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ISO3082DWRG4

Texas Instruments

ISO3082DWRG4 by Texas Instruments

ISO3082DWRG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at -40 to 85 °C. It has a max supply voltage of 5.5 V and offers differential output for EIA-422, TIA-422, EIA-485, and TIA-485 interfaces. This small outline package is ideal for industrial applications requiring high-speed data transmission.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 31,170 parts In-Stock

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Digiode

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Vyrian

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Nova Conductors

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Parana Technologies

USA . 1,087 parts In-Stock

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$3.418

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$3.943

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$3.418

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$3.943

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DigiPath Technology Company

USA . 1,511 parts In-Stock

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$3.764

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$3.764

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ChromeModa Solutions

Germany . 3,188 parts In-Stock

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$3.841

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$3.150

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$3.841

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IDEA Electronic Components Group

UK . 761 parts In-Stock

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$3.841

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$3.457

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Corohmni

South Africa . 183 parts In-Stock

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$4.008

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Advanced Electronics

New Zealand . 69 parts In-Stock

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$8.165

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$7.757

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$7.757

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Semicontronic

India . 527 parts In-Stock

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$8.500

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$8.288

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$8.245

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Ampacity Inc.

Singapore . 1,230 parts In-Stock

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$14.500

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AZTECH Wire

Italy . 862 parts In-Stock

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One Stop Electronics

USA . 473 parts In-Stock

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Component Stockers USA

USA . 1,860 parts In-Stock

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Kepictronics

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Microchip USA

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A-Z Elektronik GmbH

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Continental Prestige Electronics

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Overview

Elevate your industrial communication systems with the Texas Instruments ISO3082DWRG4 Line Driver & Receiver. Crafted with precision and quality, this small outline package delivers reliable performance in a wide range of applications. From EIA-422 to TIA-485 interfaces, this versatile product ensures seamless data transmission with minimal delay. Trust in Texas Instruments for superior technology that enhances your systems' efficiency and reliability. Experience the value and benefits of the ISO3082DWRG4 and take your communication networks to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

The surface mount feature makes installation easy and allows for compact design in electronic systems.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape offers convenient installation and efficient use of space in circuit designs.

Maximum Transmit Delay: 1.3 ns

The low maximum transmit delay ensures quick and efficient signal transmission in the system.

Power Supplies (V): 3.3/5,5

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 16

The high number of terminals provides connectivity options and allows for versatile integration in circuit layouts.

Maximum High Level Input Current: 0.00001 Amp

The low maximum high level input current ensures energy efficiency and reduces power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold environments.

Technical Specifications

Line Drivers & Receivers ISO3082DWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Maximum Receive Delay:

125 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

1.3 ns

Width:

7.5 mm

Trade Compliance

ISO3082DWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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