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74V2G08STR

STMicroelectronics

74V2G08STR by STMicroelectronics

74V2G08STR by STMicroelectronics is a dual-input CMOS logic gate with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. Its compact design features an 8-terminal gull-wing package, ideal for military applications requiring high reliability. With a max temp of 125 °C, it suits demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 9,000 parts In-Stock

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9,000

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Vyrian

USA . 5,241 parts In-Stock

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5,241

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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3,000

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Anansix

USA . 2,547 parts In-Stock

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2,547

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Digiode

USA . 1,765 parts In-Stock

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1,765

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 645 parts In-Stock

1+ parts

$8.540

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-

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645

$8.540

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IDEA Electronic Components Group

UK . 2,235 parts In-Stock

1+ parts

$8.585

100+ parts

-

1k+ parts

$7.726

10k+ parts

-

2,235

$8.585

-

$7.726

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Northwest PG Solutions

USA . 743 parts In-Stock

1+ parts

$9.394

100+ parts

$8.455

1k+ parts

-

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743

$9.394

$8.455

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AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$15.010

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647

$15.010

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MKK Technologies

India . 400 parts In-Stock

1+ parts

$16.143

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400

$16.143

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DigiPath Technology Company

USA . 400 parts In-Stock

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$16.143

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400

$16.143

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Microchip USA

USA . 409 parts In-Stock

1+ parts

$22.824

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409

$22.824

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Kepictronics

USA . 5,388 parts In-Stock

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5,388

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A-Z Elektronik GmbH

Germany . 1,847 parts In-Stock

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Assy Fe

Spain . 1,170 parts In-Stock

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Corphita

USA . 1,138 parts In-Stock

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Futuretech Components

Singapore . 845 parts In-Stock

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845

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Parana Technologies

USA . 692 parts In-Stock

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$10.264

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692

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$10.264

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Perfect Parts

USA . 224 parts In-Stock

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224

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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50

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Overview

Unlock unparalleled performance with the 74V2G08STR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile logic gate not only ensures rapid response times but also excels in demanding environments, making it perfect for automotive, industrial, and communication applications. Benefit from its compact design and energy efficiency, elevating your projects while enjoying the trusted reliability of STMicroelectronics. Experience innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resistance to environmental factors.

Propagation Delay At Nominal Supply: 10.5 ns

With low propagation delays, this logic gate enables high-speed processing, making it suitable for fast circuits.

Surface Mount: YES

Surface mount capability allows for compact designs and higher density circuit layouts.

No. of Functions: 2

Supporting two functions increases versatility and efficiency in circuit design.

No. of Inputs: 2

The dual-input configuration allows for straightforward integration in multi-gate designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier placement in circuit boards and optimizes space use.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common nominal voltage makes this gate compatible with a wide range of devices.

Power Supplies (V): 2/5.5

Supports a range of supply voltages, offering flexibility for various applications.

No. of Terminals: 8

The eight terminals allow for various connections, thereby enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile design is optimal for modern compact devices requiring minimal space.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps allows it to drive substantial loads efficiently.

Propagation Delay (tpd): 11 ns

A low propagation delay ensures rapid signal transitions, which is crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, ensuring reliability in demanding environments.

Minimum Operating Temperature: -55 °C

The ability to function in extreme cold makes it suitable for various industrial applications.

Terminal Position: DUAL

Dual terminal positioning aids in better surface mounting and connectivity.

Maximum Seated Height: 1.45 mm

The low seated height keeps the device compact and compatible with space-constrained applications.

Width: 1.625 mm

A slim width allows this logic gate to fit into tight spaces on circuit boards.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a low minimum supply voltage enables power efficiency in low-voltage designs.

Peak Reflow Temperature °C: 260

Withstand high peak reflow temperatures, the device is suitable for modern soldering techniques.

Length: 2.9 mm

A compact length allows this component to be used effectively in space-constrained designs.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this product ensures robustness and reliability in extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, which is ideal for portable devices.

Terminal Form: GULL WING

The gull-wing terminal form enhances soldering quality and reliability in industrial applications.

Packing Method: TR

Tape and reel packaging is convenient for automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for tighter layouts, which is essential for high-density designs.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate up to 5.5 V allows integration into various systems while ensuring stable performance.

Technical Specifications

Logic Gates 74V2G08STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2G08STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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