Loading...

OMAP3503DZCBCS

Texas Instruments

OMAP3503DZCBCS by Texas Instruments

OMAP3503DZCBCS by Texas Instruments is a DSP with 515 terminals, operating temp range of 0-70°C. It has power supplies of 1.1V, 1.8V, and 3.3V suitable for various applications like digital signal processing in commercial-grade devices.

Median Price

$28.305

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 168 parts In-Stock

1+ parts

$27.750

100+ parts

$26.090

1k+ parts

$23.590

10k+ parts

-

168

$27.750

$26.090

$23.590

-

DigiKey

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$28.860

1k+ parts

-

10k+ parts

-

168

-

$28.860

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,898 parts In-Stock

1+ parts

$26.362

100+ parts

-

1k+ parts

-

10k+ parts

-

4,898

$26.362

-

-

-

Vyrian

USA . 7,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,335

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,844 parts In-Stock

1+ parts

$24.975

100+ parts

-

1k+ parts

-

10k+ parts

-

1,844

$24.975

-

-

-

Corohmni

South Africa . 844 parts In-Stock

1+ parts

$38.889

100+ parts

-

1k+ parts

-

10k+ parts

-

844

$38.889

-

-

-

Parana Technologies

USA . 1,804 parts In-Stock

1+ parts

$53.468

100+ parts

$4,965.281

1k+ parts

$48.121

10k+ parts

-

1,804

$53.468

$4,965.281

$48.121

-

DigiPath Technology Company

USA . 681 parts In-Stock

1+ parts

$58.874

100+ parts

-

1k+ parts

-

10k+ parts

-

681

$58.874

-

-

-

IDEA Electronic Components Group

UK . 2,286 parts In-Stock

1+ parts

$60.076

100+ parts

$57.072

1k+ parts

$54.068

10k+ parts

-

2,286

$60.076

$57.072

$54.068

-

ChromeModa Solutions

Germany . 111 parts In-Stock

1+ parts

$60.076

100+ parts

$49.262

1k+ parts

-

10k+ parts

-

111

$60.076

$49.262

-

-

Microchip USA

USA . 201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

201

-

-

-

-

Perfect Parts

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Overview

Unlock the full potential of your digital signal processing projects with the OMAP3503DZCBCS from Texas Instruments. Renowned for their exceptional quality and reliability, Texas Instruments manufactures cutting-edge DSPs that deliver unparalleled performance in a wide range of applications. Whether you're designing multimedia systems, industrial automation solutions, or communication networks, this versatile product offers unmatched value, benefits, and advantages to help you bring your innovative ideas to life. Transform your designs with the OMAP3503DZCBCS and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the DSP, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and eliminating the need for through-hole mounting.

Power Supplies (V): 1.1, 1.8, 3.3

Offers flexibility in power options, allowing compatibility with a wide range of systems.

No. of Terminals: 515

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

Enables efficient routing of signals and connections, improving overall signal integrity.

Maximum Operating Temperature: 70 °C

Suitable for operation in various environments without risk of overheating or performance degradation.

Minimum Operating Temperature: 0 °C

Ensures reliable operation even in low-temperature conditions, making the DSP versatile for use in different settings.

Terminal Position: BOTTOM

Facilitates easy assembly and maintenance, as the terminals are conveniently located for access.

Temperature Grade: COMMERCIAL

Designed for typical commercial applications, making it a cost-effective choice for businesses and industries.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Offers advanced processing capabilities for handling digital signals efficiently, along with additional features for enhanced performance.

Technology: CMOS

Employs low power consumption and high noise immunity, ideal for digital signal processing applications that require efficiency and reliability.

Terminal Form: BALL

Allows for reliable connections and solder joints, ensuring stable connectivity for the DSP in electronic systems.

Terminal Pitch: 0.5 mm

Offers precise spacing between terminals, enabling compact design and efficient signal routing on circuit boards.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3503DZCBCS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B515

No. of Terminals:

515

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

OMAP3503DZCBCS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20