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STLVDS104BTR

STMicroelectronics

STLVDS104BTR by STMicroelectronics

STLVDS104BTR from STMicroelectronics is a 4-bit line transceiver with a max supply voltage of 3.6V and operates in -40 °C to 85 °C. It features low transmit/receive delays of 4.2 ns, making it ideal for high-speed data communication applications. Its compact SOIC package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,453 parts In-Stock

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4,453

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Anansix

USA . 1,961 parts In-Stock

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1,961

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Digiode

USA . 160 parts In-Stock

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160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 291 parts In-Stock

1+ parts

$10.022

100+ parts

-

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$9.020

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291

$10.022

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$9.020

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Semicontronic

India . 563 parts In-Stock

1+ parts

$11.500

100+ parts

$11.212

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$11.155

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563

$11.500

$11.212

$11.155

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MKK Technologies

India . 321 parts In-Stock

1+ parts

$18.847

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321

$18.847

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DigiPath Technology Company

USA . 321 parts In-Stock

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$18.847

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321

$18.847

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Corphita

USA . 2,022 parts In-Stock

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2,022

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Parana Technologies

USA . 1,169 parts In-Stock

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$11.983

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$11.983

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Overview

Unlock the power of high-speed data communication with the STLVDS104BTR from STMicroelectronics. Renowned for its exceptional reliability and efficiency, this line driver/receiver excels in demanding industrial applications where performance matters. With rapid transmit and receive capabilities, it ensures seamless connectivity while maintaining low power consumption. Trust in STMicroelectronics’ legacy of innovation to elevate your next project with unmatched quality and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in various environments, making it suitable for industrial applications.

Surface Mount: YES

Surface mount compatibility allows for efficient and space-saving designs in modern electronics.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the device is compatible with a wide range of low-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in space optimization on PCBs, making it versatile for different layouts.

Maximum Transmit Delay: 4.2 ns

A maximum transmit delay of just 4.2 ns ensures high-speed data transmission, which is crucial for real-time applications.

Power Supplies (V): 3.3

Operating at a standard 3.3 V power supply makes integration seamless with most modern electronics.

No. of Terminals: 16

With 16 terminals, this product offers ample connectivity options, enhancing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for compact applications where space is a constraint.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures operation in a variety of low-power scenarios.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, it can function reliably in higher temperature environments.

Minimum Operating Temperature: -40 °C

Capable of operating at temperatures as low as -40 °C, it is ideal for harsh environmental conditions.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and reliability in connections, making it a durable choice for prototyping and production.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in design, allowing for various PCB configurations.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm helps maintain a slim profile in compact designs.

Width: 4.4 mm

A width of 4.4 mm fits well in tight spaces, making it suitable for densely packed circuit boards.

Differential Output: YES

Differential outputs provide better noise immunity and signal integrity, crucial for high-speed applications.

Length: 5 mm

A compact length of 5 mm makes integration easier in smaller devices and systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, it can withstand harsh operating conditions for prolonged usage.

Maximum Receive Delay: 4.2 ns

With a maximum receive delay of 4.2 ns, this product ensures synchronized and efficient data transfer.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and manufacturing processes, enhancing production efficiency.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 standards assures high performance and interoperability with existing systems.

Input Characteristics: DIFFERENTIAL

Differential input characteristics minimize common-mode noise and enhance the reliability of data transmission.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V streamlines design and power management in low-voltage systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for more compact layouts while maintaining reliable connections.

Driver No. of Bits: 4

With a 4-bit driver capability, it supports multi-bit data signaling, ideal for parallel data communication.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it ensures efficient data transmission over various distances, making it suitable for diverse applications.

Technical Specifications

Line Drivers & Receivers STLVDS104BTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.2 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

4.2 ns

Width:

4.4 mm

Trade Compliance

STLVDS104BTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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