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STLV3243ECJR

STMicroelectronics

STLV3243ECJR by STMicroelectronics

STLV3243ECJR by STMicroelectronics is a versatile line transceiver with a max supply voltage of 5.5V and operates in industrial temp ranges (-40 °C to 85 °C). It features 3 driver bits, 5 receiver bits, and supports EIA-232 standards for reliable communication. Ideal for compact applications due to its thin profile (0.95mm height) and surface mount design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,769 parts In-Stock

1+ parts

-

100+ parts

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3,769

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Anansix

USA . 1,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,605

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Digiode

USA . 402 parts In-Stock

1+ parts

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100+ parts

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402

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,046 parts In-Stock

1+ parts

$8.601

100+ parts

-

1k+ parts

$7.741

10k+ parts

-

1,046

$8.601

-

$7.741

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MKK Technologies

India . 1,501 parts In-Stock

1+ parts

$16.174

100+ parts

-

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10k+ parts

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1,501

$16.174

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DigiPath Technology Company

USA . 1,501 parts In-Stock

1+ parts

$16.174

100+ parts

-

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10k+ parts

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1,501

$16.174

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Corphita

USA . 2,264 parts In-Stock

1+ parts

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2,264

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Parana Technologies

USA . 2,233 parts In-Stock

1+ parts

-

100+ parts

$10.284

1k+ parts

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10k+ parts

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2,233

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$10.284

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Overview

Elevate your designs with the STLV3243ECJR from STMicroelectronics, a leader in innovation and reliability! This industrial-grade line transceiver delivers exceptional performance in demanding applications, ensuring seamless communication with minimal power consumption. Its compact, thin profile allows for efficient space utilization, making it perfect for modern electronics. Trust in STMicroelectronics' quality to enhance your projects and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliable performance and ease of integration.

Surface Mount: YES

Allows for compact assembly on PCBs, saving space and facilitating modern circuit designs.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options, catering to various applications.

No. of Functions: 3

Multi-functionality increases design efficiency, reducing the need for multiple components.

Package Shape: RECTANGULAR

Optimizes space usage and fits standard circuit layouts, enhancing design coherence.

Power Supplies (V): 2.5/5

Supports dual voltage levels, accommodating different system requirements and enhancing versatility.

No. of Terminals: 28

Offers sufficient connectivity options for complex circuit designs and functionalities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-density mounting, ideal for space-constrained applications.

Minimum Supply Voltage: 2.3 V

Allows operation with lower voltage levels, improving energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Suitable for applications in demanding environments, ensuring reliability under various temperature conditions.

Minimum Operating Temperature: -40 °C

Enhances performance in extreme conditions, making it suitable for industrial use.

Terminal Position: BOTTOM

Facilitates efficient PCB layout and integration, reducing installation time and improving reliability.

Maximum Seated Height: 0.95 mm

Allows for low-profile designs, essential for compact electronic devices.

Width: 2.57 mm

Compact width supports space-saving designs, ideal for modern electronics.

Maximum Output Low Current: 1.6 Amp

Enables robust output capabilities for driving loads, enhancing overall performance.

Receiver No. of Bits: 5

Allows for extensive data handling capabilities, supporting complex communication applications.

Length: 4.07 mm

Compact length contributes to space efficiency on circuit boards, allowing for more components in a smaller area.

Minimum Out Swing: 7.4 V

Provides a strong output swing, ensuring compatibility with a variety of devices and systems.

Temperature Grade: INDUSTRIAL

Engineered for demanding industrial applications, ensuring reliability and longevity.

Maximum Receive Delay: 0 ns

Enables high-speed data transmission, improving responsiveness in communication systems.

Terminal Form: BALL

Facilitates improved soldering and thermal performance, enhancing overall reliability.

Interface Standard: EIA-232

Ensures compatibility with widely used communication standards, simplifying integration into existing systems.

Maximum Supply Current: 1 mA

Low power consumption promotes energy efficiency, crucial for battery-operated devices.

Input Characteristics: SCHMITT TRIGGER

Provides noise immunity and clean signal transitions, improving overall signal integrity.

Nominal Supply Voltage: 3 V

Optimized for modern low-voltage systems, enhancing compatibility and performance.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density connections, maximizing PCB functionality.

Driver No. of Bits: 3

Supports efficient data transmission, balancing complexity and performance.

Interface IC Type: LINE TRANSCEIVER

Specialized for efficient line communication, ensuring reliable data transfer in various applications.

Technical Specifications

Line Drivers & Receivers STLV3243ECJR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PBGA-B28

Length:

4.07 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

7.4 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA28,5X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

.95 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.57 mm

Trade Compliance

STLV3243ECJR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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