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SN74LVC1G14DCKRG4

Texas Instruments

SN74LVC1G14DCKRG4 by Texas Instruments

SN74LVC1G14DCKRG4 by Texas Instruments is a CMOS logic gate with 5.5 ns propagation delay, suitable for automotive applications. It operates at 3.3V with a load capacitance of 50 pF and features Schmitt Trigger technology. This small-outline package has a thin profile and is surface-mountable, making it ideal for compact electronic designs.

Median Price

$0.298

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Arrow

USA . 116 parts In-Stock

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$0.298

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$0.116

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$0.116

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Mouser Electronics

USA . 79,841 parts In-Stock

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$0.340

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$0.179

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$0.150

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$0.137

79,841

$0.340

$0.179

$0.150

$0.137

DigiKey

USA . 6,063 parts In-Stock

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$0.340

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$0.179

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$0.150

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6,063

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Avnet

USA . 60,000 parts In-Stock

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Chip1Stop

Japan . 2,395 parts In-Stock

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$0.123

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$0.077

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Verical

USA . 1,170 parts In-Stock

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$0.293

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$0.213

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Distributors (In-Stock)

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Digiode

USA . 1,685 parts In-Stock

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$0.264

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$0.264

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Nova Conductors

Japan . 500 parts In-Stock

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$0.469

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$0.469

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Chip Stock

USA . 962,660 parts In-Stock

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Vyrian

USA . 31,423 parts In-Stock

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Bristol Electronics

USA . 4,770 parts In-Stock

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$0.045

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4,770

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$0.045

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Connector Distribution Corp

USA . 800 parts In-Stock

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Right Parts Inc.

USA . 800 parts In-Stock

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Holdelec - ElecDif-Pro

France . 640 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 31,586 parts In-Stock

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$0.105

100+ parts

$0.102

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$0.102

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31,586

$0.105

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Ampacity Inc.

Singapore . 31,210 parts In-Stock

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$0.105

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Corohmni

South Africa . 832 parts In-Stock

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$0.155

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$0.160

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$0.152

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$0.152

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$0.160

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Modulus Dynamics

Lithuania . 700 parts In-Stock

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$0.172

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$0.170

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$0.165

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Corphita

USA . 1,893 parts In-Stock

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Continental Prestige Electronics

USA . 4,953 parts In-Stock

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$0.292

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$0.286

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Argo Parts USA

USA . 3,927 parts In-Stock

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$0.283

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Netroflash

USA . 1,000 parts In-Stock

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$0.469

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$0.446

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$0.436

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$0.469

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$0.436

Parana Technologies

USA . 872 parts In-Stock

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$23.240

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$23.871

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ChromeModa Solutions

Germany . 6,184 parts In-Stock

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$26.112

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$21.412

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

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Lixinc

USA . 14,176 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,836 parts In-Stock

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Robosynatics

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Lucentia Tech

USA . 3,000 parts In-Stock

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Kepictronics

USA . 2,550 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 1,227 parts In-Stock

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iodParts Technologies Inc.

India . 39 parts In-Stock

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Overview

Texas Instruments presents the SN74LVC1G14DCKRG4, a high-quality logic gate designed with precision and reliability in mind. Perfect for automotive applications, this compact and efficient component offers a fast propagation delay and low power consumption, making it ideal for space-constrained environments where performance is key. Trust Texas Instruments for cutting-edge technology that delivers value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance of the logic gate.

Propagation Delay At Nominal Supply: 5.5 ns

Fast signal propagation ensures quick response times in logic operations, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and making assembly more efficient.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of electronic systems.

Power Supplies (V): 3.3

Efficiently utilizes power at the specified voltage, optimizing energy consumption and reducing heat generation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this logic gate a reliable choice for various applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for industrial environments or applications that require extended temperature ranges.

Minimum Supply Voltage (Vsup): 1.65 V

Operates at low supply voltage, making it ideal for battery-powered devices or applications with limited power availability.

Schmitt Trigger: YES

Incorporation of Schmitt trigger ensures signal integrity by providing hysteresis, improving noise immunity and signal stability.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes, ensuring reliability and longevity of the product.

Technical Specifications

Logic Gates SN74LVC1G14DCKRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G14DCKRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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