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STLVDS105BD

STMicroelectronics

STLVDS105BD by STMicroelectronics

STLVDS105BD by STMicroelectronics is a 4-bit line transceiver with a max supply voltage of 3.6V and operates b/w -40 °C to 85 °C. It features a fast transmit/receive delay of just 3ns, making it ideal for high-speed data applications. Its compact SO package ensures efficient surface mounting in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,059 parts In-Stock

1+ parts

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3,059

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Vyrian

USA . 2,967 parts In-Stock

1+ parts

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1k+ parts

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2,967

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Anansix

USA . 907 parts In-Stock

1+ parts

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907

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,436 parts In-Stock

1+ parts

$13.306

100+ parts

-

1k+ parts

$11.975

10k+ parts

-

1,436

$13.306

-

$11.975

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MKK Technologies

India . 317 parts In-Stock

1+ parts

$25.021

100+ parts

-

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317

$25.021

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DigiPath Technology Company

USA . 317 parts In-Stock

1+ parts

$25.021

100+ parts

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317

$25.021

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Corphita

USA . 1,763 parts In-Stock

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1,763

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Parana Technologies

USA . 933 parts In-Stock

1+ parts

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100+ parts

$15.909

1k+ parts

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933

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$15.909

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Overview

Unlock exceptional performance with the STLVDS105BD by STMicroelectronics, a leading name in semiconductor solutions. Designed for high-speed data transmission, this line driver/receiver excels in demanding environments, offering reliability from -40 °C to 85 °C. Perfect for industrial applications, it ensures low power consumption and minimal delays, making it ideal for your next project. Elevate your designs with unmatched quality and innovative technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures reliability and longevity, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount design allows for easy integration into modern PCB layouts, saving space and improving assembly efficiency.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, providing flexibility for various power supply configurations in electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape is optimal for efficient space usage and can be easily placed on PCBs with a defined footprint.

Maximum Transmit Delay: 3 ns

With a maximum transmit delay of only 3 ns, this product ensures high-speed data transmission, suitable for fast communication systems.

Power Supplies (V): 3.3

Operates at a nominal supply voltage of 3.3V, which is a standard value for many digital logic circuits, enhancing compatibility.

No. of Terminals: 16

16 terminals provide ample connectivity options for various input/output configurations, supporting complex circuit designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style contributes to reduced board space requirements, making it ideal for compact electronic devices.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V adds resilience to voltage variations, ensuring consistent performance under different conditions.

Maximum Operating Temperature: 85 °C

Operational up to 85 °C makes it suitable for use in industrial environments where higher temperatures may be encountered.

Minimum Operating Temperature: -40 °C

With a range down to -40 °C, this product is ideal for applications in harsh or variable climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and corrosion resistance, enhancing reliability over time.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible routing on PCBs and eases the assembly process in densely populated areas.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75 mm helps maintain a slim profile in completed assemblies, beneficial for portable applications.

Width: 3.9 mm

Compact width of 3.9 mm is advantageous for space-sensitive designs, allowing for higher integration density on PCBs.

Differential Output: YES

Support for differential output enhances noise immunity and signal integrity over long transmission lines.

Length: 9.9 mm

The length of 9.9 mm strikes the right balance between easy placement on PCBs and space efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliable performance in demanding environments, ensuring longevity and stability.

Maximum Receive Delay: 3 ns

A maximum receive delay of 3 ns ensures that the device can quickly process incoming signals, ideal for high-speed applications.

Terminal Form: GULL WING

Gull wing terminals enable reliable soldering and easy inspection, while providing a strong physical connection upon mounting.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 standards ensures interoperability with various communication protocols and devices.

Input Characteristics: STANDARD

Standard input characteristics provide compatibility with common signal sources, simplifying design integration.

Nominal Supply Voltage: 3.3 V

Operating at a nominal 3.3V aligns with many digital systems, enhancing its versatility in different applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is compatible with common PCB designs, facilitating easy and effective placement.

Driver No. of Bits: 4

A driver supporting 4 bits allows for efficient data transmission and expands the range of applications it can serve.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable handling and reflow conditions, making it suitable for typical manufacturing processes.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed for robust signal transmission, ensuring strong performance in communication applications.

Technical Specifications

Line Drivers & Receivers STLVDS105BD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

3 ns

Width:

3.9 mm

Trade Compliance

STLVDS105BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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