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STLV3243EBDR

STMicroelectronics

STLV3243EBDR by STMicroelectronics

STLV3243EBDR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V, supporting EIA-232 standards. It operates in industrial conditions (-40 °C to 85 °C) and features 3 drivers/receivers for efficient data communication. Ideal for compact electronic designs, it comes in a small outline package with nickel palladium gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,159

-

-

-

-

Vyrian

USA . 3,519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,519

-

-

-

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Anansix

USA . 541 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

541

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,254 parts In-Stock

1+ parts

$10.061

100+ parts

-

1k+ parts

$9.055

10k+ parts

-

2,254

$10.061

-

$9.055

-

MKK Technologies

India . 2,097 parts In-Stock

1+ parts

$18.919

100+ parts

-

1k+ parts

-

10k+ parts

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2,097

$18.919

-

-

-

DigiPath Technology Company

USA . 2,097 parts In-Stock

1+ parts

$18.919

100+ parts

-

1k+ parts

-

10k+ parts

-

2,097

$18.919

-

-

-

Parana Technologies

USA . 2,261 parts In-Stock

1+ parts

-

100+ parts

$12.030

1k+ parts

-

10k+ parts

-

2,261

-

$12.030

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-

Corphita

USA . 2,245 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,245

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Overview

Experience unparalleled performance with the STLV3243EBDR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile line driver and receiver ensures reliable communication across diverse applications, from industrial automation to consumer electronics. With its robust design and wide operating temperature range, you can trust in its durability and efficiency. Elevate your projects with this high-quality component that delivers exceptional value and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and resistance to environmental factors, making this line driver and receiver suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuit designs, enhancing space efficiency.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for different system designs and compatibility with various power supply levels.

No. of Functions: 3

With three functional capabilities, this component optimally supports versatile applications, reducing the need for multiple devices.

Package Shape: RECTANGULAR

The rectangular shape aids in proper placement on PCBs, facilitating efficient space management and thermal dissipation.

Power Supplies (V): 2.5/5

Supports a range of supply voltages, enhancing versatility in diverse electronic applications.

No. of Terminals: 28

A higher terminal count allows for more complex functionalities and connections, providing enhanced performance options.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications where space is at a premium, facilitating compact design layouts.

Minimum Supply Voltage: 2.3 V

The ability to operate at a minimum of 2.3 V makes this product suitable for low-power applications, contributing to overall energy efficiency.

Maximum Operating Temperature: 85 °C

Designed to function in high temperatures, making it ideal for industrial applications where heat resistance is crucial.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely low temperatures ensures reliability in harsh environments and extreme weather conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances durability and conductivity, improving the overall performance of the connections.

Terminal Position: DUAL

This dual terminal design offers greater flexibility in board layouts, catering to various routing needs.

Maximum Seated Height: 2.65 mm

A low profile allows for dense board designs while ensuring adequate clearance for other components.

Width: 7.5 mm

A compact width that suits smaller layouts while accommodating multiple functions.

Maximum Output Low Current: 1.6 Amp

Capable of delivering a substantial output current, making it effective for driving loads in diverse applications.

Receiver No. of Bits: 5

A 5-bit receiver capability allows for robust data transmission, enhancing the performance of communication systems.

Length: 17.9 mm

The compact length aids in fitting within tighter spaces on PCBs, promoting efficient designs.

Minimum Out Swing: 7.4 V

A minimum output swing of 7.4 V ensures effective signal integrity in communication setups, maintaining quality over distance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in demanding environments, making it suitable for industrial applications.

Maximum Receive Delay: 0 ns

Zero receive delay facilitates real-time data communication, enhancing the efficiency of high-speed applications.

Terminal Form: GULL WING

The gull wing terminal design ensures reliable soldering and stability on the PCB, reducing the risk of connection failure.

Interface Standard: EIA-232

Compliance with the EIA-232 interface standard ensures compatibility with a wide range of devices and systems.

Maximum Supply Current: 1 mA

Low supply current consumption enhances energy efficiency, making the device suitable for battery-powered applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide improved noise immunity and signal integrity, ensuring reliable operation.

Nominal Supply Voltage: 3 V

Optimized for a nominal supply voltage of 3 V, increasing compatibility with modern low-voltage systems.

Terminal Pitch: 1.27 mm

A standard terminal pitch aids in seamless integration with existing PCB designs and simplifies assembly processes.

Driver No. of Bits: 3

With a 3-bit driver capability, this device can effectively manage smaller data packet transmissions.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it effectively converts signals for data communication, thereby enhancing overall system performance.

Technical Specifications

Line Drivers & Receivers STLV3243EBDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

STLV3243EBDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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