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74V2T07STR

STMicroelectronics

74V2T07STR by STMicroelectronics

74V2T07STR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 10 ns and operates at a nominal voltage of 5V. It features an open-drain output and supports military-grade temperatures from -55 °C to 125°C. Ideal for compact, high-speed applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,677 parts In-Stock

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6,677

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Digiode

USA . 4,533 parts In-Stock

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4,533

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Anansix

USA . 1,852 parts In-Stock

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1,852

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Distributors (Availability)

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Microchip USA

USA . 210 parts In-Stock

1+ parts

$9.950

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210

$9.950

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IDEA Electronic Components Group

UK . 1,749 parts In-Stock

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$16.494

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-

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$14.844

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1,749

$16.494

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$14.844

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AZTECH Wire

Italy . 218 parts In-Stock

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$17.390

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218

$17.390

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Ampacity Inc.

Singapore . 1,645 parts In-Stock

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$24.000

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1,645

$24.000

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MKK Technologies

India . 1,969 parts In-Stock

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$31.015

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1,969

$31.015

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DigiPath Technology Company

USA . 1,969 parts In-Stock

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$31.015

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$31.015

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Corphita

USA . 4,841 parts In-Stock

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Native Components

USA . 509 parts In-Stock

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509

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Northwest PG Solutions

USA . 277 parts In-Stock

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Parana Technologies

USA . 276 parts In-Stock

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$19.721

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$19.721

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Overview

Unlock the power of precision with the 74V2T07STR from STMicroelectronics—a leader in innovative semiconductor solutions. This compact logic gate combines unmatched performance and reliability, ideal for diverse applications like automotive systems, industrial automation, and consumer electronics. Experience enhanced efficiency, low power consumption, and robust temperature resilience, ensuring your designs stand out in a competitive landscape while delivering exceptional value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and protection from environmental factors, making it a robust choice for various applications.

Propagation Delay At Nominal Supply: 10 ns

A low propagation delay of 10 ns allows for fast switching, which is crucial for high-speed applications and overall system performance.

Surface Mount: YES

Surface mount capability promotes compact designs and easier integration in modern electronic circuits, making it suitable for space-constrained applications.

No. of Functions: 3

Offering multiple functions increases versatility, allowing designers to optimize designs by incorporating fewer components.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient board layout and maximizes space utilization in printed circuit boards.

Nominal Supply Voltage / Vsup (V): 5

A standard nominal supply voltage of 5V ensures compatibility with a wide range of devices and systems, simplifying circuit design.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF enables the logic gate to handle various load conditions, ensuring stable operation in different scenarios.

Power Supplies (V): 5

Operating on a standard power supply voltage simplifies design and prevents the need for complex voltage regulation.

No. of Terminals: 8

Having 8 terminals allows for multiple inputs and outputs, enabling complex logic configurations and greater functionality.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design support high-density circuit designs, making it suitable for modern, compact electronic devices.

Maximum I (ol): 8 Amp

A maximum output current of 8 Amps provides flexibility in driving various loads, enhancing its utility in demanding applications.

Propagation Delay (tpd): 10 ns

Reiterating the 10 ns propagation delay highlights its significance in ensuring rapid data processing and reducing latency in circuits.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C ensures reliability in harsh environments, making it suitable for industrial and military applications.

Output Characteristics: OPEN-DRAIN

Open-drain outputs provide flexibility in circuit design, allowing for wired-AND configurations and better integration with other devices.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this product is ideal for extreme conditions often encountered in aerospace and military applications.

Terminal Position: DUAL

Dual terminal positioning aids in easy mounting and facilitates better connectivity, contributing to overall reliability.

Maximum Seated Height: 1.45 mm

A low seated height of 1.45 mm is beneficial for fitting the component into slim profile designs, without compromising performance.

Width: 1.625 mm

A compact width of 1.625 mm enables close placement of components, optimizing the PCB layout and enhancing performance.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V ensures operational reliability while also allowing for efficient power usage in the circuit.

Length: 2.9 mm

With a length of just 2.9 mm, this product fits well in space-constrained applications.

Temperature Grade: MILITARY

MILITARY-grade specifications indicate a high level of durability, ensuring reliable performance in mission-critical applications.

Technology: CMOS

CMOS technology provides low static power consumption, making it energy-efficient while maintaining high speed and performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mechanical stability on printed circuit boards, enhancing the assembly process.

Packing Method: TR

The TR packing method provides efficient handling and storage, making it accessible and easy to integrate into production lines.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density PCB designs, making it suitable for miniaturized electronic products.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides flexibility in power supply options, ensuring compatibility with a variety of systems.

Technical Specifications

Logic Gates 74V2T07STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2T07STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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