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STLV3243EBJR

STMicroelectronics

STLV3243EBJR by STMicroelectronics

STLV3243EBJR from STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. It features 3 driver bits, 5 receiver bits, and supports EIA-232 standards. Ideal for industrial applications requiring reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Prism Electronics

USA . 21,853 parts In-Stock

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21,853

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R&J Components

USA . 12,500 parts In-Stock

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12,500

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5,246 parts In-Stock

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5,246

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Digiode

USA . 4,815 parts In-Stock

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4,815

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Vyrian

USA . 4,495 parts In-Stock

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4,495

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Sea View Technologies

USA . 616 parts In-Stock

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616

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Bristol Electronics

USA . 616 parts In-Stock

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616

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Ashlea Components Ltd

UK . 180 parts In-Stock

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180

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Anansix

USA . 109 parts In-Stock

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109

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Distributors (Availability)

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Microchip USA

USA . 362 parts In-Stock

1+ parts

$2.083

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-

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362

$2.083

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AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$8.170

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-

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763

$8.170

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IDEA Electronic Components Group

UK . 2,101 parts In-Stock

1+ parts

$9.066

100+ parts

-

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$8.159

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2,101

$9.066

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$8.159

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MKK Technologies

India . 2,056 parts In-Stock

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$17.047

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2,056

$17.047

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DigiPath Technology Company

USA . 2,056 parts In-Stock

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$17.047

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2,056

$17.047

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Component Stockers USA

USA . 238 parts In-Stock

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$99.990

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238

$99.990

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Perfect Parts

USA . 24,475 parts In-Stock

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Kepictronics

USA . 18,830 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,283 parts In-Stock

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Corphita

USA . 1,674 parts In-Stock

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1,674

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Vigor

Singapore . 1,317 parts In-Stock

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1,317

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Parana Technologies

USA . 604 parts In-Stock

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$10.839

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604

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$10.839

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Futuretech Components

Singapore . 270 parts In-Stock

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270

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Overview

Elevate your designs with the STLV3243EBJR from STMicroelectronics, a leading name in innovation and quality. This versatile line driver and receiver ensures reliable communication across diverse applications, from industrial automation to telecommunications. With its compact, thin-profile packaging and robust performance in extreme temperatures, it delivers unmatched efficiency and durability, making it the perfect choice for engineers seeking to enhance their projects effortlessly. Experience superior value and peace of mind with every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it reliable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling easier integration into modern PCBs.

Maximum Supply Voltage: 5.5 V

Compatibility with a wide voltage range provides flexibility for various application requirements.

No. of Functions: 3

Having three functions enhances versatility, making it suitable for multiple line driving and receiving tasks.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards.

Power Supplies (V): 2.5/5

The product's ability to operate at multiple voltage levels makes it adaptable to different system designs.

No. of Terminals: 28

A high terminal count facilitates integration with complex circuits, providing more connectivity options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This packaging style offers a compact footprint, necessary for space-constrained electronic designs.

Minimum Supply Voltage: 2.3 V

A lower minimum supply voltage enables the device to function in low-power applications, saving energy.

Maximum Operating Temperature: 85 °C

With a high operating temperature rating, the device can withstand harsher environments and extended use.

Minimum Operating Temperature: -40 °C

The ability to function at very low temperatures makes it suitable for extreme weather conditions.

Terminal Finish: TIN LEAD

Tin-lead terminal finish offers good solderability, ensuring reliable connections during assembly.

Terminal Position: BOTTOM

Bottom terminal positioning aids in effective thermal dissipation and enhances electronic performance.

Maximum Seated Height: 0.95 mm

The low seated height supports high-density PCB layouts, maximizing space efficiency.

Width: 2.57 mm

A narrow width allows for tighter integration in compact designs, without sacrificing performance.

Maximum Output Low Current: 1.6 Amp

The ability to handle high output low current is ideal for driving loads in a variety of applications.

Receiver No. of Bits: 5

With 5 bits for receiving, the product maintains high data integrity and accuracy in data transmission.

Length: 4.07 mm

A short length ensures minimal impact on circuit layouts, essential for modern electronic design.

Minimum Out Swing: 7.4 V

A high minimum output swing guarantees effective signal transmission over longer distances.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in demanding applications, suitable for factory automation.

Maximum Receive Delay: 0 ns

Zero receive delay enhances real-time communication capabilities, critical for time-sensitive applications.

Terminal Form: BALL

Ball terminal form provides improved electrical connectivity and mechanical strength.

Interface Standard: EIA-232; EIA-562; TIA-562

Compliance with established standards facilitates compatibility with a wide range of devices and systems.

Maximum Supply Current: 1 mA

Low supply current ensures minimal power consumption, making it ideal for battery-powered devices.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide clean signal transitions, improving noise immunity.

Nominal Supply Voltage: 3 V

A nominal supply of 3V strikes an excellent balance between performance and energy efficiency.

Terminal Pitch: 0.5 mm

A fine terminal pitch enhances the ability to design compact boards while maintaining reliability.

Driver No. of Bits: 3

Offering 3 bits for driving ensures robust performance for multiple line-driving requirements.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it is specifically designed for reliable data transmission over distance.

Technical Specifications

Line Drivers & Receivers STLV3243EBJR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; EIA-562; TIA-562

JESD-30 Code:

R-PBGA-B28

JESD-609 Code:

e0

Length:

4.07 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA28,5X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

.95 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.57 mm

Trade Compliance

STLV3243EBJR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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