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74V2G08CTR

STMicroelectronics

74V2G08CTR by STMicroelectronics

74V2G08CTR by STMicroelectronics is a dual-input CMOS logic gate with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features an 8-terminal gull-wing package and is suitable for military applications due to its wide temperature range (-55 °C to 125°C). Ideal for compact electronic designs, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,251 parts In-Stock

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4,251

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Vyrian

USA . 2,953 parts In-Stock

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2,953

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Anansix

USA . 935 parts In-Stock

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935

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IDEA Electronic Components Group

UK . 1,113 parts In-Stock

1+ parts

$17.250

100+ parts

-

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$15.525

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1,113

$17.250

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$15.525

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MKK Technologies

India . 519 parts In-Stock

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$32.438

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519

$32.438

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DigiPath Technology Company

USA . 519 parts In-Stock

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$32.438

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519

$32.438

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Corphita

USA . 1,723 parts In-Stock

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Northwest PG Solutions

USA . 1,500 parts In-Stock

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1,500

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Native Components

USA . 610 parts In-Stock

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610

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Parana Technologies

USA . 158 parts In-Stock

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$20.625

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$20.625

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Overview

Unlock the power of innovation with the 74V2G08CTR from STMicroelectronics, a leader in high-quality logic gates. Designed for versatility and reliability, this advanced CMOS device offers exceptional performance across various applications—from consumer electronics to industrial automation. With rapid propagation delays and robust temperature resilience, it ensures your designs are not only efficient but also future-proof. Elevate your projects with ST’s commitment to excellence and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material enhances durability and provides effective insulation, making the product reliable in various environmental conditions.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay ensures quick response times, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronics, catering to space-constrained applications.

No. of Functions: 2

The ability to perform two functions makes this logic gate versatile and efficient, enabling reduced component count and simplified circuit design.

No. of Inputs: 2

Having two inputs allows for basic logic operations, which are essential in most digital circuits, ensuring compatibility with a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier mounting on PCBs, thereby enhancing design flexibility and stability.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V makes this product compatible with many low-power digital systems, promoting energy efficiency.

Power Supplies (V): 2/5.5

Supports a wide range of power supplies (2V to 5.5V), accommodating various system voltage requirements and enhancing application flexibility.

No. of Terminals: 8

Having 8 terminals allows for multiple configuration options and connections, enhancing its compatibility with various circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline package style are ideal for innovative, space-saving designs, particularly in portable devices.

Maximum I (ol): 4 Amp

The capability to handle a maximum output current of 4 Amps ensures strong performance in driving loads, making it suitable for various applications.

Propagation Delay (tpd): 11 ns

With a propagation delay of just 11 ns, this product supports high-speed operations, allowing it to meet the demands of fast-acting circuits.

Maximum Operating Temperature: 125 °C

An operating temperature of up to 125 °C ensures reliability in high-temperature applications, making it a suitable choice for harsh environments.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature of -55 °C makes this logic gate ideal for use in extreme cold conditions, ensuring consistent operation.

Terminal Position: DUAL

The dual terminal position enhances the ease of use in PCB design, optimizing for various mounting techniques.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this product is suitable for applications requiring low-profile components, ensuring minimal component elevation.

Width: 1.25 mm

A narrow width of 1.25 mm allows for efficient use of board space, which is crucial in compact electronic devices.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V provides flexibility in power source selection, accommodating various low-voltage operating conditions.

Length: 2 mm

A compact length of 2 mm allows for high-density designs, making it suitable for miniaturized electronic circuits.

Temperature Grade: MILITARY

MILITARY grade temperature specifications ensure reliability and robustness under extreme conditions, making it ideal for defense applications.

Technology: CMOS

Using CMOS technology promotes low power consumption and high noise immunity, making this logic gate highly efficient for modern applications.

Terminal Form: GULL WING

Gull-wing terminals allow for easy soldering and assembly, improving manufacturability and ensuring robust connections.

Packing Method: TR

Through the packing method (TR), the product is organized for efficient handling and storage, aiding in streamlined assembly processes.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is fitting for modern PCB designs, allowing denser layouts and better space utilization.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V expands application possibilities across varying system requirements, accommodating a wide range of circuits.

Technical Specifications

Logic Gates 74V2G08CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G08CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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