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74V2G02CTR

STMicroelectronics

74V2G02CTR by STMicroelectronics

74V2G02CTR by STMicroelectronics is a dual-input CMOS logic gate with a propagation delay of just 11.5 ns. It operates within a supply voltage range of 2-5.5 V and withstands temperatures from -55 °C to 125°C, making it ideal for military applications. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,570 parts In-Stock

1+ parts

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3,570

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Vyrian

USA . 3,221 parts In-Stock

1+ parts

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3,221

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Anansix

USA . 1,132 parts In-Stock

1+ parts

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1,132

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,104 parts In-Stock

1+ parts

$24.105

100+ parts

-

1k+ parts

$21.694

10k+ parts

-

2,104

$24.105

-

$21.694

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MKK Technologies

India . 433 parts In-Stock

1+ parts

$45.328

100+ parts

-

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433

$45.328

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DigiPath Technology Company

USA . 433 parts In-Stock

1+ parts

$45.328

100+ parts

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433

$45.328

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Native Components

USA . 905 parts In-Stock

1+ parts

$83.400

100+ parts

-

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10k+ parts

$80.064

905

$83.400

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-

$80.064

Northwest PG Solutions

USA . 1,970 parts In-Stock

1+ parts

$91.740

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1,970

$91.740

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Parana Technologies

USA . 1,950 parts In-Stock

1+ parts

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$28.821

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1,950

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$28.821

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Corphita

USA . 409 parts In-Stock

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409

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Overview

Elevate your designs with the 74V2G02CTR from STMicroelectronics, a trusted leader in innovation and quality. This dual-input CMOS logic gate combines exceptional speed and reliability, making it ideal for demanding applications in automotive, industrial, and consumer electronics. With its compact profile and proven performance in extreme conditions, this component offers unmatched value, ensuring your projects achieve superior efficiency and longevity. Choose STMicroelectronics for cutting-edge solutions that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection to the internal components, ensuring longevity and reliable performance in various environments.

Propagation Delay At Nominal Supply: 11.5 ns

This low propagation delay ensures fast switching speeds, making the product suitable for high-speed applications and improving overall system performance.

Surface Mount: YES

Surface mount technology enables compact circuit designs, increasing design flexibility and accommodating modern miniaturized electronics.

No. of Functions: 2

With two functions integrated into a single package, this product can simplify circuit designs and reduce component count, saving valuable board space.

No. of Inputs: 2

The dual input design offers versatility for various logical operations, making it suitable for both basic and more complex logic circuit applications.

Package Shape: RECTANGULAR

The rectangular package shape is standard and efficient for PCB layout, facilitating easier integration into existing designs.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V makes this logic gate compatible with a wide range of digital circuits, enhancing its adaptability.

Power Supplies (V): 2/5.5

Supporting both low and moderate voltage operations (2V to 5.5V) allows for flexibility in design, making it useful for different applications.

No. of Terminals: 8

The 8-terminal configuration facilitates easy integration into circuit designs while allowing multiple connections for both functions.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style is ideal for space-constrained applications, promoting higher density in electronic designs.

Maximum I (ol): 4 Amp

A high output current capability of 4 Amps allows this logic gate to drive substantial loads directly, enhancing its functionality in power applications.

Propagation Delay (tpd): 11.5 ns

Consistency in propagation delay signifies reliable operational timing, crucial for synchronized circuits in high-performance electronics.

Maximum Operating Temperature: 125 °C

A wide operating temperature range (up to 125 °C) ensures this product can function effectively in demanding environments, enhancing its reliability.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55 °C makes this logic gate suitable for applications in extreme conditions, including aerospace and military.

Terminal Position: DUAL

Dual terminal positioning simplifies wiring and connections, increasing ease of use in various designs.

Maximum Seated Height: 1.1 mm

A low seated height contributes to compact designs and efficient thermal management, making it excellent for modern electronics.

Width: 1.25 mm

This narrow width allows for efficient layout on PCBs, enabling denser circuit packing and improved performance.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum of 2V allows for low-power applications and makes it energy-efficient.

Length: 2 mm

Shorter lengths contribute to smaller footprints on PCBs, aiding in the design of compact electronic devices.

Temperature Grade: MILITARY

A military temperature grade indicates high reliability and performance under harsh conditions, making it suitable for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices and reducing energy costs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering during assembly, improving manufacturing efficiency and reliability.

Packing Method: TR

Tape and reel packaging enhances automated assembly processes, increasing production speed and reducing handling errors.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density designs, essential in modern compact electronics.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product provides flexibility in various applications, accommodating a range of operating conditions.

Technical Specifications

Logic Gates 74V2G02CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G02CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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