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MAX3243EIPWRG4

Texas Instruments

MAX3243EIPWRG4 by Texas Instruments

MAX3243EIPWRG4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.3/5V. It has a max supply voltage of 5.5V and operates in industrial temperature range (-40 to 85°C). Ideal for EIA-232-F, TIA-232-F, V.28 interface standards applications.

Median Price

$2.430

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 802 parts In-Stock

1+ parts

$2.430

100+ parts

$1.470

1k+ parts

$1.290

10k+ parts

$1.070

802

$2.430

$1.470

$1.290

$1.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 26,460 parts In-Stock

1+ parts

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26,460

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Digiode

USA . 4,860 parts In-Stock

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4,860

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Vyrian

USA . 1,908 parts In-Stock

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1,908

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North Shore Components

USA . 1,331 parts In-Stock

1+ parts

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1,331

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Nova Conductors

Japan . 32 parts In-Stock

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32

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Semi Source

USA . 7 parts In-Stock

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7

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,884 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

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-

1,884

$0.560

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Semicontronic

India . 1,759 parts In-Stock

1+ parts

$0.560

100+ parts

$0.546

1k+ parts

$0.543

10k+ parts

-

1,759

$0.560

$0.546

$0.543

-

Parana Technologies

USA . 2,115 parts In-Stock

1+ parts

$3.969

100+ parts

$368.619

1k+ parts

$3.572

10k+ parts

-

2,115

$3.969

$368.619

$3.572

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DigiPath Technology Company

USA . 1,855 parts In-Stock

1+ parts

$4.371

100+ parts

$4.021

1k+ parts

-

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1,855

$4.371

$4.021

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ChromeModa Solutions

Germany . 3,197 parts In-Stock

1+ parts

$4.460

100+ parts

$3.657

1k+ parts

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3,197

$4.460

$3.657

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IDEA Electronic Components Group

UK . 1,918 parts In-Stock

1+ parts

$4.460

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$4.014

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1,918

$4.460

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$4.014

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Corohmni

South Africa . 3 parts In-Stock

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$6.668

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3

$6.668

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$14.598

100+ parts

$13.868

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$13.868

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20

$14.598

$13.868

$13.868

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A-Z Elektronik GmbH

Germany . 5,477 parts In-Stock

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5,477

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Argo Parts USA

USA . 4,573 parts In-Stock

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4,573

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Continental Prestige Electronics

USA . 3,512 parts In-Stock

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Microchip USA

USA . 3,344 parts In-Stock

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3,344

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Corphita

USA . 893 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Enhance your electronic designs with the MAX3243EIPWRG4 by Texas Instruments, a top-tier manufacturer renowned for quality and reliability. As a leading player in the Line Drivers & Receivers category, this product offers exceptional value with its versatile applications in industrial settings, communications, and more. With a focus on maximizing performance and efficiency, this small outline, thin profile package delivers superior functionality, making it a must-have component for your projects. Upgrade your systems today with the MAX3243EIPWRG4 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product into various electronic designs and saves space on the PCB.

Maximum Supply Voltage: 3.6 V

Suitable for low power applications and provides a safe operating voltage range for the product.

No. of Functions: 3

Having multiple functions in one product can help reduce the need for additional components, making the design more efficient.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and soldering onto the PCB, simplifying the manufacturing process.

Maximum Supply Voltage-1: 5.5 V

Allows for flexibility in power supply options, suitable for a wide range of applications.

Power Supplies (V): 3.3/5

Supports multiple power supply options, making it compatible with various systems and designs.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and versatility in the usage of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves space on the PCB and enables a higher component density, ideal for designs with limited space.

Minimum Supply Voltage-1: 4.5 V

Provides a wider operating voltage range, ensuring compatibility with different power sources.

Maximum High Level Input Current: 0.000001 Amp

Low input current helps in reducing power consumption and heat dissipation, making the product more energy-efficient.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for operation in low-power conditions, suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial environments where heat can be a concern.

Minimum Operating Temperature: -40 °C

Operates reliably in cold temperatures, making it suitable for a wide range of environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position offers more flexibility in PCB layout and connection options, enhancing usability.

Maximum Seated Height: 1.2 mm

Low seated height saves space on the PCB and allows for a slimmer overall design.

Width: 4.4 mm

Compact width makes it easier to place multiple components in a limited space, optimizing PCB layout.

Maximum Output Low Current: 1.6 Amp

High output current capability makes it suitable for driving various loads and ensures reliable performance.

Output Polarity: INVERTED

Inverted output polarity can be beneficial in certain applications where a complementary signal is required.

Receiver No. of Bits: 5

Having 5 bits in the receiver allows for more precision in data transmission and reception.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes, ensuring reliable assembly during manufacturing.

Length: 9.7 mm

Compact length saves space on the PCB and allows for more flexibility in design layout.

Minimum Out Swing: 10 V

High minimum output swing ensures compatibility with a wide range of input signals and enhances signal integrity.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments, where reliability and durability are essential.

Maximum Receive Delay: 150 ns

Low receive delay ensures fast data transmission and response times, critical in real-time applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process and ensures reliable connections on the PCB.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry-standard interface protocols ensures interoperability with other devices and systems.

Maximum Supply Current: 1 mA

Low supply current consumption helps in reducing overall power consumption and heat generation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide hysteresis and noise immunity, ensuring reliable signal detection.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density packaging and precise connections, suitable for small form factor designs.

Nominal Supply Voltage-1: 5 V

Another stable supply voltage option for compatibility with various power sources and requirements.

Driver No. of Bits: 3

Having 3 bits in the driver allows for multiple output states and flexibility in driving external components.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver, this product can handle bidirectional data transmission and reception, enhancing communication capabilities.

Technical Specifications

Line Drivers & Receivers MAX3243EIPWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

MAX3243EIPWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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