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SN65LVDS1DBV

Texas Instruments

SN65LVDS1DBV by Texas Instruments

SN65LVDS1DBV by Texas Instruments is a line driver with a max supply voltage of 3.6 V and a max transmit delay of 3.1 ns. It is used in applications requiring TTL technology and EIA-644-A/TIA-644-A interface standards.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 8,520 parts In-Stock

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8,520

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Nova Conductors

Japan . 750 parts In-Stock

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750

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South Electronics

USA . 131 parts In-Stock

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131

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Digiode

USA . 70 parts In-Stock

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70

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EPE Components Inc.

USA . 20 parts In-Stock

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20

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Sunrise Surplus Inc.

USA . 18 parts In-Stock

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18

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Distributors (Availability)

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Semicontronic

India . 841 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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841

$1.500

$1.462

$1.455

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$2.697

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$2.562

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$2.562

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100

$2.697

$2.562

$2.562

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Parana Technologies

USA . 169 parts In-Stock

1+ parts

$3.823

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$355.064

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$3.441

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169

$3.823

$355.064

$3.441

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DigiPath Technology Company

USA . 2,247 parts In-Stock

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$4.210

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$3.873

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$4.210

$3.873

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ChromeModa Solutions

Germany . 5,005 parts In-Stock

1+ parts

$4.296

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$3.523

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5,005

$4.296

$3.523

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IDEA Electronic Components Group

UK . 1,627 parts In-Stock

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$4.296

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$3.866

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1,627

$4.296

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$3.866

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Corohmni

South Africa . 396 parts In-Stock

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$12.832

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396

$12.832

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AZTECH Wire

Italy . 526 parts In-Stock

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$13.634

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526

$13.634

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Microchip USA

USA . 704 parts In-Stock

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$16.044

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704

$16.044

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Ampacity Inc.

Singapore . 649 parts In-Stock

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$22.500

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649

$22.500

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One Stop Electronics

USA . 745 parts In-Stock

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$42.500

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745

$42.500

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Lixinc

USA . 9,283 parts In-Stock

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Corphita

USA . 2,046 parts In-Stock

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2,046

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Argo Parts USA

USA . 1,275 parts In-Stock

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1,275

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Continental Prestige Electronics

USA . 193 parts In-Stock

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193

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Overview

Experience superior performance and reliability with the SN65LVDS1DBV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality line drivers and receivers that meet the demands of various applications. This compact and efficient device offers numerous advantages, including a small outline package design, low power consumption, and a wide temperature range for industrial-grade performance. With its differential output and standard input characteristics, the SN65LVDS1DBV is perfect for ensuring reliable signal transmission in demanding environments. Trust Texas Instruments to provide you with exceptional value, benefits, and advantages that exceed your expectations. Elevate your designs with the SN65LVDS1DBV and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the internal components, making this line driver/receiver suitable for various environments.

Surface Mount: YES

With the surface mount capability, this line driver/receiver offers easier integration and installation onto circuit boards, allowing for space-saving designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V enables compatibility with a wide range of systems and power sources, making it versatile for different applications.

No. of Functions: 1

Having one function simplifies the implementation and operation of this line driver/receiver, ensuring ease of use and straightforward functionality.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard mounting and soldering processes, ensuring convenience during assembly.

Maximum Transmit Delay: 3.1 ns

The low maximum transmit delay of 3.1 ns ensures fast and efficient signal transmission, making it ideal for high-speed communication applications.

Power Supplies (V): 2.5/3.3

With support for multiple power supply voltages (2.5V and 3.3V), this line driver/receiver offers flexibility in system integration and compatibility with various voltage sources.

No. of Terminals: 5

The compact design with only five terminals allows for space-efficient circuitry layout and simplifies the connection process while reducing points of failure.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style ensures space-saving installation and compatibility with modern electronic devices.

Maximum High Level Input Current: 0.00002 Amp

The extremely low maximum high level input current minimizes power consumption and allows for efficient operations, making this line driver/receiver energy-efficient.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage requirement of 2.4V enables reliable operation with lower power sources, expanding its range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C makes this line driver/receiver suitable for use in demanding environments, ensuring reliability in harsh conditions.

Output Characteristics: TOTEM-POLE

The totem-pole output characteristics provide both strong driving capabilities and bidirectional functionality, making it suitable for versatile applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures this line driver/receiver can function reliably even in extremely cold conditions, expanding its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals enhances corrosion resistance and enables reliable electrical connections over time, ensuring long-term performance.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB layout and easier connection options, providing convenience during the installation process.

Maximum Seated Height: 1.45 mm

The low maximum seated height ensures a compact and low-profile design, suitable for space-constrained applications.

Width: 1.6 mm

With a slim width of only 1.6mm, this line driver/receiver enables compact circuit board designs and efficient space utilization.

Differential Output: YES

The presence of differential output allows for noise reduction and improved signal integrity, making this line driver/receiver suitable for applications requiring high data accuracy.

Maximum Time At Peak Reflow Temperature (s): 30

The extended maximum time at peak reflow temperature of 30 seconds ensures compatibility with reflow soldering processes while providing sufficient time for reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures the line driver/receiver can withstand high-temperature soldering processes, ensuring proper assembly and reliable connections.

Length: 2.9 mm

The compact length of 2.9mm allows for space-efficient integration on circuit boards and provides versatility in product designs.

Minimum Out Swing: 0.247 V

The minimum out swing voltage of 0.247V ensures reliable signal levels, minimizing distortion and enhancing data transmission quality.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures reliable operation in a wide range of temperature conditions, making this line driver/receiver suitable for industrial applications.

Maximum Receive Delay: 3.6 ns

The low maximum receive delay of 3.6 ns enables fast and efficient signal reception, ensuring minimal delays in data transmission and reception.

Technology: TTL

The use of TTL (Transistor-Transistor Logic) technology provides compatibility with various systems and ensures reliable signal processing, making it a reliable choice for multiple applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates surface mounting and ensures secure solder connections, providing ease of installation and reliable electrical connections.

Interface Standard: EIA-644-A; TIA-644-A

Compliance with the EIA-644-A and TIA-644-A interface standards ensures compatibility and interoperability with other devices implementing the same standards, making it a suitable choice for standardized communication protocols.

Input Characteristics: STANDARD

The standard input characteristics ensure compatibility with a wide range of input signals, allowing for seamless integration and interoperability in various systems.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides compatibility with standard power sources and ensures stable and reliable operation in most applications.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95mm allows for high-density PCB layouts and enables compact system designs while ensuring electrical integrity.

Driver No. of Bits: 1

With a single driver bit, this line driver/receiver is suitable for applications requiring single-channel driving or receiving, providing simplicity and cost-effectiveness.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level 1 indicates that this line driver/receiver has a low sensitivity to moisture, ensuring robustness and reliability during storage and usage.

Interface IC Type: LINE DRIVER

The interface IC type of line driver ensures compatibility with other line receiver devices, making it suitable for signal transmission and amplification applications.

Technical Specifications

Line Drivers & Receivers SN65LVDS1DBV attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

TOTEM-POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3.6 ns

Maximum Seated Height:

1.45 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3.1 ns

Width:

1.6 mm

Trade Compliance

SN65LVDS1DBV Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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