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STLV3243EBPR

STMicroelectronics

STLV3243EBPR by STMicroelectronics

STLV3243EBPR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V and operates in industrial temp ranges (-40 °C to 85 °C). It features 3 drivers, 5 receivers, and supports EIA-232 standards for reliable communication. Ideal for compact applications due to its small outline package (28 terminals).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,196 parts In-Stock

1+ parts

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100+ parts

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2,196

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Digiode

USA . 1,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,178

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Anansix

USA . 480 parts In-Stock

1+ parts

-

100+ parts

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480

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,492 parts In-Stock

1+ parts

$4.325

100+ parts

-

1k+ parts

$3.892

10k+ parts

-

1,492

$4.325

-

$3.892

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MKK Technologies

India . 1,552 parts In-Stock

1+ parts

$8.133

100+ parts

-

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10k+ parts

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1,552

$8.133

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DigiPath Technology Company

USA . 1,552 parts In-Stock

1+ parts

$8.133

100+ parts

-

1k+ parts

-

10k+ parts

-

1,552

$8.133

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-

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Corphita

USA . 4,204 parts In-Stock

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4,204

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Parana Technologies

USA . 1,542 parts In-Stock

1+ parts

-

100+ parts

$5.171

1k+ parts

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10k+ parts

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1,542

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$5.171

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Overview

Unlock seamless communication with the STLV3243EBPR from STMicroelectronics, a trusted leader in high-performance solutions. Designed for robust line driving and receiving, this reliable device enhances signal integrity across various applications, from industrial automation to telecommunications. With its compact design and superior temperature resilience, it ensures your projects run smoothly under demanding conditions. Experience unmatched quality and performance that propels your innovation forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resistance against environmental factors, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and optimal use of PCB space, enhancing design flexibility and ease of manufacturing.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V accommodates a wide range of applications, while assuring compatibility with other electronic components.

No. of Functions: 3

With three functions, it offers versatility in application, enabling complex systems to be managed efficiently with a single component.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into various PCB layouts, optimizing space usage and component placement.

Power Supplies (V): 2.5/5

Support for dual power supply options makes the product adaptable to different circuit requirements, broadening its usability.

No. of Terminals: 28

A larger number of terminals allows for greater connectivity and functionality, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with shrink pitch design minimizes footprint on PCBs, making it ideal for space-constrained applications.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage means lower power consumption and compatibility with battery-powered designs.

Maximum Operating Temperature: 85 °C

An extended operating temperature range ensures reliable performance in harsh industrial conditions.

Minimum Operating Temperature: -40 °C

Operating at extremely low temperatures allows for use in demanding environments, such as outdoor or refrigerated applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and ensures reliable connections, especially in high-frequency applications.

Terminal Position: DUAL

Dual terminal positioning enables versatile mounting options, facilitating integration into different designs.

Maximum Seated Height: 2 mm

The low profile design allows for a sleek integration into compact layouts, making it ideal for modern electronic devices.

Width: 5.3 mm

A narrow width fits easily into tight spaces in modern circuit boards, ideal for miniaturized electronics.

Maximum Output Low Current: 1.6 Amp

This capability allows for powerful output performance for driving loads, making it effective in a variety of applications.

Receiver No. of Bits: 5

With five receiver bits, it can handle complex data signals effectively, catering to intricate communication protocols.

Length: 10.2 mm

The compact length is suitable for integration into space-constrained applications without sacrificing performance.

Minimum Out Swing: 7.4 V

High minimum out swing ensures robust signal integrity over long distances, ideal for communication lines.

Temperature Grade: INDUSTRIAL

Industrial temperature grading means the product can operate in harsh conditions, making it reliable for industrial use.

Maximum Receive Delay: 0 ns

Zero receive delay guarantees immediate signal transmission and reception, critical for real-time communication systems.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical strength, offering reliable connections.

Interface Standard: EIA-232

Compliance with the EIA-232 standard ensures easy integration into existing communication systems and compatibility with various devices.

Maximum Supply Current: 1 mA

Low supply current consumption enhances energy efficiency, extending battery life in portable applications.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics improve noise immunity and signal integrity, making it reliable in noisy environments.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V supports a wide range of components, enhancing compatibility in diverse applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch optimizes the compactness and feasibility of PCB design, facilitating tighter layouts.

Driver No. of Bits: 3

This supports efficient data handling and transmission, which is crucial in applications with limited bandwidth.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it is specifically designed for robust signal communication over long distances, ensuring effectiveness in data transmission.

Technical Specifications

Line Drivers & Receivers STLV3243EBPR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

STLV3243EBPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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