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STLV3243EBD

STMicroelectronics

STLV3243EBD by STMicroelectronics

STLV3243EBD by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V and operates in extreme temperatures from -40 °C to 85 °C. It features 3 driver bits, 5 receiver bits, and supports EIA-232 standards. Ideal for industrial applications requiring reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,871

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-

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Digiode

USA . 2,854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,854

-

-

-

-

Vyrian

USA . 2,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,790

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,297 parts In-Stock

1+ parts

$2.272

100+ parts

-

1k+ parts

$2.045

10k+ parts

-

2,297

$2.272

-

$2.045

-

MKK Technologies

India . 39 parts In-Stock

1+ parts

$4.273

100+ parts

-

1k+ parts

-

10k+ parts

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39

$4.273

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-

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DigiPath Technology Company

USA . 39 parts In-Stock

1+ parts

$4.273

100+ parts

-

1k+ parts

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10k+ parts

-

39

$4.273

-

-

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Corphita

USA . 970 parts In-Stock

1+ parts

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970

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Parana Technologies

USA . 269 parts In-Stock

1+ parts

-

100+ parts

$2.717

1k+ parts

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10k+ parts

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269

-

$2.717

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Overview

Elevate your designs with the STLV3243EBD from STMicroelectronics, a premium line transceiver that delivers unmatched reliability and performance. With its robust temperature range and dual functionality, this small-outline device is perfect for industrial applications demanding precision and efficiency. Trust in STMicroelectronics' legacy of quality and innovation to enhance your projects, ensuring seamless communication and exceptional value for your investment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern PCBs, enhancing space efficiency.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options while ensuring safe operation within specified limits.

No. of Functions: 3

Incorporating multiple functions in a single package reduces the overall component count and simplifies circuit design.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient layout design and effective thermal management in the application.

Power Supplies (V): 2.5/5

Compatible with 2.5V and 5V power supplies, offering versatility for various electronic systems and reducing dependency on specific voltage supplies.

No. of Terminals: 28

With 28 terminals, this product provides ample connection points for integration into complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in space-saving designs, which is critical in compact electronic devices.

Minimum Supply Voltage: 2.3 V

A low minimum supply voltage enhances compatibility with low-power applications, supporting energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in industrial environments where higher temperatures might be encountered.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this device suitable for applications in harsh, cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality finish improves corrosion resistance and conductivity, promoting longevity and reliability.

Terminal Position: DUAL

Dual terminal positions facilitate a variety of mounting options, enabling design flexibility.

Maximum Seated Height: 2.65 mm

A low seated height supports compact designs and ensures compatibility with low-profile enclosures.

Width: 7.5 mm

A narrow width enables dense PCB layouts, optimizing space within electronic devices.

Maximum Output Low Current: 1.6 Amp

A high maximum output current capability allows the device to drive larger loads, enhancing its application range.

Receiver No. of Bits: 5

A 5-bit receiver enhances data handling capability, making it suitable for complex communication protocols.

Length: 17.9 mm

The length contributes to compactness, ideal for scenarios where space is limited.

Minimum Out Swing: 7.4 V

A high minimum output swing provides strong signal integrity, essential for long-distance communication.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures the device reliably operates in demanding conditions typical of industrial environments.

Maximum Receive Delay: 0 ns

Zero maximum receive delay indicates optimal performance for high-speed applications requiring immediate data transmission.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and provide reliable mechanical strength.

Interface Standard: EIA-232

Compliance with the EIA-232 standard guarantees compatibility with a wide range of serial communication devices.

Maximum Supply Current: 1 mA

A low maximum supply current helps in conserving power, making this device ideal for battery-operated equipment.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristic enhances noise immunity, ensuring reliable signal integrity in noisy environments.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V balances power consumption and performance, suitable for modern electronic designs.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates easier design and compatibility with existing PCB layouts.

Driver No. of Bits: 3

A 3-bit driver enables efficient data transmission, suitable for both high-speed and low-bandwidth applications.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed to facilitate reliable communication over long distances.

Technical Specifications

Line Drivers & Receivers STLV3243EBD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

STLV3243EBD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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