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STLVDS050BD

STMicroelectronics

STLVDS050BD by STMicroelectronics

STLVDS050BD by STMicroelectronics is a dual line transceiver with a max supply voltage of 3.6V and operates b/w -40 °C to 85 °C. It features a fast transmit delay of 2.7ns and supports EIA-644/TIA-644 standards, ideal for high-speed data communication in industrial applications. Its compact SO package ensures efficient space utilization on PCBs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,671 parts In-Stock

1+ parts

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2,671

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Digiode

USA . 1,551 parts In-Stock

1+ parts

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1,551

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Anansix

USA . 450 parts In-Stock

1+ parts

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,346 parts In-Stock

1+ parts

$11.548

100+ parts

-

1k+ parts

$10.393

10k+ parts

-

2,346

$11.548

-

$10.393

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MKK Technologies

India . 1,859 parts In-Stock

1+ parts

$21.715

100+ parts

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1,859

$21.715

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DigiPath Technology Company

USA . 1,859 parts In-Stock

1+ parts

$21.715

100+ parts

-

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10k+ parts

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1,859

$21.715

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Corphita

USA . 2,023 parts In-Stock

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2,023

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Parana Technologies

USA . 1,180 parts In-Stock

1+ parts

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100+ parts

$13.807

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1,180

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$13.807

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Overview

Unlock unparalleled performance with the STLVDS050BD from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This compact line driver and receiver excels in high-speed data communication, ensuring rapid signal transmission with minimal delay. Designed for industrial applications, it operates reliably in challenging environments. Experience superior quality backed by STMicroelectronics' expertise, delivering value through efficiency and robust functionality for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances the product's longevity and robustness, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating integration into dense circuit boards.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V makes this line driver and receiver compatible with common low-voltage systems.

No. of Functions: 2

Offering two functions in a single package increases versatility and reduces component count in designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout and placement on PCB, optimizing space usage.

Maximum Transmit Delay: 2.7 ns

A low transmit delay enhances performance in high-speed applications, ensuring data is transmitted quickly and efficiently.

Power Supplies (V): 3.3

The nominal supply voltage of 3.3 V aligns with standard supply voltages, ensuring easy integration into existing systems.

No. of Terminals: 16

The 16 terminals provide ample connection points for a variety of functionalities, promoting flexibility in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces board space requirements, which is crucial for compact electronics.

Maximum High Level Input Current: 0.00002 Amp

Low input current minimizes power consumption, promoting energy efficiency in battery-powered applications.

Minimum Supply Voltage: 3 V

Operating down to 3 V ensures compatibility with a broad range of power supplies, increasing design options.

Maximum Operating Temperature: 85 °C

Withstands higher temperatures, making it suitable for industrial applications where heat can be a concern.

Minimum Operating Temperature: -40 °C

The product's ability to function in extreme low temperatures makes it ideal for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances connectivity and prevents oxidation, ensuring reliability over time.

Terminal Position: DUAL

Dual terminal positioning provides flexible layout options, enabling efficient use of board space.

Maximum Seated Height: 1.75 mm

A low seated height is beneficial for low-profile applications, promoting sleek designs.

Width: 3.9 mm

A compact width supports design flexibility, particularly in space-constrained layouts.

Maximum Output Low Current: 2 Amp

The capability to handle up to 2 Amps output current makes this product suitable for driving larger loads.

Receiver No. of Bits: 2

Supports two-bit data reception, which is ideal for applications requiring simple data transfer.

Differential Output: YES

Differential output reduces noise susceptibility, ensuring reliable signal transmission over longer distances.

Length: 9.9 mm

Compact length makes it easy to integrate within space-constrained applications without sacrificing performance.

Minimum Out Swing: 0.247 V

Low minimum output swing enhances the drive strength of the output, which is beneficial in signaling applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability and robustness in challenging environments.

Maximum Receive Delay: 4 ns

Rapid receive delay helps maintain high throughput in data communications, making it suitable for faster networks.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection during assembly, helping to reduce production defects.

Interface Standard: EIA-644; TIA-644

Compliance with established interface standards facilitates integration with a wide range of devices and systems.

Maximum Supply Current: 20 mA

Low maximum supply current ensures efficient power consumption, making it suitable for battery-operated devices.

Input Characteristics: DIFFERENTIAL

Differential input characteristics provide immunity to common-mode noise, enhancing signal integrity.

Nominal Supply Voltage: 3.3 V

The nominal voltage is a common industry standard, ensuring compatibility and ease of use in most applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates easier PCB design and manufacturing processes.

Driver No. of Bits: 2

Supports two-bit data transmission, making it suitable for applications requiring simple data interfacing.

Moisture Sensitivity Level (MSL): 3

MEoisture sensitivity level of 3 indicates that proper handling and storage are required, ensuring reliability during usage.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it facilitates reliable data transfer over long distances, making it ideal for communication systems.

Technical Specifications

Line Drivers & Receivers STLVDS050BD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2.7 ns

Width:

3.9 mm

Trade Compliance

STLVDS050BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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