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SN65HVD1473DGSR

Texas Instruments

SN65HVD1473DGSR by Texas Instruments

SN65HVD1473DGSR by Texas Instruments is a line driver/receiver with 10 terminals, operating at 3.3V nominal voltage. It features EIA-485 interface standard, differential output, and peak reflow temperature of 260°C. Ideal for automotive applications due to its small outline package and wide temperature range from -40°C to 125°C.

Median Price

$3.573

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 194,156 parts In-Stock

1+ parts

$3.573

100+ parts

$2.913

1k+ parts

$1.942

10k+ parts

-

194,156

$3.573

$2.913

$1.942

-

Mouser Electronics

USA . 2,563 parts In-Stock

1+ parts

$6.050

100+ parts

$3.870

1k+ parts

$3.590

10k+ parts

$3.410

2,563

$6.050

$3.870

$3.590

$3.410

DigiKey

USA . 1,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.419

1,641

-

-

-

$3.419

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$2.913

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$2.913

-

-

-

Ozdisan Elektronik

Türkiye . 91 parts In-Stock

1+ parts

$3.017

100+ parts

-

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-

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91

$3.017

-

-

-

Digiode

USA . 3,534 parts In-Stock

1+ parts

$3.394

100+ parts

-

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-

10k+ parts

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3,534

$3.394

-

-

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Vyrian

USA . 68,161 parts In-Stock

1+ parts

-

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68,161

-

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-

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Chip Stock

USA . 23,600 parts In-Stock

1+ parts

-

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23,600

-

-

-

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Cyclops Electronics Ltd

UK . 298 parts In-Stock

1+ parts

-

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-

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298

-

-

-

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NAC Semi

USA . 73 parts In-Stock

1+ parts

-

100+ parts

$8.610

1k+ parts

-

10k+ parts

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73

-

$8.610

-

-

ComSIT Distribution GmbH

Germany . 28 parts In-Stock

1+ parts

-

100+ parts

-

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28

-

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NexGen Digital

USA . 1 parts In-Stock

1+ parts

-

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1

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,632 parts In-Stock

1+ parts

$2.913

100+ parts

-

1k+ parts

-

10k+ parts

-

3,632

$2.913

-

-

-

Continental Prestige Electronics

USA . 3,308 parts In-Stock

1+ parts

$2.913

100+ parts

-

1k+ parts

-

10k+ parts

$2.855

3,308

$2.913

-

-

$2.855

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.913

100+ parts

-

1k+ parts

-

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100

$2.913

-

-

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Corohmni

South Africa . 60 parts In-Stock

1+ parts

$2.990

100+ parts

-

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60

$2.990

-

-

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Semicontronic

India . 68,152 parts In-Stock

1+ parts

$3.040

100+ parts

$2.964

1k+ parts

$2.949

10k+ parts

-

68,152

$3.040

$2.964

$2.949

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$3.080

100+ parts

$2.926

1k+ parts

$2.926

10k+ parts

-

2,000

$3.080

$2.926

$2.926

-

Corphita

USA . 4,488 parts In-Stock

1+ parts

$3.216

100+ parts

-

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10k+ parts

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4,488

$3.216

-

-

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Parana Technologies

USA . 1,661 parts In-Stock

1+ parts

$3.659

100+ parts

-

1k+ parts

$4.166

10k+ parts

-

1,661

$3.659

-

$4.166

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ChromeModa Solutions

Germany . 4,395 parts In-Stock

1+ parts

$4.111

100+ parts

$3.371

1k+ parts

-

10k+ parts

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4,395

$4.111

$3.371

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IDEA Electronic Components Group

UK . 244 parts In-Stock

1+ parts

$4.111

100+ parts

-

1k+ parts

$3.700

10k+ parts

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244

$4.111

-

$3.700

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Ampacity Inc.

Singapore . 68,397 parts In-Stock

1+ parts

$6.610

100+ parts

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68,397

$6.610

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Lixinc

USA . 8,884 parts In-Stock

1+ parts

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8,884

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A-Z Elektronik GmbH

Germany . 5,154 parts In-Stock

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5,154

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Futuretech Components

Singapore . 5,000 parts In-Stock

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5,000

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DigiPath Technology Company

USA . 1,330 parts In-Stock

1+ parts

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100+ parts

$3.706

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1,330

-

$3.706

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

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500

-

-

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$3.399

1k+ parts

$3.399

10k+ parts

$3.399

500

-

$3.399

$3.399

$3.399

Overview

Unlock seamless communication with the SN65HVD1473DGSR by Texas Instruments. Crafted with precision and reliability, this line driver & receiver is designed to elevate your automotive applications with its robust performance and efficient transmission capabilities. With a compact design and advanced features, this product offers unparalleled value, ensuring optimal functionality and seamless connectivity for your projects. Trust Texas Instruments for quality engineering and innovative solutions that drive success. Elevate your designs today with the SN65HVD1473DGSR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for applications where weight and longevity are important factors.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation, making this product ideal for compact or crowded circuit board designs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product offers flexibility in power requirements and can handle a wide range of voltage inputs.

Package Shape: SQUARE

The square package shape helps optimize space on a circuit board, making it a great choice for applications where board real estate is limited.

Maximum Transmit Delay: 20 ns

The low maximum transmit delay ensures efficient and timely data transmission, making this product suitable for high-speed communication systems.

No. of Terminals: 10

Having 10 terminals provides multiple connection points, increasing versatility and functionality in different circuit setups.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style minimizes space usage, making it a practical choice for compact electronic devices.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this product can operate efficiently even with lower power sources, offering flexibility in power management.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in extreme conditions, making this product suitable for a wide range of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function in cold environments, providing versatility in usage scenarios.

Technical Specifications

Line Drivers & Receivers SN65HVD1473DGSR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

90 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Maximum Supply Current:

1.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

20 ns

Width:

3 mm

Trade Compliance

SN65HVD1473DGSR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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