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STLVDS050BTR

STMicroelectronics

STLVDS050BTR by STMicroelectronics

STLVDS050BTR from STMicroelectronics is a dual line transceiver with a max supply voltage of 3.6V and operates b/w -40 °C to 85 °C. It features a fast transmit delay of 2.7ns and supports EIA-644/TIA-644 standards, ideal for high-speed data communication in industrial applications. Its compact SOIC package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,803 parts In-Stock

1+ parts

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2,803

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Digiode

USA . 2,001 parts In-Stock

1+ parts

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2,001

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Vyrian

USA . 348 parts In-Stock

1+ parts

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348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,609 parts In-Stock

1+ parts

$12.633

100+ parts

-

1k+ parts

$11.369

10k+ parts

-

1,609

$12.633

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$11.369

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MKK Technologies

India . 502 parts In-Stock

1+ parts

$23.755

100+ parts

-

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502

$23.755

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DigiPath Technology Company

USA . 502 parts In-Stock

1+ parts

$23.755

100+ parts

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502

$23.755

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Corphita

USA . 3,593 parts In-Stock

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3,593

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Parana Technologies

USA . 2,249 parts In-Stock

1+ parts

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$15.104

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2,249

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$15.104

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Overview

Elevate your designs with the STLVDS050BTR from STMicroelectronics—a top-tier line driver and receiver that combines exceptional performance with reliability. Engineered for optimal efficiency, this compact device thrives in industrial applications, ensuring seamless communication even in challenging environments. Trust in STMicroelectronics' legacy of innovation to deliver quality components that enhance your projects while reducing costs and boosting performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and longevity, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, saving space.

Maximum Supply Voltage: 3.6 V

This high maximum supply voltage provides flexibility for a wide range of applications while ensuring compatibility with standard systems.

No. of Functions: 2

Having two functions in one package increases efficiency and reduces the need for multiple components, streamlining the design.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier layout and placement on printed circuit boards.

Maximum Transmit Delay: 2.7 ns

A low transmit delay enhances signal integrity and improves overall system performance, particularly in high-speed applications.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3 V makes this product compatible with numerous modern electronic systems.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various functionalities, enhancing versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enable designers to optimize space, essential for compact electronic devices.

Maximum High Level Input Current: 0.00002 Amp

This very low input current requirement maximizes power efficiency, beneficial for battery-operated devices.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V makes this product versatile and adaptable to a variety of operational scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this component can function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the product suitable for industrial applications exposed to extreme conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and enhances connection reliability in various environments.

Terminal Position: DUAL

Dual terminal positioning allows for easier integration into designs, enhancing layout flexibility.

Maximum Seated Height: 1.2 mm

A low seated height is advantageous for low-profile applications, allowing for more compact designs.

Width: 4.4 mm

The narrow width provides additional opportunities for space-saving designs in electronic products.

Maximum Output Low Current: 2 Amp

A high output current capability of 2 Amps supports robust performance and is ideal for driving loads.

Receiver No. of Bits: 2

Supports 2 bits for data transfer, making it suitable for various applications that don't require extensive data widths.

Differential Output: YES

Differential output reduces electromagnetic interference (EMI) and enhances signal integrity over longer distances.

Length: 5 mm

A compact length further facilitates space-efficient designs in a variety of electronic devices.

Minimum Out Swing: 0.247 V

A sufficient minimum output swing ensures reliable communication and compatibility across signal levels.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this component guarantees reliability in harsh environments.

Maximum Receive Delay: 4 ns

Minimal receive delay enhances the responsiveness of the product, ideal for time-critical applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and enhance the reliability of PCB assembly.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 standards ensures interoperability with a wide range of communication systems.

Maximum Supply Current: 20 mA

This low supply current maximizes energy efficiency, which is crucial for mobile and battery-operated devices.

Input Characteristics: DIFFERENTIAL

Differential input characteristics provide better noise immunity and improve overall signal integrity.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V makes it compatible with most modern electronic devices.

Terminal Pitch: 0.65 mm

A narrow terminal pitch allows for a higher density of connections, enabling more compact circuit designs.

Driver No. of Bits: 2

This capability supports two-bit data transfer, suitable for applications requiring basic communication.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is tailored for robust signal transmission over distances, essential for communication applications.

Technical Specifications

Line Drivers & Receivers STLVDS050BTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2.7 ns

Width:

4.4 mm

Trade Compliance

STLVDS050BTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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