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MSP430F67661IPEUR

Texas Instruments

MSP430F67661IPEUR by Texas Instruments

MSP430F67661IPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at temperatures from -40 to 85 °C, it's ideal for industrial applications requiring low power consumption and high performance. With a max supply voltage of 3.6 V, this MICROPROCESSOR CIRCUIT is suitable for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,976 parts In-Stock

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4,976

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Digiode

USA . 2,195 parts In-Stock

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2,195

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Distributors (Availability)

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AZTECH Wire

Italy . 497 parts In-Stock

1+ parts

$6.354

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497

$6.354

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Parana Technologies

USA . 1,552 parts In-Stock

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$25.127

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$25.795

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1,552

$25.127

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$25.795

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DigiPath Technology Company

USA . 950 parts In-Stock

1+ parts

$27.668

100+ parts

$25.455

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950

$27.668

$25.455

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ChromeModa Solutions

Germany . 6,677 parts In-Stock

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$28.233

100+ parts

$23.151

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6,677

$28.233

$23.151

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IDEA Electronic Components Group

UK . 1,857 parts In-Stock

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$28.233

100+ parts

$26.821

1k+ parts

$25.410

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1,857

$28.233

$26.821

$25.410

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One Stop Electronics

USA . 586 parts In-Stock

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$32.000

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586

$32.000

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Corohmni

South Africa . 142 parts In-Stock

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$74.382

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Corphita

USA . 412 parts In-Stock

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Microchip USA

USA . 329 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the MSP430F67661IPEUR by Texas Instruments. This cutting-edge microprocessor circuit offers a wide range of applications, from consumer electronics to industrial automation. Boasting top-notch quality and reliability, Texas Instruments sets the industry standard for innovation. Experience seamless operation and enhanced functionality with the MSP430 family, providing customers with exceptional value and benefits. Upgrade your devices today with the MSP430F67661IPEUR and revolutionize your technology experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good electrical insulation and protection for the integrated circuits inside the package.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB designs, saving space and reducing assembly costs.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape is easy to handle and integrate into circuit designs.

Bit Size: 16

16-bit architecture allows for efficient processing capabilities.

Power Supplies (V): 2/3.3

Supports multiple power supply options for flexibility in different environments.

No. of Terminals: 128

Sufficient number of terminals for connecting to other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compact and low-profile design, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Can operate at low supply voltages for power efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for secure mounting on the PCB.

ROM Words: 262144

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design for space-saving and compact applications.

Width: 14 mm

Compact width for fitting into tight spaces on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for proper soldering during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during manufacturing processes.

Length: 20 mm

Optimal length for handling and integration into PCB layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature requirements and harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes microprocessor circuitry for enhanced functionality and processing capabilities.

RAM Bytes: 16384

Sufficient RAM capacity for data storage and processing needs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering to the PCB.

Maximum Supply Current: 11.75 mA

Low supply current consumption for energy efficiency.

Nominal Supply Voltage: 3.3 V

Stable and commonly used nominal supply voltage for reliable operation.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts and compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate level of moisture sensitivity during storage and handling.

Speed: 25 rpm

Operates at a speed of 25 rotations per minute, providing efficient processing capabilities.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67661IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67661IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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