's energy efficiency and reduces power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance makes the product suitable for industrial environments with varying temperature conditions.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6416TBGLZI1EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SM32C6416TBGLZI1EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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