Loading...

74V2G03CTR

STMicroelectronics

74V2G03CTR by STMicroelectronics

74V2G03CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 10 ns and operates at a nominal voltage of 3.3 V. It features open-drain output, dual inputs, and is ideal for military applications due to its wide temperature range (-55 °C to 125°C). This compact surface-mount device supports load capacitance up to 50 pF.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,877

-

-

-

-

Digiode

USA . 2,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

-

-

-

-

Vyrian

USA . 163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

163

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 383 parts In-Stock

1+ parts

$24.553

100+ parts

-

1k+ parts

$22.098

10k+ parts

-

383

$24.553

-

$22.098

-

MKK Technologies

India . 1,311 parts In-Stock

1+ parts

$46.170

100+ parts

-

1k+ parts

-

10k+ parts

-

1,311

$46.170

-

-

-

DigiPath Technology Company

USA . 1,311 parts In-Stock

1+ parts

$46.170

100+ parts

-

1k+ parts

-

10k+ parts

-

1,311

$46.170

-

-

-

Parana Technologies

USA . 1,369 parts In-Stock

1+ parts

-

100+ parts

$29.357

1k+ parts

-

10k+ parts

-

1,369

-

$29.357

-

-

Corphita

USA . 1,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,317

-

-

-

-

Northwest PG Solutions

USA . 804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

804

-

-

-

-

Native Components

USA . 617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

617

-

-

-

-

Overview

Elevate your designs with the 74V2G03CTR from STMicroelectronics, a premier logic gate that ensures reliability and performance in diverse applications. Backed by ST's renowned quality and innovation, this compact, surface-mount component excels in efficiency and speed, making it perfect for automotive, industrial, and consumer electronics. Experience enhanced functionality and longevity, simplifying your design process while maximizing value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protects against environmental factors, making this logic gate suitable for various applications.

Propagation Delay At Nominal Supply: 10 ns

A short propagation delay ensures quicker signal processing, ideal for high-speed digital applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space on PCBs, facilitating compact designs in modern electronics.

No. of Functions: 2

Having two functions adds versatility to the device, enabling it to perform multiple tasks within a single chip.

No. of Inputs: 2

Two inputs offer flexibility for various circuit designs, allowing for more complex logic operations.

Package Shape: RECTANGULAR

A rectangular shape optimizes layout and spacing on circuit boards, catering to different design requirements.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V makes it compatible with many modern electronic systems, ensuring stability and performance.

Load Capacitance (CL): 50 pF

Low load capacitance allows for faster switching speeds, which is crucial for maintaining performance in high-speed applications.

Power Supplies (V): 2/5.5

The flexibility in power supply range offers compatibility with a variety of systems, enabling versatile deployment.

No. of Terminals: 8

Having 8 terminals provides ample connection opportunities, supporting complex circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are essential for compact electronic designs, making it easier to fit into tight spaces.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps enhances the device's capability to drive loads, improving its utility in diverse applications.

Propagation Delay (tpd): 11 ns

With a propagation delay of 11 ns, this logic gate ensures efficient data transfer, which is vital for high-performance computing.

Maximum Operating Temperature: 125 °C

A high operating temperature tolerance means reliability in extreme environments, suitable for military and industrial applications.

Output Characteristics: OPEN-DRAIN

Open-drain outputs allow for wired-AND logic configurations, adding flexibility in multi-device communication setups.

Minimum Operating Temperature: -55 °C

The ability to operate at -55 °C makes this logic gate ideal for harsh environments, such as aerospace and military applications.

Terminal Position: DUAL

Dual terminal positions improve ease of layout and soldering, simplifying manufacturing processes.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a compact design, allowing for denser PCB layouts.

Width: 1.25 mm

A narrow width aids in miniaturization efforts in electronic devices, making it suitable for portable applications.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2V enhances compatibility with a broader range of electronic systems, including low-power devices.

Length: 2 mm

A compact length ensures efficient space utilization on circuit boards, accommodating high-density designs.

Temperature Grade: MILITARY

Designed for military use, this logic gate is built to withstand rigorous conditions, ensuring reliability in critical applications.

Technology: CMOS

The CMOS technology used offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, enhancing manufacturing efficiency.

Packing Method: TR

Tape and reel packing allows for automated assembly processes, streamlining production and reducing costs.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports modern compact circuit designs, allowing for increased functionality within limited space.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle up to 5.5V provides versatility in various applications, ensuring robust performance across different voltage levels.

Technical Specifications

Logic Gates 74V2G03CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G03CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19