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ISO35TDW

Texas Instruments

ISO35TDW by Texas Instruments

ISO35TDW by Texas Instruments is a line driver with 16 terminals, operating at 3.3V. It features a max transmit delay of 340ns and can handle up to 8A output low current. Ideal for EIA-485 and EIA-422 interfaces in industrial applications due to its high-speed differential output capabilities.

Median Price

$9.755

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 228 parts In-Stock

1+ parts

$9.650

100+ parts

$6.750

1k+ parts

$6.327

10k+ parts

-

228

$9.650

$6.750

$6.327

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Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$9.860

100+ parts

$8.500

1k+ parts

$6.420

10k+ parts

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9

$9.860

$8.500

$6.420

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.470

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100

$5.470

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Digiode

USA . 4,456 parts In-Stock

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$9.367

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4,456

$9.367

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 6,274 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,717 parts In-Stock

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ComSIT Distribution GmbH

Germany . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$5.470

100+ parts

$5.196

1k+ parts

$4.937

10k+ parts

$4.868

100

$5.470

$5.196

$4.937

$4.868

Continental Prestige Electronics

USA . 4,932 parts In-Stock

1+ parts

$5.470

100+ parts

-

1k+ parts

-

10k+ parts

$5.361

4,932

$5.470

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-

$5.361

AZTECH Wire

Italy . 201 parts In-Stock

1+ parts

$7.796

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201

$7.796

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$7.896

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251

$7.896

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Ampacity Inc.

Singapore . 155 parts In-Stock

1+ parts

$8.380

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155

$8.380

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Semicontronic

India . 155 parts In-Stock

1+ parts

$8.380

100+ parts

$8.170

1k+ parts

$8.129

10k+ parts

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155

$8.380

$8.170

$8.129

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Corphita

USA . 1,874 parts In-Stock

1+ parts

$8.874

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1,874

$8.874

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Parana Technologies

USA . 2,162 parts In-Stock

1+ parts

$9.549

100+ parts

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$10.147

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2,162

$9.549

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$10.147

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Advanced Electronics

New Zealand . 4,812 parts In-Stock

1+ parts

$9.659

100+ parts

$9.562

1k+ parts

$9.176

10k+ parts

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4,812

$9.659

$9.562

$9.176

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DigiPath Technology Company

USA . 51 parts In-Stock

1+ parts

$10.514

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51

$10.514

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ChromeModa Solutions

Germany . 2,784 parts In-Stock

1+ parts

$10.729

100+ parts

$8.798

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2,784

$10.729

$8.798

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IDEA Electronic Components Group

UK . 600 parts In-Stock

1+ parts

$10.729

100+ parts

$10.193

1k+ parts

$9.656

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600

$10.729

$10.193

$9.656

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Lixinc

USA . 5,894 parts In-Stock

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Argo Parts USA

USA . 116 parts In-Stock

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Robosynatics

Brazil . 20 parts In-Stock

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Lucentia Tech

USA . 20 parts In-Stock

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$1.910

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$1.910

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$1.910

20

-

$1.910

$1.910

$1.910

iodParts Technologies Inc.

India . 3 parts In-Stock

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Overview

Enhance your electronics projects with the Texas Instruments ISO35TDW line driver & receiver. Manufactured by a trusted industry leader, this product offers reliable performance and versatility for a wide range of applications. With a compact package shape and surface mount design, this line driver & receiver provides seamless integration and maximum efficiency. Trust in the quality and precision of Texas Instruments to deliver top-notch products that exceed expectations. Unlock the potential of your projects with the ISO35TDW and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage requirements in various applications.

Package Shape: RECTANGULAR

Optimizes space utilization on circuit boards.

Maximum Transmit Delay: 340 ns

Ensures fast and efficient data transmission.

Power Supplies (V): 3.3

Efficiently operates at a standard voltage level.

No. of Terminals: 16

Provides sufficient connectivity options for diverse connections.

Package Style (Meter): SMALL OUTLINE

Facilitates compact and space-saving design integration.

Minimum Supply Voltage: 3 V

Allows operation within a safe voltage range.

Maximum High Level Input Current: 0.00001 Amp

Efficiently handles low current requirements.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Output Characteristics: TOTEM-POLE

Ensures stable and balanced output signals.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a corrosion-resistant and durable finish for long-term use.

Terminal Position: DUAL

Offers flexibility in connection options.

Maximum Seated Height: 2.65 mm

Enables low-profile installation in compact devices.

Width: 7.5 mm

Compact size for space-efficient circuit board layout.

Maximum Output Low Current: 8 Amp

Capable of handling high output current requirements.

Output Polarity: COMPLEMENTARY

Provides balanced and complementary output signals.

Differential Output: YES

Allows for effective noise rejection and signal integrity in transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes.

Length: 10.3 mm

Optimizes space utilization on circuit boards.

Minimum Out Swing: 1.5 V

Guarantees a minimum voltage swing for reliable signal transmission.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature ranges.

Maximum Receive Delay: 115 ns

Provides fast response time for incoming data.

Terminal Form: GULL WING

Facilitates easy soldering and connection to PCBs.

Interface Standard: EIA-485; EIA-422

Complies with industry standards for seamless integration in communication systems.

Maximum Supply Current: 16 mA

Operates efficiently within specified current parameters.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Ensures accurate and reliable signal detection.

Nominal Supply Voltage: 3.3 V

Standard voltage supply for compatibility in various applications.

Terminal Pitch: 1.27 mm

Allows for precise and secure connections on circuit boards.

Moisture Sensitivity Level (MSL): 2

Suitable for moderate moisture exposure during storage and handling.

Interface IC Type: LINE TRANSCEIVER

Provides versatile interface capabilities for communication systems.

Technical Specifications

Line Drivers & Receivers ISO35TDW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485; EIA-422

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

115 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

16 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

340 ns

Width:

7.5 mm

Trade Compliance

ISO35TDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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