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STLVDS050BDR

STMicroelectronics

STLVDS050BDR by STMicroelectronics

STLVDS050BDR from STMicroelectronics is a dual line transceiver with a max supply voltage of 3.6V and operates b/w -40 °C to 85 °C. It features a fast transmit delay of 2.7ns and supports EIA-644/TIA-644 standards, ideal for high-speed data communication in industrial applications. Its compact SO package ensures efficient space utilization on PCBs.

Median Price

$2.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,609 parts In-Stock

1+ parts

$2.630

100+ parts

$1.608

1k+ parts

$1.423

10k+ parts

$1.204

1,609

$2.630

$1.608

$1.423

$1.204

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,416 parts In-Stock

1+ parts

$2.498

100+ parts

-

1k+ parts

-

10k+ parts

-

3,416

$2.498

-

-

-

Vyrian

USA . 1,514 parts In-Stock

1+ parts

$2.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,514

$2.630

-

-

-

R&J Components

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

Anansix

USA . 1,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,373

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 317 parts In-Stock

1+ parts

$2.367

100+ parts

-

1k+ parts

-

10k+ parts

-

317

$2.367

-

-

-

Component Stockers USA

USA . 16 parts In-Stock

1+ parts

$2.650

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$2.650

-

-

-

Vigor

Singapore . 2,250 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

$2.660

-

-

-

Microchip USA

USA . 115 parts In-Stock

1+ parts

$3.575

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$3.575

-

-

-

IDEA Electronic Components Group

UK . 1,308 parts In-Stock

1+ parts

$12.092

100+ parts

-

1k+ parts

$10.883

10k+ parts

-

1,308

$12.092

-

$10.883

-

MKK Technologies

India . 2,223 parts In-Stock

1+ parts

$22.739

100+ parts

-

1k+ parts

-

10k+ parts

-

2,223

$22.739

-

-

-

DigiPath Technology Company

USA . 2,223 parts In-Stock

1+ parts

$22.739

100+ parts

-

1k+ parts

-

10k+ parts

-

2,223

$22.739

-

-

-

Perfect Parts

USA . 2,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,122

-

-

-

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Parana Technologies

USA . 1,317 parts In-Stock

1+ parts

-

100+ parts

$14.458

1k+ parts

-

10k+ parts

-

1,317

-

$14.458

-

-

Overview

Unlock superior performance with the STLVDS050BDR from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust line driver and receiver excels in delivering fast, reliable communication for industrial applications, ensuring seamless data transfer even in harsh environments. With its compact design, low power consumption, and impressive temperature range, it brings exceptional value and efficiency to your projects, enhancing overall system performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction enhances reliability and protects against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage ensures compatibility with a wide range of digital circuitry.

No. of Functions: 2

Having multiple functions increases versatility and reduces the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape is optimized for space-efficient layouts on printed circuit boards.

Maximum Transmit Delay: 2.7 ns

Low transmit delays enable high-speed data transmission, making this product suitable for performance-critical applications.

Power Supplies (V): 3.3

The nominal supply voltage of 3.3V aligns with standard digital logic levels, facilitating easy integration.

No. of Terminals: 16

With 16 terminals, this device offers ample connectivity options for different configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained designs while maintaining robust performance.

Maximum High Level Input Current: 0.00002 Amp

Minimal high-level input current contributes to lower power consumption, ideal for energy-efficient applications.

Minimum Supply Voltage: 3 V

The ability to operate down to 3 V enhances compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature rating ensures reliability in demanding environments.

Minimum Operating Temperature: -40 °C

The extended temperature range from -40 °C allows this product to be used in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish offers improved solderability and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning facilitates a more flexible integration into various circuit designs.

Maximum Seated Height: 1.75 mm

Low seated height allows for slimmer profiles in compact electronic devices.

Width: 3.9 mm

Narrow width provides opportunities for denser component layouts.

Maximum Output Low Current: 2 Amp

Ability to output up to 2 A current enhances driving capacity for connected loads.

Receiver No. of Bits: 2

The 2-bit receiver is perfect for smaller applications needing basic communication without complexity.

Differential Output: YES

Differential output improves noise immunity and signal integrity over longer transmission distances.

Length: 9.9 mm

Compact length aids in designs requiring miniaturization without sacrificing functionality.

Minimum Out Swing: 0.247 V

The minimum output swing enhances signal clarity, ensuring reliable communication even in noisy environments.

Temperature Grade: INDUSTRIAL

Industrial-grade reliability ensures performance in challenging conditions, ideal for demanding applications.

Maximum Receive Delay: 4 ns

Short receive delay ensures that your system can handle high-speed data without lag.

Terminal Form: GULL WING

Gull wing terminals provide stable mounting and easier soldering during assembly.

Interface Standard: EIA-644; TIA-644

Compliance with industry standards guarantees compatibility with a wide range of devices.

Maximum Supply Current: 20 mA

Low supply current consumption aids in maintaining energy efficiency and prolonging battery life in portable devices.

Input Characteristics: DIFFERENTIAL

Differential input characteristics ensure better performance in noisy environments and reduce crosstalk.

Nominal Supply Voltage: 3.3 V

Fact that it operates effectively at a nominal 3.3 V expands its versatility across various applications.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch facilitates easier PCB design and routing for tight layouts.

Driver No. of Bits: 2

2-bit driver capability allows for effective communication in simple digital systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate sensitivity to moisture, informing handling and storage practices.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is optimized for efficient bidirectional communication, enhancing overall system performance.

Technical Specifications

Line Drivers & Receivers STLVDS050BDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2.7 ns

Width:

3.9 mm

Trade Compliance

STLVDS050BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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