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OMAP3503ECBC

Texas Instruments

OMAP3503ECBC by Texas Instruments

OMAP3503ECBC by Texas Instruments is a DSP with integrated cache, 32-bit RAM, and 59 MHz clock frequency. It is used in digital signal processing applications due to its low power mode, boundary scan feature, and 32 DMA channels for efficient data transfer.

Median Price

$34.337

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 90 parts In-Stock

1+ parts

$36.230

100+ parts

-

1k+ parts

$29.349

10k+ parts

-

90

$36.230

-

$29.349

-

Rochester

USA . 3,836 parts In-Stock

1+ parts

-

100+ parts

$27.470

1k+ parts

$24.580

10k+ parts

$23.140

3,836

-

$27.470

$24.580

$23.140

Verical

USA . 2,527 parts In-Stock

1+ parts

-

100+ parts

$34.337

1k+ parts

$30.725

10k+ parts

$28.925

2,527

-

$34.337

$30.725

$28.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,052 parts In-Stock

1+ parts

$29.004

100+ parts

-

1k+ parts

-

10k+ parts

-

4,052

$29.004

-

-

-

Vyrian

USA . 6,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,211

-

-

-

-

DigiKey Marketplace

USA . 3,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,836

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,298 parts In-Stock

1+ parts

$27.477

100+ parts

-

1k+ parts

-

10k+ parts

-

3,298

$27.477

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$43.357

100+ parts

$39.455

1k+ parts

$35.553

10k+ parts

-

2,500

$43.357

$39.455

$35.553

-

Corohmni

South Africa . 2,636 parts In-Stock

1+ parts

$69.475

100+ parts

-

1k+ parts

-

10k+ parts

-

2,636

$69.475

-

-

-

Parana Technologies

USA . 1,730 parts In-Stock

1+ parts

$76.448

100+ parts

$7,099.387

1k+ parts

$68.803

10k+ parts

-

1,730

$76.448

$7,099.387

$68.803

-

DigiPath Technology Company

USA . 1,960 parts In-Stock

1+ parts

$84.179

100+ parts

-

1k+ parts

-

10k+ parts

-

1,960

$84.179

-

-

-

ChromeModa Solutions

Germany . 6,141 parts In-Stock

1+ parts

$85.897

100+ parts

$70.436

1k+ parts

-

10k+ parts

-

6,141

$85.897

$70.436

-

-

IDEA Electronic Components Group

UK . 1,718 parts In-Stock

1+ parts

$85.897

100+ parts

$81.602

1k+ parts

$77.307

10k+ parts

-

1,718

$85.897

$81.602

$77.307

-

Microchip USA

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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112

-

-

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Overview

Unlock the power of advanced digital signal processing with the Texas Instruments OMAP3503ECBC. Designed with precision and quality in mind, this DSP offers unparalleled performance and reliability for a wide range of applications. From audio processing to image recognition, the OMAP3503ECBC delivers exceptional value and efficiency, making it the ideal choice for customers seeking cutting-edge technology. Trust in Texas Instruments to provide top-of-the-line solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Integrated Cache: YES

The integrated cache helps improve the processing speed and efficiency of the DSP, making it suitable for applications requiring quick data retrieval.

Maximum Supply Voltage: 1.91 V

The high maximum supply voltage allows for versatility in power input options, making it compatible with a wide range of power sources.

On Chip Data RAM Width: 32

The wide data RAM width enhances the data processing capabilities of the DSP, enabling it to handle complex algorithms and calculations efficiently.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space and easy integration into circuit designs.

Power Supplies (V): 1.1,1.8,3.3

The multiple power supply options cater to different power requirements, giving flexibility in design and compatibility with various systems.

No. of Terminals: 515

The high number of terminals enables connectivity with multiple external components and peripherals, expanding the functionality of the DSP.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch design of the package make it suitable for compact and densely packed circuit board layouts.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and compatibility with low-power applications, optimizing energy efficiency.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the DSP to function reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the DSP can operate effectively in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

The triple metal finish provides excellent conductivity and corrosion resistance for reliable terminal connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier and more convenient PCB mounting and assembly processes.

Maximum Seated Height: 0.9 mm

The low maximum seated height allows for slim and compact device designs without compromising performance.

RAM Words: 32768

The large RAM capacity enables the DSP to handle and process a significant amount of data simultaneously, improving overall performance.

Width: 12 mm

The compact width of the DSP makes it suitable for space-constrained applications while still offering high processing capabilities.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the DSP during the manufacturing and maintenance processes.

Maximum Clock Frequency: 59 MHz

The high maximum clock frequency enables fast data processing and real-time operations, making the DSP suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of heat damage during soldering processes, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering processes without compromising the integrity of the DSP.

Internal Bus Architecture: SINGLE

The single internal bus architecture simplifies data transfer and communication between components, improving efficiency and reducing latency.

Length: 12 mm

The compact length of the DSP contributes to its overall small form factor, making it suitable for portable and space-sensitive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor type of peripheral IC enhances the DSP's ability to process and manipulate digital signals effectively, expanding its application versatility.

No. of Timers: 15

The multiple timers offer precise timing control for various operations, enhancing the DSP's capability to manage time-critical tasks accurately.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption, high speed, and reliable performance, making it ideal for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, suitable for applications where mechanical stability is crucial.

Nominal Supply Voltage: 1.8 V

The stable and efficient nominal supply voltage optimizes the DSP's performance and power consumption, ensuring consistent operation.

No. of DMA Channels: 32

The high number of DMA channels allows for efficient data transfer and processing, improving overall system performance and responsiveness.

ROM Programmability: MROM

The MROM programmability of the ROM ensures secure and reliable storage of essential program data, preventing unauthorized tampering and data loss.

Terminal Pitch: 0.4 mm

The fine terminal pitch enables high-density mounting and connections, suitable for compact and miniaturized electronic devices.

Format: FLOATING POINT

The floating-point format enhances the DSP's ability to perform complex mathematical computations accurately, making it suitable for scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level ensures the DSP's reliability and performance even in humid conditions or during reflow soldering processes.

Low Power Mode: YES

The low power mode feature allows the DSP to conserve energy when idle or during low-demand tasks, extending battery life and reducing power consumption.

On Chip Program ROM Width: 32

The on-chip program ROM width of 32 bits enables the DSP to store and execute program instructions efficiently, enhancing overall processing speed and performance.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3503ECBC attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Terminals:

515

No. of Timers:

15

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

.9 mm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.91 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP3503ECBC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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