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STLVDS051BDR

STMicroelectronics

STLVDS051BDR by STMicroelectronics

STLVDS051BDR from STMicroelectronics is a dual line transceiver with a max supply voltage of 3.6V and operates within -40 °C to 85°C. It features a fast transmit delay of 2.7ns and supports EIA-644/TIA-644 standards, ideal for high-speed data communication in industrial applications. Its compact SO package ensures efficient space utilization on PCBs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,111 parts In-Stock

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4,111

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Digiode

USA . 3,238 parts In-Stock

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3,238

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Anansix

USA . 1,127 parts In-Stock

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1,127

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,368 parts In-Stock

1+ parts

$2.137

100+ parts

-

1k+ parts

$1.923

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2,368

$2.137

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$1.923

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MKK Technologies

India . 1,834 parts In-Stock

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$4.019

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1,834

$4.019

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DigiPath Technology Company

USA . 1,834 parts In-Stock

1+ parts

$4.019

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1,834

$4.019

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Corphita

USA . 2,729 parts In-Stock

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2,729

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Parana Technologies

USA . 1,630 parts In-Stock

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$2.555

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1,630

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$2.555

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Overview

Elevate your designs with the STLVDS051BDR from STMicroelectronics—a top-tier line driver and receiver that ensures unmatched performance and reliability. With superior temperature resilience and a compact, surface-mount package, this device excels in industrial applications where speed and efficiency are paramount. Trust in STMicroelectronics' legacy of innovation and quality to enhance your systems, delivering seamless connectivity and robust functionality for every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and protection against environmental factors.

Surface Mount: YES

Surface Mount Technology (SMT) allows for a compact design and efficient use of board space, ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility for integration into various low-voltage applications.

No. of Functions: 2

Dual-functionality enhances versatility, allowing the product to be used in a range of applications without needing multiple components.

Package Shape: RECTANGULAR

Rectangular packaging provides efficient use of PCB layout and optimizes space for other components.

Maximum Transmit Delay: 2.7 ns

Low transmit delay ensures high-speed data transmission, making the device suitable for fast communication systems.

Power Supplies (V): 3.3

Operating at a nominal voltage of 3.3 V is compatible with most digital logic families, increasing design compatibility.

No. of Terminals: 16

With 16 terminals, the device offers ample connectivity options for various external components.

Package Style (Meter): SMALL OUTLINE

Small outline packages minimize space on the PCB and are conducive to high-density assembly.

Maximum High Level Input Current: 0.00002 Amp

Low input current ensures minimal power consumption, which is critical for battery-operated devices.

Minimum Supply Voltage: 3 V

This minimum supply voltage allows for operation in battery-powered applications with limited voltage availability.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes it suitable for industrial applications where heat is a factor.

Minimum Operating Temperature: -40 °C

Ability to function at -40 °C ensures reliability in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical contact.

Terminal Position: DUAL

Dual terminal positions improve flexibility in PCB design and placement.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact integration into designed circuits, crucial for modern miniaturized devices.

Width: 3.9 mm

Narrow width makes it suitable for applications where space is limited without compromising performance.

Maximum Output Low Current: 2 Amp

Capable of outputting 2 Amp ensures it can drive various loads and devices efficiently.

Receiver No. of Bits: 2

A 2-bit receiver allows handling of multi-bit signals, making it versatile for multiple applications.

Differential Output: YES

Differential output helps improve signal integrity and reduces noise susceptibility, enhancing overall performance.

Length: 9.9 mm

Short length aids in fitting within compact designs, allowing for more versatile applications.

Minimum Out Swing: 0.247 V

A minimum output swing of 0.247 V ensures that the device can drive connected components effectively.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in rugged environments.

Maximum Receive Delay: 4 ns

A receive delay of only 4 ns guarantees minimal latency, benefitting high-speed communication systems.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance connectivity reliability in assemblies.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 standards means compatibility with various telecommunications and networking systems.

Maximum Supply Current: 20 mA

A low maximum supply current of 20 mA minimizes power consumption, suitable for energy-efficient designs.

Input Characteristics: DIFFERENTIAL

Differential input characteristics provide better noise immunity and signal integrity, crucial for reliable communications.

Nominal Supply Voltage: 3.3 V

3.3 V nominal supply is common across many devices, simplifying design and reducing the number of different voltage levels needed.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch is standard, facilitating easier placement and soldering onto PCBs.

Driver No. of Bits: 2

A 2-bit driver allows the device to handle multiple signals, enhancing its usefulness in communications applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that it requires proper handling and soldering precautions, ensuring reliability in assembly.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this device is optimized for reliable transmission and reception of data over communication lines.

Technical Specifications

Line Drivers & Receivers STLVDS051BDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2.7 ns

Width:

3.9 mm

Trade Compliance

STLVDS051BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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