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74V2G32STR

STMicroelectronics

74V2G32STR by STMicroelectronics

74V2G32STR by STMicroelectronics is a dual-input CMOS logic gate with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features an 8-terminal low-profile package and supports military-grade temperatures from -55 °C to 125°C. Ideal for compact electronic applications requiring fast switching speeds and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,333 parts In-Stock

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6,333

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Digiode

USA . 2,570 parts In-Stock

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2,570

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Anansix

USA . 2,558 parts In-Stock

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2,558

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Prism Electronics

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 980 parts In-Stock

1+ parts

$1.331

100+ parts

-

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980

$1.331

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Northwest PG Solutions

USA . 710 parts In-Stock

1+ parts

$1.464

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-

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710

$1.464

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Corohmni

South Africa . 615 parts In-Stock

1+ parts

$16.548

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615

$16.548

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AZTECH Wire

Italy . 1,200 parts In-Stock

1+ parts

$17.100

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1,200

$17.100

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$22.388

100+ parts

$20.373

1k+ parts

$18.358

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-

1,000

$22.388

$20.373

$18.358

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Microchip USA

USA . 291 parts In-Stock

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$23.383

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291

$23.383

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IDEA Electronic Components Group

UK . 1,493 parts In-Stock

1+ parts

$26.046

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-

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$23.442

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1,493

$26.046

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$23.442

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MKK Technologies

India . 596 parts In-Stock

1+ parts

$48.978

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596

$48.978

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DigiPath Technology Company

USA . 596 parts In-Stock

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$48.978

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596

$48.978

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Component Stockers USA

USA . 632 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 3,597 parts In-Stock

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3,597

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Parana Technologies

USA . 695 parts In-Stock

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$31.142

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695

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$31.142

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Perfect Parts

USA . 413 parts In-Stock

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413

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Overview

Unlock the potential of your designs with the 74V2G32STR from STMicroelectronics, a leader in innovative semiconductor solutions. This dual-input logic gate delivers exceptional performance and reliability, enhancing efficiency across various applications—from automotive to telecommunications. With its compact, low-profile package and robust temperature range, it ensures seamless integration in demanding environments. Choose ST for unparalleled quality and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package lightweight and ensures durability, providing optimal protection for the internal components.

Propagation Delay At Nominal Supply: 10.5 ns

A short propagation delay ensures fast signal processing, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact PCB designs, saving space.

No. of Functions: 2

With two functions, this logic gate provides versatility, allowing for different circuit configurations without needing multiple components.

No. of Inputs: 2

Having two inputs makes this component suitable for basic logic operations, providing simplicity in design while maintaining efficiency.

Package Shape: RECTANGULAR

The rectangular shape enhances the packing density on PCB layouts, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V is compatible with most modern digital systems, making the gate easy to implement in various applications.

Load Capacitance (CL): 50 pF

A low load capacitance of 50 pF ensures better speed performance, making the logic gate suitable for high-frequency designs.

Power Supplies (V): 2/5.5

The capability to operate with a wide range of power supplies (from 2V to 5.5V) offers flexibility in power management and design.

No. of Terminals: 8

With 8 terminals, this logic gate is designed for easy connectivity, ensuring straightforward integration into larger circuits.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design allow for high-density mounting options, ideal for space-constrained applications.

Maximum I (ol): 0.05 Amp

A maximum output current of 0.05 Amp makes it suitable for driving low-power loads while maintaining circuit integrity.

Propagation Delay (tpd): 10.5 ns

Consistent propagation delay enhances reliability in performance and ensures predictable behavior in timing-sensitive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this logic gate is suitable for demanding environments, ensuring reliability under heat stress.

Minimum Operating Temperature: -55 °C

A wide temperature range allows this component to function in extreme environments, making it suitable for military and aerospace applications.

Terminal Finish: TIN

The tin terminal finish provides good solderability and enhances the reliability of electrical connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in layout configuration, facilitating easier PCB design.

Maximum Seated Height: 1.45 mm

A low seated height profile supports designs requiring minimal component height, making it ideal for slim devices.

Width: 1.625 mm

The narrow width allows for tighter routing on PCBs, aiding in compact circuit designs.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V makes this logic gate adaptable for low-power electronic designs.

Peak Reflow Temperature °C: 260

A peak reflow temperature capability of 260 °C ensures compatibility with modern soldering processes, simplifying manufacturing.

Length: 2.9 mm

The compact length facilitates flexible board layouts, making it versatile for various applications.

Temperature Grade: MILITARY

Designed for military standards, this logic gate signifies high reliability and performance in critical applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this component efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals allow for easy handling and placement during assembly, enhancing manufacturing efficiency.

Packing Method: TR

The tape and reel (TR) packing method ensures easy automated assembly, streamlining the production process.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density packaging, optimizing board space for complex designs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V enhances operational flexibility, allowing the component to work in a wide range of applications.

Technical Specifications

Logic Gates 74V2G32STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.05 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2G32STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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