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STLVDS051BTR

STMicroelectronics

STLVDS051BTR by STMicroelectronics

STLVDS051BTR from STMicroelectronics is a dual line transceiver with a max supply voltage of 3.6V and operates within -40 °C to 85°C. It features a fast transmit delay of 2.7ns and supports EIA-644/TIA-644 standards, ideal for high-speed data communication in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,110 parts In-Stock

1+ parts

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4,110

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Anansix

USA . 2,353 parts In-Stock

1+ parts

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2,353

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Vyrian

USA . 141 parts In-Stock

1+ parts

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141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,214 parts In-Stock

1+ parts

$6.828

100+ parts

-

1k+ parts

$6.145

10k+ parts

-

1,214

$6.828

-

$6.145

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MKK Technologies

India . 212 parts In-Stock

1+ parts

$12.840

100+ parts

-

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212

$12.840

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DigiPath Technology Company

USA . 212 parts In-Stock

1+ parts

$12.840

100+ parts

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212

$12.840

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Corphita

USA . 3,338 parts In-Stock

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3,338

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Parana Technologies

USA . 2,075 parts In-Stock

1+ parts

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100+ parts

$8.164

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2,075

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$8.164

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Overview

Elevate your designs with the STLVDS051BTR from STMicroelectronics, a trusted name in high-performance semiconductor solutions. This robust line driver and receiver ensures exceptional signal integrity with minimal delay, making it ideal for fast-paced industrial applications. Enjoy effortless integration and reliable operation across various environments, all while benefiting from STMicroelectronics' commitment to quality and innovation. Choose STLVDS051BTR for unparalleled performance and peace of mind in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight design, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount design allows for easy integration into modern circuit boards, enhancing manufacturing efficiency.

Maximum Supply Voltage: 3.6 V

A relatively low maximum supply voltage enables compatibility with various low-power systems, reducing energy consumption.

No. of Functions: 2

Offering two functions increases versatility for diverse applications, providing greater value and flexibility in design.

Package Shape: RECTANGULAR

The rectangular shape allows efficient space utilization on PCB layout.

Maximum Transmit Delay: 2.7 ns

Fast transmit delay ensures high-speed data communication, making it ideal for high-performance applications.

Power Supplies (V): 3.3

Utilizes a nominal supply voltage of 3.3 V, aligning with common logic levels in many digital circuits.

No. of Terminals: 16

With 16 terminals, it provides ample connectivity options for both input and output signals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and compact package make it suitable for dense circuit board designs.

Maximum High Level Input Current: 0.00002 Amp

Low input current minimizes the load on the preceding circuit, enhancing overall system efficiency.

Minimum Supply Voltage: 3 V

This low minimum supply voltage broadens the compatibility with various power sources, ensuring flexibility.

Maximum Operating Temperature: 85 °C

Designed to operate at higher temperatures, making it suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

The capability to function in extreme low temperatures makes this product reliable for outdoor and rugged applications.

Terminal Position: DUAL

Dual terminal positions enhance design flexibility for placement on circuit boards.

Maximum Seated Height: 1.2 mm

The low seated height aids in minimizing profile height, perfect for space-constrained applications.

Width: 4.4 mm

A compact width provides better fitment in tight spaces, aligning with modern design trends.

Maximum Output Low Current: 2 Amp

A high output current capability allows the driver to support demanding loads, enhancing performance.

Receiver No. of Bits: 2

With two receiver bits, it allows for efficient data processing and management for simpler applications.

Differential Output: YES

Differential output improves signal integrity and reduces noise, ensuring reliable communication.

Length: 5 mm

A short length facilitates more compact PCB layouts, saving space for other components.

Minimum Out Swing: 0.247 V

Allows operations at lower voltage levels, increasing system compatibility with other components.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability under demanding conditions, suitable for various applications.

Maximum Receive Delay: 4 ns

Low receive delay enhances realtime performance, making it suitable for high-speed applications.

Terminal Form: GULL WING

The gull wing terminal form aids in easy soldering and assembly, enhancing overall manufacturing efficiency.

Interface Standard: EIA-644; TIA-644

Adherence to these standards ensures compatibility with widely used communication interfaces, allowing for easy integration.

Maximum Supply Current: 20 mA

Low supply current helps in minimizing energy consumption, making it a cost-effective solution.

Input Characteristics: DIFFERENTIAL

Differential inputs provide better noise immunity, making this component well-suited for communication applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V allows seamless integration into 3.3 V logic systems, enhancing utility.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch accommodates standard PCB designs, simplifying layout and assembly.

Driver No. of Bits: 2

The two bits configuration for the driver provides efficient data transmission capabilities for simplified communication.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it specializes in long-distance communication, making it ideal for network applications.

Technical Specifications

Line Drivers & Receivers STLVDS051BTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Maximum Output Low Current:

2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2.7 ns

Width:

4.4 mm

Trade Compliance

STLVDS051BTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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