Loading...

STGD3NB60SD-1

STMicroelectronics

STGD3NB60SD-1 by STMicroelectronics

STGD3NB60SD-1 by STMicroelectronics is an N-CHANNEL IGBT with 600V VCE, 3A IC, and 48W Pd. It operates up to 175 °C making it ideal for power applications requiring high voltage switching in surface mount designs.

Median Price

$0.519

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$0.519

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$0.519

-

-

-

Vyrian

USA . 3,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,401

-

-

-

-

Anansix

USA . 662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

662

-

-

-

-

Digiode

USA . 584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

584

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 620 parts In-Stock

1+ parts

$0.789

100+ parts

-

1k+ parts

$0.710

10k+ parts

-

620

$0.789

-

$0.710

-

MKK Technologies

India . 719 parts In-Stock

1+ parts

$1.484

100+ parts

-

1k+ parts

-

10k+ parts

-

719

$1.484

-

-

-

DigiPath Technology Company

USA . 719 parts In-Stock

1+ parts

$1.484

100+ parts

-

1k+ parts

-

10k+ parts

-

719

$1.484

-

-

-

AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$9.260

100+ parts

-

1k+ parts

-

10k+ parts

-

874

$9.260

-

-

-

Component Stockers USA

USA . 259 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

259

$99.990

-

-

-

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56,986

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,800

-

-

-

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Parana Technologies

USA . 1,613 parts In-Stock

1+ parts

-

100+ parts

$0.944

1k+ parts

-

10k+ parts

-

1,613

-

$0.944

-

-

Corphita

USA . 1,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,296

-

-

-

-

Overview

Enhance your electronic designs with the STGD3NB60SD-1 Insulated Gate Bipolar Transistor by STMicroelectronics. This high-quality N-CHANNEL IGBT offers a maximum collector-emitter voltage of 600V and a maximum collector current of 3A, making it ideal for power applications. With a maximum power dissipation of 48W and a wide operating temperature range, this surface-mount transistor provides reliable performance in various environments. Trust in STMicroelectronics' reputation for excellence and innovation, and elevate your projects with the STGD3NB60SD-1.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making this product suitable for applications requiring high performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Power Dissipation (Abs): 48 W

With a high maximum power dissipation, this IGBT can handle heavy loads and high power applications effectively.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures reliable performance even in environments with elevated temperatures.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating allows for use in high voltage applications, providing versatility and flexibility.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating ensures safe and reliable operation, protecting the device from excessive voltage levels.

Maximum Collector Current (IC): 3 A

With a high maximum collector current rating, this IGBT can handle high current levels, making it suitable for power electronic applications.

Maximum Gate-Emitter Threshold Voltage: 4.5 V

The gate-emitter threshold voltage specifies the minimum voltage required to turn on the IGBT, allowing for precise control and efficient operation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures reliable electrical connections, enhancing the overall durability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper soldering and prevents overheating of the device during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for lead-free soldering processes, making this product compliant with environmental regulations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGD3NB60SD-1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

3 A

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

4.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STGD3NB60SD-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20