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74V2G05STR

STMicroelectronics

74V2G05STR by STMicroelectronics

74V2G05STR by STMicroelectronics is a CMOS logic gate with a propagation delay of 11 ns and operates at a supply voltage range of 2-5.5 V. It features open-drain output and is ideal for military applications due to its -55 °C to 125°C temp range. This compact, surface-mount device has 3 functions in an 8-terminal package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,042 parts In-Stock

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5,042

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Digiode

USA . 2,772 parts In-Stock

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2,772

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Anansix

USA . 2,662 parts In-Stock

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2,662

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 466 parts In-Stock

1+ parts

$0.508

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466

$0.508

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IDEA Electronic Components Group

UK . 2,203 parts In-Stock

1+ parts

$18.580

100+ parts

-

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$16.722

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-

2,203

$18.580

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$16.722

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AZTECH Wire

Italy . 519 parts In-Stock

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$21.400

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519

$21.400

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Native Components

USA . 228 parts In-Stock

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$22.760

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228

$22.760

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Northwest PG Solutions

USA . 1,249 parts In-Stock

1+ parts

$25.036

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$22.532

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1,249

$25.036

$22.532

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MKK Technologies

India . 629 parts In-Stock

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$34.939

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629

$34.939

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DigiPath Technology Company

USA . 629 parts In-Stock

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$34.939

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629

$34.939

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Component Stockers USA

USA . 672 parts In-Stock

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$99.990

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672

$99.990

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A-Z Elektronik GmbH

Germany . 6,048 parts In-Stock

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Corphita

USA . 3,166 parts In-Stock

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Parana Technologies

USA . 595 parts In-Stock

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$22.216

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Overview

Unlock unparalleled performance with the 74V2G05STR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile logic gate excels in demanding applications, delivering rapid response times and exceptional reliability. With its compact design and military-grade temperature resilience, it’s perfect for automotive and industrial uses. Experience enhanced efficiency and quality backed by STMicroelectronics’ commitment to excellence, ensuring your projects thrive with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it suitable for various environments.

Propagation Delay At Nominal Supply: 11 ns

A low propagation delay means faster switching times, enhancing performance in high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and simplified manufacturing processes.

No. of Functions: 3

Having three functions in one chip increases design flexibility and reduces the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for board layout efficiency.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at 3.3 V is ideal for modern low-power digital circuits.

Load Capacitance (CL): 50 pF

A low load capacitance allows for better speed and performance, especially in high-frequency applications.

Power Supplies (V): 2/5.5

The ability to operate across a range of supply voltages makes this product compatible with various systems.

No. of Terminals: 8

Eight terminals enable multiple I/O operations, enhancing the product's functionality in complex circuits.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style is space-efficient, making it suitable for compact electronic designs.

Maximum I (ol): 4 Amp

The high output current capability allows for driving larger loads, making it versatile for various applications.

Propagation Delay (tpd): 12.5 ns

With minimal propagation delay, this chip ensures timely signal processing crucial for fast digital circuits.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extreme environments.

Output Characteristics: OPEN-DRAIN

Open-drain output is suitable for wired-AND configurations, offering flexibility in designing complex logic circuits.

Minimum Operating Temperature: -55 °C

The ability to operate in extremely low temperatures makes this product suitable for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and design options on the PCB.

Maximum Seated Height: 1.45 mm

A low seated height ensures compatibility with compact placements in modern circuit boards.

Width: 1.625 mm

A narrow width allows for high-density placement on PCBs, maximizing efficient use of board area.

Minimum Supply Voltage (Vsup): 2 V

Operation at a minimum voltage of 2 V supports low-power applications, leading to battery efficiency.

Length: 2.9 mm

Short length helps in compact designs and saves valuable board space.

Temperature Grade: MILITARY

Designed to meet military standards, ensuring high reliability in critical applications.

Technology: CMOS

CMOS technology provides low static power consumption, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance soldering quality and reliability on PCBs.

Packing Method: TR

Tape and reel packing method facilitates automated assembly, boosting manufacturing efficiency.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for more compact PCB designs while maintaining signal integrity.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to tolerate a maximum supply voltage of 5.5 V adds flexibility in power management.

Technical Specifications

Logic Gates 74V2G05STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2G05STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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