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STLV3243CDR

STMicroelectronics

STLV3243CDR by STMicroelectronics

STLV3243CDR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V, supporting EIA-232 standards. It operates in extreme temps from -40 °C to 85 °C and features 3 driver bits and 5 receiver bits for efficient data transmission. Ideal for industrial applications, it ensures reliable communication in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,429

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-

-

-

Digiode

USA . 2,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,145

-

-

-

-

Anansix

USA . 1,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,083

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 487 parts In-Stock

1+ parts

$6.582

100+ parts

-

1k+ parts

$5.924

10k+ parts

-

487

$6.582

-

$5.924

-

MKK Technologies

India . 630 parts In-Stock

1+ parts

$12.376

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$12.376

-

-

-

DigiPath Technology Company

USA . 630 parts In-Stock

1+ parts

$12.376

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$12.376

-

-

-

Corphita

USA . 4,447 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,447

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-

-

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Parana Technologies

USA . 1,667 parts In-Stock

1+ parts

-

100+ parts

$7.869

1k+ parts

-

10k+ parts

-

1,667

-

$7.869

-

-

Overview

Unlock the potential of your designs with the STLV3243CDR from STMicroelectronics—a trusted leader in high-quality semiconductor solutions. This versatile line driver and receiver excels in industrial applications, offering robust performance in challenging environments. With its compact design and low power consumption, it ensures reliable communication while optimizing space and efficiency. Elevate your projects with STMicroelectronics' commitment to innovation and excellence, delivering unmatched value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for efficient PCB design and saves space, making integration into compact devices easier.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of low-voltage applications.

No. of Functions: 3

With three functions, this product offers versatility for various applications, consolidating functions in a single IC.

Package Shape: RECTANGULAR

The rectangular package shape enhances layout flexibility and can fit various circuit designs.

Power Supplies (V): 2.5/5

Dual supply voltage options (2.5V and 5V) allow for broader compatibility with different systems.

No. of Terminals: 28

A higher number of terminals increases connectivity options, enabling complex circuit designs and integration.

Package Style (Meter): SMALL OUTLINE

Small outline package style is suitable for space-constrained applications, promoting more compact designs.

Minimum Supply Voltage: 2.3 V

A low minimum supply voltage enables operation in battery-powered devices and other low-voltage environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial applications that require durability.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C makes it reliable in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish improves solderability and enhances the reliability of the electrical connections.

Terminal Position: DUAL

Dual terminal position facilitates easy mounting and access in circuit designs.

Maximum Seated Height: 2.65 mm

The low seated height is ideal for applications where space is at a premium, ensuring a compact footprint.

Width: 7.5 mm

The width of 7.5 mm allows for easy integration into various PCB layouts.

Maximum Output Low Current: 1.6 Amp

A maximum output low current of 1.6 Amp ensures robust performance in driving loads effectively.

Receiver No. of Bits: 5

A 5-bit receiver enhances data handling capabilities, allowing for more information to be processed simultaneously.

Length: 17.9 mm

A length of 17.9 mm strikes a balance between compactness and functionality.

Minimum Out Swing: 7.4 V

A minimum out swing of 7.4 V ensures adequate signal integrity for effective communication.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the part operates reliably over a wide range of conditions, suitable for harsh environments.

Maximum Receive Delay: 0 ns

Zero maximum receive delay ensures ultra-fast data communication, which is critical in high-speed applications.

Terminal Form: GULL WING

Gull wing terminals enhance the ease of soldering and improve the overall mechanical strength of the connections.

Interface Standard: EIA-232

Compatibility with the EIA-232 interface standard makes this device suitable for a wide range of communication tasks.

Maximum Supply Current: 1 mA

A maximum supply current of only 1 mA contributes to energy efficiency, ideal for battery-powered applications.

Input Characteristics: SCHMITT TRIGGER

Incorporating Schmitt trigger input characteristics ensures clean switching and noise immunity in data signals.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V aligns well with common digital systems, enhancing compatibility.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm facilitates ease of PCB design and assembly.

Driver No. of Bits: 3

With 3 bits for the driver, this device supports various data formats and applications.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver, this IC is specifically designed for efficient long-distance communication over serial links.

Technical Specifications

Line Drivers & Receivers STLV3243CDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

STLV3243CDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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