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SM320F2801PZMEP

Texas Instruments

SM320F2801PZMEP by Texas Instruments

SM320F2801PZMEP by Texas Instruments is a 32-bit DSP with 100 terminals, operating at up to 100 MHz. Ideal for digital signal processing applications, it features 16-bit on-chip data RAM and flash ROM programmability. With low power mode and multiple internal bus architecture, it offers high performance in a compact package.

Median Price

$24.012

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,654 parts In-Stock

1+ parts

$19.824

100+ parts

$17.316

1k+ parts

$11.942

10k+ parts

-

2,654

$19.824

$17.316

$11.942

-

DigiKey

USA . 180 parts In-Stock

1+ parts

$28.200

100+ parts

$19.987

1k+ parts

$18.810

10k+ parts

-

180

$28.200

$19.987

$18.810

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,130 parts In-Stock

1+ parts

$18.833

100+ parts

-

1k+ parts

-

10k+ parts

-

3,130

$18.833

-

-

-

Vyrian

USA . 8,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,630

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,720 parts In-Stock

1+ parts

$17.842

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

$17.842

-

-

-

Microchip USA

USA . 2,477 parts In-Stock

1+ parts

$53.540

100+ parts

$52.610

1k+ parts

$52.150

10k+ parts

$51.680

2,477

$53.540

$52.610

$52.150

$51.680

Corohmni

South Africa . 53 parts In-Stock

1+ parts

$61.077

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$61.077

-

-

-

Parana Technologies

USA . 1,699 parts In-Stock

1+ parts

$75.779

100+ parts

-

1k+ parts

-

10k+ parts

-

1,699

$75.779

-

-

-

ChromeModa Solutions

Germany . 1,979 parts In-Stock

1+ parts

$85.145

100+ parts

$69.819

1k+ parts

-

10k+ parts

-

1,979

$85.145

$69.819

-

-

IDEA Electronic Components Group

UK . 1,103 parts In-Stock

1+ parts

$85.145

100+ parts

$80.888

1k+ parts

$76.630

10k+ parts

-

1,103

$85.145

$80.888

$76.630

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

DigiPath Technology Company

USA . 2,347 parts In-Stock

1+ parts

-

100+ parts

$76.767

1k+ parts

-

10k+ parts

-

2,347

-

$76.767

-

-

Overview

Experience cutting-edge technology with the Texas Instruments SM320F2801PZMEP Digital Signal Processor. Manufactured with precision and expertise, this DSP offers unparalleled performance and reliability for a wide range of applications. With features like low power mode, multiple internal bus architecture, and boundary scan capability, this product provides exceptional value and benefits to customers in need of high-quality signal processing solutions. Upgrade your systems with the SM320F2801PZMEP and experience seamless operation and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 1.89 V

Allows for flexibility in power supply options without risking damage to the DSP.

Bit Size: 32

A higher bit size allows for more precise calculations and processing of digital signals, enhancing overall performance.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperature environments, expanding the potential use cases for this DSP.

Maximum Clock Frequency: 100 MHz

Capable of high-speed processing, making it suitable for applications that require real-time signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the DSP efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) SM320F2801PZMEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

6144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SM320F2801PZMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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