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SM320F2812GHHMEP

Texas Instruments

SM320F2812GHHMEP by Texas Instruments

The Texas Instruments SM320F2812GHHMEP is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 16-bit data bus width. Ideal for military applications, it features low power mode, flash ROM programmability, and multiple internal bus architecture.

Median Price

$43.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 292 parts In-Stock

1+ parts

$43.390

100+ parts

$42.520

1k+ parts

$41.650

10k+ parts

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292

$43.390

$42.520

$41.650

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 741 parts In-Stock

1+ parts

$41.220

100+ parts

-

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741

$41.220

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Vyrian

USA . 4,762 parts In-Stock

1+ parts

-

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4,762

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ACDS - Activité Composants Distribution Service

France . 23 parts In-Stock

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23

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 357 parts In-Stock

1+ parts

$9.292

100+ parts

-

1k+ parts

$8.921

10k+ parts

$8.921

357

$9.292

-

$8.921

$8.921

AZTECH Wire

Italy . 1,095 parts In-Stock

1+ parts

$19.750

100+ parts

-

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1,095

$19.750

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Corphita

USA . 1,866 parts In-Stock

1+ parts

$39.051

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1,866

$39.051

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Parana Technologies

USA . 130 parts In-Stock

1+ parts

$48.242

100+ parts

-

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130

$48.242

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DigiPath Technology Company

USA . 1,648 parts In-Stock

1+ parts

$53.121

100+ parts

-

1k+ parts

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1,648

$53.121

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-

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Corohmni

South Africa . 2,445 parts In-Stock

1+ parts

$53.938

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2,445

$53.938

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ChromeModa Solutions

Germany . 1,830 parts In-Stock

1+ parts

$54.205

100+ parts

$44.448

1k+ parts

-

10k+ parts

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1,830

$54.205

$44.448

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IDEA Electronic Components Group

UK . 1,230 parts In-Stock

1+ parts

$54.205

100+ parts

$51.495

1k+ parts

$48.784

10k+ parts

-

1,230

$54.205

$51.495

$48.784

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Microchip USA

USA . 124 parts In-Stock

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124

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Overview

Experience unmatched performance and reliability with the Texas Instruments SM320F2812GHHMEP digital signal processor. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in their products. This DSP is perfect for a wide range of applications, thanks to its high clock frequency and low power mode. With features like flash ROM programmability and multiple internal bus architecture, this product offers unparalleled value and efficiency to customers seeking superior performance in their projects. Unlock endless possibilities with the SM320F2812GHHMEP and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 2 V

Allows for efficient power utilization without risking damage to the device.

Bit Size: 32

Enables high-speed processing and handling of complex digital signals.

Maximum Operating Temperature: 125 °C

Ensures optimal performance even in high-temperature environments.

RAM Words: 18432

Provides ample storage for temporary data processing, enhancing overall performance.

Maximum Clock Frequency: 150 MHz

Allows for speedy data processing and execution of instructions.

Technology: CMOS

Offers low power consumption and high noise immunity, ideal for efficient signal processing.

Technical Specifications

Digital Signal Processors (DSPs) SM320F2812GHHMEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

SM320F2812GHHMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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