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ISO3086DWRG4

Texas Instruments

ISO3086DWRG4 by Texas Instruments

ISO3086DWRG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at -40 to 85°C. It features a max supply voltage of 5.5V, differential output, and interface standards EIA-422/485 for industrial applications requiring reliable data transmission in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 27,460 parts In-Stock

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Vyrian

USA . 2,487 parts In-Stock

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Digiode

USA . 455 parts In-Stock

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455

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Nova Conductors

Japan . 150 parts In-Stock

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150

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QIE Inc.

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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Parana Technologies

USA . 1,075 parts In-Stock

1+ parts

$4.163

100+ parts

$386.554

1k+ parts

$3.746

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-

1,075

$4.163

$386.554

$3.746

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DigiPath Technology Company

USA . 816 parts In-Stock

1+ parts

$4.583

100+ parts

$4.217

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816

$4.583

$4.217

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IDEA Electronic Components Group

UK . 1,094 parts In-Stock

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$4.677

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-

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$4.209

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1,094

$4.677

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$4.209

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ChromeModa Solutions

Germany . 744 parts In-Stock

1+ parts

$4.677

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$3.835

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744

$4.677

$3.835

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Ampacity Inc.

Singapore . 834 parts In-Stock

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$7.500

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834

$7.500

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Corohmni

South Africa . 627 parts In-Stock

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$10.299

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627

$10.299

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AZTECH Wire

Italy . 221 parts In-Stock

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$12.026

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$12.026

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$12.593

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$11.963

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$11.963

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40

$12.593

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$11.963

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Semicontronic

India . 1,394 parts In-Stock

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$29.500

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$28.762

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$28.615

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One Stop Electronics

USA . 1,446 parts In-Stock

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$30.500

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Continental Prestige Electronics

USA . 6,428 parts In-Stock

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Corphita

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Argo Parts USA

USA . 2,838 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Modulus Dynamics

Lithuania . 62 parts In-Stock

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Robosynatics

Brazil . 20 parts In-Stock

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Lucentia Tech

USA . 20 parts In-Stock

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$4.728

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$4.728

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$4.728

20

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$4.728

$4.728

$4.728

Overview

Experience top-notch quality and reliability with the Texas Instruments ISO3086DWRG4 Line Drivers & Receivers. Designed for industrial applications, this product offers unmatched performance and precision. Benefit from seamless communication with a maximum transmit delay of 45 ns and differential output capability. Trust in Texas Instruments' reputation for excellence in semiconductor manufacturing. Elevate your projects with the value and advantages that the ISO3086DWRG4 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Ease of installation and integration into circuit boards.

Maximum Supply Voltage: 3.6 V

Suitable for a wide range of applications with varying power requirements.

Package Shape: RECTANGULAR

Compact design for efficient use of space on circuit boards.

Maximum Transmit Delay: 45 ns

Fast data transmission speeds for quick and efficient communication.

Power Supplies (V): 3.3/5,5

Compatible with multiple power supply options for flexibility in usage.

No. of Terminals: 16

Sufficient terminals for connecting to multiple devices or components.

Minimum Supply Voltage: 3.15 V

Ensures reliable operation even at lower voltage levels.

Maximum High Level Input Current: 0.00001 Amp

Low input current requirements for energy efficiency.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-term reliability.

Width: 7.5 mm

Compact size for easy integration into circuits with limited space.

Differential Output: YES

Provides accurate data transmission by eliminating noise and interference.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during assembly processes.

Minimum Out Swing: 1.5 V

Low output swing for compatibility with a wide range of devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Maximum Receive Delay: 125 ns

Fast data reception for efficient communication.

Terminal Form: GULL WING

Provides secure solder joints for reliable connections.

Interface Standard: EIA-422; TIA-422; EIA-485; TIA-485

Compatible with multiple interface standards for versatile use.

Maximum Supply Current: 15 mA

Low power consumption for energy efficiency.

Technical Specifications

Line Drivers & Receivers ISO3086DWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Maximum Receive Delay:

125 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

45 ns

Width:

7.5 mm

Trade Compliance

ISO3086DWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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