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ISO3082DWG4

Texas Instruments

ISO3082DWG4 by Texas Instruments

ISO3082DWG4 by Texas Instruments is a line driver/receiver with 16 terminals, operating at -40 to 85°C. It features a max supply voltage of 5.5V, differential output, and interface standards EIA-422/485. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$7.910

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 835 parts In-Stock

1+ parts

$7.910

100+ parts

$6.820

1k+ parts

$4.480

10k+ parts

$4.150

835

$7.910

$6.820

$4.480

$4.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$4.770

100+ parts

-

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55

$4.770

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Digiode

USA . 4,225 parts In-Stock

1+ parts

$7.514

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4,225

$7.514

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Chip Stock

USA . 31,940 parts In-Stock

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31,940

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Vyrian

USA . 7,701 parts In-Stock

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LWI Electronics Inc

India . 14 parts In-Stock

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14

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Semi Source

USA . 2 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$3.523

100+ parts

$3.346

1k+ parts

$3.346

10k+ parts

-

270

$3.523

$3.346

$3.346

-

Parana Technologies

USA . 2,358 parts In-Stock

1+ parts

$4.428

100+ parts

-

1k+ parts

$4.852

10k+ parts

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2,358

$4.428

-

$4.852

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Continental Prestige Electronics

USA . 3,900 parts In-Stock

1+ parts

$4.770

100+ parts

-

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$4.675

3,900

$4.770

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-

$4.675

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.770

100+ parts

-

1k+ parts

$4.531

10k+ parts

$4.436

500

$4.770

-

$4.531

$4.436

DigiPath Technology Company

USA . 1,573 parts In-Stock

1+ parts

$4.876

100+ parts

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1,573

$4.876

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Modulus Dynamics

Lithuania . 100 parts In-Stock

1+ parts

$4.951

100+ parts

$4.901

1k+ parts

$4.753

10k+ parts

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100

$4.951

$4.901

$4.753

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ChromeModa Solutions

Germany . 6,378 parts In-Stock

1+ parts

$4.975

100+ parts

$4.080

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6,378

$4.975

$4.080

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IDEA Electronic Components Group

UK . 2,147 parts In-Stock

1+ parts

$4.975

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$4.478

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2,147

$4.975

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$4.478

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Semicontronic

India . 488 parts In-Stock

1+ parts

$6.720

100+ parts

$6.552

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$6.518

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488

$6.720

$6.552

$6.518

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Ampacity Inc.

Singapore . 369 parts In-Stock

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$6.720

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369

$6.720

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Corphita

USA . 308 parts In-Stock

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$7.119

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Corohmni

South Africa . 796 parts In-Stock

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$8.386

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$8.386

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AZTECH Wire

Italy . 609 parts In-Stock

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$16.218

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$16.218

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Argo Parts USA

USA . 4,075 parts In-Stock

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Microchip USA

USA . 2,590 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Experience high-quality data transmission with the Texas Instruments ISO3082DWG4 line driver & receiver. Manufactured with precision and expertise, this product offers reliable performance in a range of applications. With a compact design and durable construction, customers can trust in the value and benefits this product provides. Say goodbye to communication issues and hello to seamless data transfer with the ISO3082DWG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Supports a maximum supply voltage of 5.5V, ensuring compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular package shape provides ease of handling and installation in various applications.

Maximum Transmit Delay: 1.3 ns

Low transmit delay of 1.3ns ensures efficient signal transmission.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40 to 85°C allows for reliable performance in different environments.

Maximum Output Low Current: 8 Amp

High output low current capability of 8Amp ensures robust signal output.

Interface Standard: EIA-422; TIA-422; EIA-485; TIA-485

Support for various interface standards allows for versatile compatibility with different communication protocols.

Terminal Pitch: 1.27 mm

Close terminal pitch of 1.27mm enables compact design and efficient signal routing.

Technical Specifications

Line Drivers & Receivers ISO3082DWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Maximum Receive Delay:

125 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

1.3 ns

Width:

7.5 mm

Trade Compliance

ISO3082DWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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