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74V2G32CTR

STMicroelectronics

74V2G32CTR by STMicroelectronics

74V2G32CTR by STMicroelectronics is a dual-input CMOS logic gate with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features an 8-terminal, thin-profile package suitable for military applications. With a wide temp range (-55 °C to 125°C), it's ideal for robust electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,688 parts In-Stock

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2,688

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Digiode

USA . 1,623 parts In-Stock

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1,623

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Anansix

USA . 348 parts In-Stock

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348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 376 parts In-Stock

1+ parts

$0.659

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376

$0.659

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Northwest PG Solutions

USA . 354 parts In-Stock

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$0.725

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354

$0.725

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IDEA Electronic Components Group

UK . 1,526 parts In-Stock

1+ parts

$7.715

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$6.944

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1,526

$7.715

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$6.944

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MKK Technologies

India . 986 parts In-Stock

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$14.508

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986

$14.508

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DigiPath Technology Company

USA . 986 parts In-Stock

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$14.508

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986

$14.508

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Corphita

USA . 3,068 parts In-Stock

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3,068

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Parana Technologies

USA . 113 parts In-Stock

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$9.225

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113

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$9.225

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Overview

Unlock unparalleled performance with the 74V2G32CTR from STMicroelectronics, a trusted leader in innovative electronics. This dual-input logic gate, designed for rugged environments, boasts exceptional reliability and efficiency, making it ideal for a range of applications from automotive to aerospace. With its compact design and military-grade temperature resilience, this product delivers outstanding value, ensuring your projects are powered by cutting-edge technology. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology facilitates compact designs and allows for automated assembly, enhancing production efficiency.

No. of Functions: 2

Having multiple functions in a single package helps reduce board space and complexity, providing flexibility in circuit design.

No. of Inputs: 2

With two inputs, this product can perform a variety of logical operations, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and straightforward integration into existing designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V makes this logic gate suitable for modern low-power electronics, contributing to energy efficiency.

No. of Terminals: 8

Having 8 terminals allows for versatile pin configurations, making it adaptable to various circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style enables high-density mounting and minimizes PCB space requirements, ideal for compact electronic devices.

Propagation Delay (tpd): 10.5 ns

A propagation delay of 10.5 ns ensures quick signal processing, beneficial for high-speed applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature enhances reliability in extreme environments, suitable for military and aerospace applications.

Minimum Operating Temperature: -55 °C

Operating down to -55 °C guarantees functionality in harsh cold conditions, expanding the range of possible applications.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in circuit layout and simplifies soldering.

Maximum Seated Height: 1.1 mm

The low seated height allows for more compact and low-profile designs, which is critical in modern electronics.

Width: 1.25 mm

Narrow width minimizes space usage, enabling denser and more efficient circuit layouts.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum of 2V makes this component compatible with a wide range of low-voltage applications.

Length: 2 mm

Compact length allows for optimized space utilization on printed circuit boards.

Temperature Grade: MILITARY

MIL-grade specifications ensure durability and performance under rigorous conditions, perfect for defense applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling and automated soldering, facilitating better manufacturing processes.

Packing Method: TR

Tape and reel packing is designed for automated placement, streamlining production and reducing assembly time.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density designs, benefiting compact electronic product development.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V ensures compatibility with a wide range of systems, enhancing versatility.

Technical Specifications

Logic Gates 74V2G32CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G32CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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