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STLV3243ECTR

STMicroelectronics

STLV3243ECTR by STMicroelectronics

STLV3243ECTR from STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V and operates in industrial temperatures (-40 °C to 85 °C). It features 3 drivers, 5 receivers, and supports EIA-232 standards. Ideal for compact applications requiring reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,484 parts In-Stock

1+ parts

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3,484

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Anansix

USA . 2,069 parts In-Stock

1+ parts

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2,069

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Digiode

USA . 426 parts In-Stock

1+ parts

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426

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,089 parts In-Stock

1+ parts

$13.271

100+ parts

-

1k+ parts

$11.944

10k+ parts

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2,089

$13.271

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$11.944

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MKK Technologies

India . 1,824 parts In-Stock

1+ parts

$24.955

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1,824

$24.955

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DigiPath Technology Company

USA . 1,824 parts In-Stock

1+ parts

$24.955

100+ parts

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1,824

$24.955

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Corphita

USA . 4,823 parts In-Stock

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4,823

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Parana Technologies

USA . 890 parts In-Stock

1+ parts

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100+ parts

$15.868

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890

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$15.868

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Overview

Elevate your design with the STLV3243ECTR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This versatile line driver and receiver excels in industrial applications, offering robust performance across a wide temperature range. With its compact, thin-profile design, it seamlessly integrates into your projects while ensuring reliable communication. Experience enhanced efficiency, lower power consumption, and unwavering quality that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides good protection for the internal components, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for smaller device footprints and efficient use of PCB space, making it ideal for compact designs.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage enables compatibility with a wider range of systems and applications.

No. of Functions: 3

Multiple functions in a single device help reduce component count, save board space, and simplify design.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier placement on PCBs while optimizing space and layout.

Power Supplies (V): 2.5/5

Supports dual voltage supplies, providing versatility and ease of integration into different systems.

No. of Terminals: 28

Ample terminals allow for complex connections and multiple interfaces, enhancing functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile design helps in fitting the product into tighter spaces without compromising performance.

Minimum Supply Voltage: 2.3 V

Operates at lower voltages, making it suitable for low-power applications and helping to save energy.

Maximum Operating Temperature: 85 °C

Can operate up to high temperatures, making it suitable for industrial applications where heat is a concern.

Minimum Operating Temperature: -40 °C

Wide temperature range allows deployment in extreme environments, ensuring reliable operation in harsh conditions.

Terminal Position: DUAL

Dual terminal positions improve layout flexibility and ease of routing on the PCB.

Maximum Seated Height: 1.2 mm

Low profile minimizes the height of mounted components, which is beneficial for compact designs.

Width: 4.4 mm

Narrow width helps in designing tighter PCB layouts, making it ideal for space-constrained applications.

Maximum Output Low Current: 1.6 Amp

High output current capacity allows this device to drive larger loads directly, enhancing its application range.

Receiver No. of Bits: 5

With 5 bits available for the receiver, it supports more complex data communication protocols.

Length: 9.7 mm

Compact length supports space-efficient designs without compromising functionality.

Minimum Out Swing: 7.4 V

Allows for strong signaling, ensuring reliable communication across longer distances.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, ensuring reliability and enhanced performance in demanding conditions.

Maximum Receive Delay: 0 ns

Zero delay improves responsiveness and performance in high-speed applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent solderability and mechanical strength, optimizing the device’s reliability.

Interface Standard: EIA-232

Complies with EIA-232 standards, making it compatible with a wide array of communication equipment.

Maximum Supply Current: 1 mA

Low supply current enhances efficiency and prolongs battery life in portable applications.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input provides improved noise immunity, ensuring clean signal transitions and reliable performance.

Nominal Supply Voltage: 3 V

Optimized for nominal voltage supply, ensuring balanced performance in standard operational conditions.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density layouts, essential for modern electronic designs.

Driver No. of Bits: 3

3 bits available for the driver, allowing effective data communication and control in various applications.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver enhances its functionality in transmitting and receiving data efficiently over communication lines.

Technical Specifications

Line Drivers & Receivers STLV3243ECTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

STLV3243ECTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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