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STGB35N35LZ-1

STMicroelectronics

STGB35N35LZ-1 by STMicroelectronics

STGB35N35LZ-1 from STMicroelectronics is an N-channel IGBT ideal for power control applications. It features a max collector-emitter voltage of 380V, a power dissipation of 176W, and operates at up to 175 °C. Its built-in diode enhances efficiency in various electronic circuits.

Median Price

$2.920

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 901 parts In-Stock

1+ parts

$2.920

100+ parts

$1.327

1k+ parts

$1.103

10k+ parts

-

901

$2.920

$1.327

$1.103

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,722 parts In-Stock

1+ parts

$3.268

100+ parts

-

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3,722

$3.268

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Vyrian

USA . 2,605 parts In-Stock

1+ parts

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2,605

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Anansix

USA . 1,641 parts In-Stock

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1,641

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 966 parts In-Stock

1+ parts

$1.766

100+ parts

-

1k+ parts

$1.590

10k+ parts

-

966

$1.766

-

$1.590

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Corphita

USA . 3,277 parts In-Stock

1+ parts

$3.096

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-

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3,277

$3.096

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MKK Technologies

India . 1,986 parts In-Stock

1+ parts

$3.322

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1,986

$3.322

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DigiPath Technology Company

USA . 1,986 parts In-Stock

1+ parts

$3.322

100+ parts

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1,986

$3.322

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Microchip USA

USA . 312 parts In-Stock

1+ parts

$16.900

100+ parts

-

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312

$16.900

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Kepictronics

USA . 23,000 parts In-Stock

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23,000

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RC Electronics

USA . 22,828 parts In-Stock

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22,828

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A-Z Elektronik GmbH

Germany . 6,540 parts In-Stock

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6,540

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Parana Technologies

USA . 1,857 parts In-Stock

1+ parts

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100+ parts

$2.112

1k+ parts

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1,857

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$2.112

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Authorized Procurement Solutions

USA . 100 parts In-Stock

1+ parts

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100

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Overview

Elevate your power control solutions with the STGB35N35LZ-1 from STMicroelectronics, a leader in high-quality semiconductors. This robust N-channel IGBT delivers exceptional performance in demanding applications while ensuring reliability and efficiency. Designed for optimal thermal management and ease of integration, it empowers engineers to create innovative solutions across industrial, automotive, and renewable energy sectors, providing unmatched value and durability for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides excellent insulation properties, making it durable and suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for lower on-resistance and better performance, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

This configuration offers versatility and enhances efficiency by providing integrated components that simplify circuit design.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is optimized for high-power applications, ensuring reliable and efficient operation.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on circuit boards, facilitating easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliable electrical connections, making installation straightforward and secure.

Nominal Turn Off Time (toff): 37000 ns

A relatively long turn-off time can provide improved switching performance in certain applications, suitable for high-power contexts.

No. of Terminals: 3

Three terminals indicate a simple and efficient design, enabling straightforward connections and reducing complexity in circuitry.

Maximum Power Dissipation (Abs): 176 W

With a maximum power dissipation of 176 W, this IGBT can handle substantial loads effectively, making it a strong choice for high-performance systems.

Package Style (Meter): IN-LINE

An in-line package style allows for better airflow and heat dissipation, enhancing the overall reliability of the component in demanding applications.

Maximum Operating Temperature: 175 °C

This high maximum operating temperature ensures that the IGBT can perform well in harsh environments, extending its applicability and lifespan.

Maximum Collector-Emitter Voltage: 380 V

A high collector-emitter voltage rating allows this IGBT to be used in various high-voltage applications, boosting versatility.

Transistor Element Material: SILICON

Silicon as the transistor material ensures good conductivity and reliability, making this IGBT suitable for a wide range of electronic applications.

Maximum Gate-Emitter Voltage: 12 V

A maximum gate-emitter voltage of 12V allows for easy interfacing with standard logic circuits, providing flexibility in design.

Maximum Collector Current (IC): 40 A

With a maximum collector current of 40 A, this IGBT is capable of handling significant current loads, perfect for power-intensive applications.

Maximum Gate-Emitter Threshold Voltage: 2.3 V

A low gate-emitter threshold voltage means this IGBT can be activated with standard logic levels, simplifying control circuitry.

Terminal Position: SINGLE

A single terminal position simplifies the installation process and helps to reduce assembly errors during manufacturing.

Case Connection: COLLECTOR

The collector case connection enables efficient heat dissipation and maintains stable operating temperatures, which is crucial for performance.

Nominal Turn On Time (ton): 7600 ns

A faster turn-on time (ton) enhances switching performance, resulting in improved efficiency and faster response in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB35N35LZ-1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

VOLTAGE CLAMPING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

380 V

Maximum Gate-Emitter Threshold Voltage:

2.3 V

Maximum Gate-Emitter Voltage:

12 V

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

37000 ns

Nominal Turn On Time (ton):

7600 ns

Trade Compliance

STGB35N35LZ-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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