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SM320DM642AZDKI7

Texas Instruments

SM320DM642AZDKI7 by Texas Instruments

Texas Instruments SM320DM642AZDKI7 is a DSP with 64-bit external data bus width, 23 address bus width, and 75.19 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,889 parts In-Stock

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Digiode

USA . 4,078 parts In-Stock

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Chip Stock

USA . 155 parts In-Stock

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155

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Distributors (Availability)

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AZTECH Wire

Italy . 280 parts In-Stock

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$16.598

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280

$16.598

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Corohmni

South Africa . 2,409 parts In-Stock

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$20.845

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$20.845

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One Stop Electronics

USA . 1,519 parts In-Stock

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$24.000

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Parana Technologies

USA . 463 parts In-Stock

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$65.019

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463

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DigiPath Technology Company

USA . 2,030 parts In-Stock

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$71.594

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$71.594

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ChromeModa Solutions

Germany . 4,501 parts In-Stock

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$73.055

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$59.905

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$73.055

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IDEA Electronic Components Group

UK . 234 parts In-Stock

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$73.055

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$69.402

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$65.750

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234

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$65.750

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Microchip USA

USA . 2,010 parts In-Stock

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$153.820

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$149.720

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$147.670

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$145.620

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$153.820

$149.720

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$145.620

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,249 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the SM320DM642AZDKI7 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors (DSPs) that cater to a wide range of applications. The SM320DM642AZDKI7 is designed to provide optimal results with its integrated cache, low power mode, and advanced internal bus architecture. With a maximum clock frequency of 75.19 MHz and 64 DMA channels, this product offers exceptional value and benefits to customers looking for cutting-edge technology. Upgrade your systems today with the SM320DM642AZDKI7 and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency, enhancing the overall performance of the DSP.

Surface Mount: YES

Surface mount technology allows for easy installation, reducing the space required and making it suitable for compact designs.

Maximum Supply Voltage: 1.44 V

Higher maximum supply voltage allows for better performance and stability under varying external conditions.

Package Shape: SQUARE

Square package shape is space-efficient and provides better thermal characteristics for heat dissipation.

No. of Terminals: 548

Higher number of terminals enable better connectivity options and functionality for the DSP.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures the DSP can perform reliably in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the DSP energy-efficient and fast.

Technical Specifications

Digital Signal Processors (DSPs) SM320DM642AZDKI7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SM320DM642AZDKI7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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