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STLV3243ECPR

STMicroelectronics

STLV3243ECPR by STMicroelectronics

STLV3243ECPR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V, supporting EIA-232 standards. It operates in industrial temperatures from -40 °C to 85 °C and features 3 drivers/receivers for efficient data communication. Ideal for compact applications, it comes in a small outline package with nickel palladium gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,386 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,386

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Anansix

USA . 1,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,035

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-

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Digiode

USA . 351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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351

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 314 parts In-Stock

1+ parts

$10.805

100+ parts

-

1k+ parts

$9.725

10k+ parts

-

314

$10.805

-

$9.725

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MKK Technologies

India . 218 parts In-Stock

1+ parts

$20.319

100+ parts

-

1k+ parts

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10k+ parts

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218

$20.319

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DigiPath Technology Company

USA . 218 parts In-Stock

1+ parts

$20.319

100+ parts

-

1k+ parts

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10k+ parts

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218

$20.319

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-

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Corphita

USA . 3,840 parts In-Stock

1+ parts

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3,840

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Parana Technologies

USA . 2,081 parts In-Stock

1+ parts

-

100+ parts

$12.920

1k+ parts

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10k+ parts

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2,081

-

$12.920

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Overview

Elevate your designs with the STLV3243ECPR from STMicroelectronics, a premium line driver and receiver that guarantees exceptional performance in diverse applications. Renowned for their reliability and innovation, STMicroelectronics delivers unmatched quality, ensuring your projects thrive under varying conditions. Experience enhanced data integrity, low power consumption, and robust temperature resilience, making it the perfect choice for industrial automation, telecommunications, and more. Unlock the potential of your systems today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and space-saving solutions on printed circuit boards.

Maximum Supply Voltage: 5.5 V

This higher maximum supply voltage offers flexibility in design, accommodating a range of power supply environments.

No. of Functions: 3

Having multiple functions integrated in one device reduces component count and simplifies circuit design.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient board layout and allows for easy placement and soldering.

Power Supplies (V): 2.5/5

Support for both 2.5V and 5V power supplies enhances versatility, making it compatible with a wide range of systems.

No. of Terminals: 28

With 28 terminals, this product offers ample connectivity options to integrate with various circuitry.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline package saves space while the shrink pitch allows for higher density arrangements on PCBs.

Minimum Supply Voltage: 2.3 V

This low minimum supply voltage is beneficial for battery-operated devices, extending their life and usability.

Maximum Operating Temperature: 85 °C

An operational range up to 85 °C makes this product suitable for industrial applications where heat can be a concern.

Minimum Operating Temperature: -40 °C

Operating in extreme cold environments (-40 °C) ensures reliability in harsh conditions, ideal for outdoor and industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality finish enhances durability and ensures reliable connections over time, reducing maintenance needs.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit design and easy integration into various applications.

Maximum Seated Height: 2 mm

A maximum seated height of just 2 mm contributes to low-profile designs, preventing space constraints in tight assemblies.

Width: 5.3 mm

This compact width helps in achieving a small footprint in applications, permitting more efficient layout configurations.

Maximum Output Low Current: 1.6 Amp

A high maximum output current capability (1.6A) supports robust signal driving, making it suitable for demanding applications.

Receiver No. of Bits: 5

A 5-bit receiver allows for efficient data handling and processing, meeting the demands of modern communication systems.

Length: 10.2 mm

The compact length supports space-efficient designs which is essential for modern electronics with limited space.

Minimum Out Swing: 7.4 V

A high minimum out swing voltage allows for robust signal transmission over longer distances, ensuring integrity in communication.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product remains reliable in extreme conditions, suitable for various applications.

Maximum Receive Delay: 0 ns

Zero maximum receive delay ensures instantaneous signal processing, critical for high-speed communication applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mechanical stability during assembly, enhancing manufacturing efficiency.

Interface Standard: EIA-232

Compliance with the EIA-232 standard ensures compatibility with a wide range of existing interfaces and devices.

Maximum Supply Current: 1 mA

A low maximum supply current of just 1 mA indicates efficient power consumption, ideal for power-sensitive applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input provides noise immunity and better signal integrity, enhancing performance in noisy environments.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V aligns well with many low-voltage digital systems, making it very compatible.

Terminal Pitch: 0.65 mm

A fine terminal pitch of 0.65 mm allows for compact PCB design, accommodating intricate circuit configurations.

Driver No. of Bits: 3

The inclusion of a 3-bit driver optimizes data transmission, making it efficient for various communication needs.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed for effective signal conversion, crucial for reliable communication.

Technical Specifications

Line Drivers & Receivers STLV3243ECPR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

STLV3243ECPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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