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SN74LVC1G04DRLR

Texas Instruments

SN74LVC1G04DRLR by Texas Instruments

SN74LVC1G04DRLR by Texas Instruments is a CMOS logic gate with 4.2 ns propagation delay at 3.3V, suitable for automotive applications. It has a small outline package with 5 terminals and operates within -40 to 125°C temperature range. With a load capacitance of 50 pF, it offers low power consumption at 0.01 mA ICC.

Median Price

$0.138

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2,784 parts In-Stock

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$0.101

100+ parts

$0.087

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$0.074

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$0.101

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Texas Instruments

USA . 14,042 parts In-Stock

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$0.164

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$0.111

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$0.057

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14,042

$0.164

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$0.057

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DigiKey

USA . 3,966 parts In-Stock

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$0.230

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$0.119

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$0.099

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3,966

$0.230

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Mouser Electronics

USA . 988 parts In-Stock

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$0.230

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$0.100

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$0.092

988

$0.230

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$0.092

Chip1Stop

Japan . 3,917 parts In-Stock

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$0.096

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$0.086

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$0.075

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$0.096

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$0.075

Verical

USA . 3,917 parts In-Stock

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$0.112

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$0.090

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$0.080

3,917

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Distributors (In-Stock)

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Digiode

USA . 1,393 parts In-Stock

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$0.123

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Nova Conductors

Japan . 150 parts In-Stock

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$0.126

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$0.126

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Component Electronics Inc.

Canada . 915 parts In-Stock

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$3.850

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$2.880

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$2.500

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915

$3.850

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$2.500

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Vyrian

USA . 9,779 parts In-Stock

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Bristol Electronics

USA . 9,619 parts In-Stock

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Atlantic Semiconductor

USA . 7,095 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,115 parts In-Stock

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Speed Components Ltd

Israel . 2,999 parts In-Stock

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Rebound Electronics

UK . 2,950 parts In-Stock

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PC Components Company LLC

USA . 2,414 parts In-Stock

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Connector Distribution Corp

USA . 480 parts In-Stock

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480

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Right Parts Inc.

USA . 480 parts In-Stock

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480

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Cogito LLC

Ukraine . 260 parts In-Stock

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Component Sense

UK . 168 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 10,061 parts In-Stock

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$0.077

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$0.077

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Semicontronic

India . 9,884 parts In-Stock

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$0.078

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$0.076

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$0.076

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9,884

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Corphita

USA . 479 parts In-Stock

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$0.116

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Argo Parts USA

USA . 3,655 parts In-Stock

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Continental Prestige Electronics

USA . 532 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.126

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Corohmni

South Africa . 222 parts In-Stock

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$12.030

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$18.798

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$17.858

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Parana Technologies

USA . 416 parts In-Stock

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$25.656

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$26.258

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DigiPath Technology Company

USA . 1,911 parts In-Stock

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$28.250

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$25.990

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ChromeModa Solutions

Germany . 5,721 parts In-Stock

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$28.827

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$23.638

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IDEA Electronic Components Group

UK . 728 parts In-Stock

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$28.827

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$27.386

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$25.944

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728

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$25.944

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Perfect Parts

USA . 54,852 parts In-Stock

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Lixinc

USA . 5,347 parts In-Stock

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Kepictronics

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S.R.D Solutions

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Overview

Unlock the power of cutting-edge technology with the SN74LVC1G04DRLR by Texas Instruments. Crafted with precision and expertise, this logic gate offers lightning-fast processing speeds and unparalleled reliability. Whether you're building automotive applications or high-performance electronics, this product delivers unmatched value and performance. Trust Texas Instruments to provide top-of-the-line solutions for all your electronic needs. Elevate your projects with the SN74LVC1G04DRLR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures quick signal processing, making this product efficient for high-speed operations.

Surface Mount: YES

Surface mount capability makes installation and soldering easy, perfect for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 3.3

Standard supply voltage allows easy integration with existing systems that operate on 3.3V.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance and signal integrity in various circuit configurations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the reliability and efficiency of the product.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes this product suitable for use in various environments, including automotive applications.

Technical Specifications

Logic Gates SN74LVC1G04DRLR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.2 mm

Trade Compliance

SN74LVC1G04DRLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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