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ISO1176DWRG4

Texas Instruments

ISO1176DWRG4 by Texas Instruments

ISO1176DWRG4 by Texas Instruments is a line driver/receiver with max supply voltage of 5.5V, transmit delay of 40ns, and differential output. Ideal for EIA-485/TIA-485 interfaces in industrial applications due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,601 parts In-Stock

1+ parts

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3,601

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Vyrian

USA . 3,550 parts In-Stock

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3,550

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Nova Conductors

Japan . 94 parts In-Stock

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94

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,549 parts In-Stock

1+ parts

$6.665

100+ parts

-

1k+ parts

$7.372

10k+ parts

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1,549

$6.665

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$7.372

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ChromeModa Solutions

Germany . 3,284 parts In-Stock

1+ parts

$7.489

100+ parts

$6.141

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-

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3,284

$7.489

$6.141

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IDEA Electronic Components Group

UK . 2,149 parts In-Stock

1+ parts

$7.489

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$6.740

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2,149

$7.489

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$6.740

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AZTECH Wire

Italy . 533 parts In-Stock

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$9.050

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533

$9.050

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Corohmni

South Africa . 115 parts In-Stock

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$11.809

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115

$11.809

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$13.575

100+ parts

$12.897

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$12.897

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2,000

$13.575

$12.897

$12.897

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One Stop Electronics

USA . 1,460 parts In-Stock

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$21.500

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1,460

$21.500

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Ampacity Inc.

Singapore . 654 parts In-Stock

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$27.500

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654

$27.500

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Semicontronic

India . 803 parts In-Stock

1+ parts

$48.500

100+ parts

$47.288

1k+ parts

$47.045

10k+ parts

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803

$48.500

$47.288

$47.045

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,411 parts In-Stock

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Continental Prestige Electronics

USA . 2,313 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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$0.008

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$0.008

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$0.008

900

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$0.008

$0.008

$0.008

Argo Parts USA

USA . 515 parts In-Stock

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515

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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DigiPath Technology Company

USA . 130 parts In-Stock

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$6.752

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130

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$6.752

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Modulus Dynamics

Lithuania . 42 parts In-Stock

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Overview

Enhance your industrial applications with the Texas Instruments ISO1176DWRG4 Line Driver & Receiver. Built with precision and reliability in mind, this product offers seamless communication and data transmission. With a maximum supply voltage of 5.5V and differential output characteristics, it ensures high performance even in challenging environments. Trust in Texas Instruments' expertise in semiconductor manufacturing to deliver top-notch quality and durability. Elevate your systems with the ISO1176DWRG4 and experience unmatched efficiency and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver & receiver, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product into circuit boards, saving space and enhancing efficiency.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile and reliable.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to design and layout the circuit board, optimizing space and ensuring a tidy installation.

Maximum Transmit Delay: 40 ns

The low transmit delay ensures fast and efficient data transmission, making this product ideal for high-speed communication applications.

Output Characteristics: DIFFERENTIAL

Differential output provides better noise immunity and signal integrity, making this product suitable for environments with electrical interference.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, improving overall reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function in extreme cold environments, expanding its usability.

Interface Standard: EIA-485; TIA-485

Compliance with these industry standards ensures compatibility with a wide range of communication protocols, making integration easier.

Technical Specifications

Line Drivers & Receivers ISO1176DWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485; TIA-485

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Maximum Receive Delay:

55 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

40 ns

Width:

7.5 mm

Trade Compliance

ISO1176DWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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