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STLVDS104BD

STMicroelectronics

STLVDS104BD by STMicroelectronics

STLVDS104BD by STMicroelectronics is a 4-bit line transceiver with a max supply voltage of 3.6V and operates in industrial temperatures from -40 °C to 85 °C. It features low transmit/receive delays of 4.2 ns, making it ideal for high-speed data applications. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,688 parts In-Stock

1+ parts

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3,688

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Digiode

USA . 2,079 parts In-Stock

1+ parts

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2,079

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Anansix

USA . 1,156 parts In-Stock

1+ parts

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1,156

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,345 parts In-Stock

1+ parts

$13.358

100+ parts

-

1k+ parts

$12.023

10k+ parts

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1,345

$13.358

-

$12.023

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MKK Technologies

India . 557 parts In-Stock

1+ parts

$25.120

100+ parts

-

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557

$25.120

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DigiPath Technology Company

USA . 557 parts In-Stock

1+ parts

$25.120

100+ parts

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557

$25.120

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Corphita

USA . 2,848 parts In-Stock

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2,848

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Parana Technologies

USA . 347 parts In-Stock

1+ parts

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100+ parts

$15.972

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347

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$15.972

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Overview

Elevate your designs with the STLVDS104BD from STMicroelectronics, a trusted leader in semiconductor solutions. This high-performance line driver and receiver excels in delivering rapid data transmission with minimal delay, making it ideal for industrial automation, telecommunications, and automotive applications. With its robust temperature range and compact footprint, you gain reliability and efficiency without compromise—perfect for driving innovation in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable plastic/epoxy material enhances the overall reliability of the product.

Surface Mount: YES

Surface mount design allows for easier integration into compact PCB layouts.

Maximum Supply Voltage: 3.6 V

A maximum voltage of 3.6 V ensures compatibility with a wide range of electronic systems.

Package Shape: RECTANGULAR

Rectangular shape aids in effective space utilization on printed circuit boards.

Maximum Transmit Delay: 4.2 ns

Low transmit delay enhances communication speed for high-performance applications.

Power Supplies (V): 3.3

Designed for 3.3V supply, making it suitable for modern low-power devices.

No. of Terminals: 16

The 16-terminal configuration provides multiple connection options for versatile applications.

Package Style (Meter): SMALL OUTLINE

Small outline package facilitates space savings in closely packed electronic assemblies.

Minimum Supply Voltage: 3 V

Operates down to 3V, ensuring it functions well in a variety of power environments.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes it suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Withstand extremely low temperatures, ensuring operation in frigid conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal position allows for flexible board layout options.

Maximum Seated Height: 1.75 mm

The low height facilitates integration into compact designs where space is critical.

Width: 3.9 mm

This narrow width is ideal for space-constrained PCB designs.

Differential Output: YES

Differential output supports high noise immunity and signal integrity.

Length: 9.9 mm

Compact length allows for efficient use of space on printed circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in demanding environments.

Maximum Receive Delay: 4.2 ns

Low receive delay contributes to fast data transmission rates.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhanced connectivity.

Interface Standard: EIA-644; TIA-644

Adhering to established industry standards ensures interoperability with other devices.

Input Characteristics: DIFFERENTIAL

Differential inputs maximize noise immunity, making it suitable for long-distance signal transmission.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage aligns with common digital logic levels for compatibility.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for easier placement in double-sided PCB designs.

Driver No. of Bits: 4

4-bit driver capability enables efficient and streamlined data transfers in applications.

Moisture Sensitivity Level (MSL): 3

MSL Level 3 indicates moderate environmental robustness suitable for standard handling practices.

Interface IC Type: LINE TRANSCEIVER

Designed specifically as a line transceiver, it is optimized for reliable communication in various applications.

Technical Specifications

Line Drivers & Receivers STLVDS104BD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.2 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

4.2 ns

Width:

3.9 mm

Trade Compliance

STLVDS104BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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