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STLVDS051BD

STMicroelectronics

STLVDS051BD by STMicroelectronics

STLVDS051BD by STMicroelectronics is a dual line transceiver with a max supply voltage of 3.6V and operates b/w -40 °C to 85°C. It features a fast transmit delay of 2.7ns and supports EIA-644/TIA-644 standards, ideal for high-speed data communication in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,282 parts In-Stock

1+ parts

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3,282

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Digiode

USA . 1,630 parts In-Stock

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1,630

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Anansix

USA . 501 parts In-Stock

1+ parts

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501

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 60 parts In-Stock

1+ parts

$8.437

100+ parts

$8.437

1k+ parts

$8.437

10k+ parts

-

60

$8.437

$8.437

$8.437

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IDEA Electronic Components Group

UK . 1,979 parts In-Stock

1+ parts

$10.482

100+ parts

-

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$9.434

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1,979

$10.482

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$9.434

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MKK Technologies

India . 2,173 parts In-Stock

1+ parts

$19.712

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2,173

$19.712

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DigiPath Technology Company

USA . 2,173 parts In-Stock

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$19.712

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2,173

$19.712

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Corphita

USA . 4,867 parts In-Stock

1+ parts

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4,867

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Parana Technologies

USA . 2,175 parts In-Stock

1+ parts

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$12.533

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2,175

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$12.533

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Overview

Unlock unparalleled performance with the STLVDS051BD from STMicroelectronics, a leader in innovative semiconductor solutions. This exceptional line driver and receiver offers rugged reliability and advanced functionality for your industrial applications, ensuring seamless data transmission even in challenging environments. With its compact design and low power consumption, it delivers outstanding efficiency, making it the perfect choice for high-speed communication systems. Trust in STMicroelectronics' legacy of quality and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for smaller PCB layouts and easier assembly.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage broadens compatibility with various systems.

No. of Functions: 2

Dual function capability enhances versatility in line driver and receiver applications.

Package Shape: RECTANGULAR

The rectangular shape aids efficient space utilization on circuit boards.

Maximum Transmit Delay: 2.7 ns

Low transmit delay ensures fast data communication, critical for high-speed applications.

Power Supplies (V): 3.3

The nominal supply voltage of 3.3 V is standard for most digital circuits, promoting ease of use.

No. of Terminals: 16

With 16 terminals, this device supports a variety of signals and functions.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for compact designs, making it suitable for space-constrained applications.

Maximum High Level Input Current: 0.00002 Amp

Very low input current protects the device from high power draw, prolonging its lifespan.

Minimum Supply Voltage: 3 V

The minimum supply voltage allows for flexibility in power supply options.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in hostile environments.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this product suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and improves contact performance.

Terminal Position: DUAL

Dual terminal positions allow for versatile layouts in circuit design.

Maximum Seated Height: 1.75 mm

Low seated height is advantageous for designs requiring thin profiles.

Width: 3.9 mm

Narrow width helps conserve board space, fitting within compact PCB designs.

Maximum Output Low Current: 2 Amp

High output current capability makes it suitable for driving larger loads.

Receiver No. of Bits: 2

The 2-bit receiver supports efficient data handling in various applications.

Differential Output: YES

Differential outputs reduce noise and enhance signal integrity over long distances.

Length: 9.9 mm

Compact length makes it adaptable for miniaturized electronic setups.

Minimum Out Swing: 0.247 V

Adequate out swing minimizes signal distortion and guarantees clarity in communication.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications ensure reliability and adaptability in tough environments.

Maximum Receive Delay: 4 ns

Quick receive delay ensures minimal latency, enhancing overall device responsiveness.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and soldering on PCBs.

Interface Standard: EIA-644; TIA-644

Compliance with industry standards confirms interoperability and reliability across various applications.

Maximum Supply Current: 20 mA

Low supply current improves power efficiency, making it suitable for battery-operated devices.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and data integrity.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage supports compatibility with common logic levels in digital systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB design and component placement.

Driver No. of Bits: 2

2-bit driver supports efficient data transmission tailored for specific applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, balancing reliability and cost-effectiveness.

Interface IC Type: LINE TRANSCEIVER

Versatile line transceiver functionality allows for a wide range of signal communication applications.

Technical Specifications

Line Drivers & Receivers STLVDS051BD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2.7 ns

Width:

3.9 mm

Trade Compliance

STLVDS051BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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