Loading...

STLV3243EBTR

STMicroelectronics

STLV3243EBTR by STMicroelectronics

STLV3243EBTR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. It features 3 drivers, 5 receivers, and supports EIA-232 standards for reliable data communication. Ideal for industrial applications requiring compact design and efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,911

-

-

-

-

Anansix

USA . 2,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,463

-

-

-

-

Vyrian

USA . 2,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,280

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 823 parts In-Stock

1+ parts

$2.400

100+ parts

-

1k+ parts

$2.160

10k+ parts

-

823

$2.400

-

$2.160

-

MKK Technologies

India . 332 parts In-Stock

1+ parts

$4.514

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$4.514

-

-

-

DigiPath Technology Company

USA . 332 parts In-Stock

1+ parts

$4.514

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$4.514

-

-

-

Corphita

USA . 2,686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,686

-

-

-

-

Parana Technologies

USA . 1,062 parts In-Stock

1+ parts

-

100+ parts

$2.870

1k+ parts

-

10k+ parts

-

1,062

-

$2.870

-

-

Overview

Elevate your design with the STLV3243EBTR from STMicroelectronics, a standout in line drivers and receivers. Crafted for reliability, it operates seamlessly across diverse applications while promising exceptional performance even in extreme conditions. With its compact, thin profile, this device optimizes space without compromising quality. Trust in ST's industry expertise to enhance your projects with robust connectivity and efficiency that drive innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables space-saving designs on PCBs and simplifies the manufacturing process.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage provides flexibility in circuit design and compatibility with power sources.

No. of Functions: 3

Multiple functions increase the versatility of this device, reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape is conducive for efficient layout on circuit boards, optimizing space.

Power Supplies (V): 2.5/5

Supports common supply voltages, allowing for compatibility with a wide range of electronic designs.

No. of Terminals: 28

A sufficient number of terminals facilitates complex connections and enhanced functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact design helps in creating lightweight and portable devices without sacrificing performance.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage allows for operation in low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Withstanding higher temperatures ensures reliable operation in demanding environments and applications.

Minimum Operating Temperature: -40 °C

An extended temperature range makes this line driver/receiver suitable for industrial applications where extreme conditions are present.

Terminal Position: DUAL

Dual terminal positioning improves design flexibility and PCB layout options.

Maximum Seated Height: 1.2 mm

A low seated height enables tight component stacking and contributes to miniaturized product designs.

Width: 4.4 mm

A narrow width aids in compact PCB designs, allowing multiple components to fit in limited spaces.

Maximum Output Low Current: 1.6 Amp

A significant output current capability allows for driving larger loads, enhancing functionality in a variety of applications.

Receiver No. of Bits: 5

With 5 bits capability, it facilitates robust data transmission and increases bandwidth for communication systems.

Length: 9.7 mm

A short length helps reduce the overall footprint of the product, beneficial for compact electronic devices.

Minimum Out Swing: 7.4 V

High minimum output swing ensures effective signal integrity over longer distances, important for EIA-232 interfaces.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability and reliability in harsh conditions.

Maximum Receive Delay: 0 ns

Zero receive delay optimizes performance and responsiveness crucial for high-speed communication.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and are popular for surface mount applications, enhancing manufacturing efficiency.

Interface Standard: EIA-232

Complies with the EIA-232 standard, ensuring compatibility with various communication equipment and systems.

Maximum Supply Current: 1 mA

Low supply current translates to reduced power consumption, important for battery-operated and energy-efficient devices.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input provides improved noise immunity and faster switching, enhancing overall reliability.

Nominal Supply Voltage: 3 V

Operation at a nominal 3V supply is ideal for many modern digital designs, facilitating compatibility with other components.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for denser layouts on PCBs, optimizing space usage in compact devices.

Driver No. of Bits: 3

A 3-bit driver allows for versatile applications requiring various data rates and signaling.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it is specifically designed for long-distance data transmission, ensuring signal integrity across devices.

Technical Specifications

Line Drivers & Receivers STLV3243EBTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

STLV3243EBTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19