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74V2G07CTR

STMicroelectronics

74V2G07CTR by STMicroelectronics

74V2G07CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11 ns and operates at supply voltages b/w 2-5.5 V. It features an open-drain output and is ideal for military applications due to its -55 °C to 125°C temp range. This compact, surface-mount device has three functions in an 8-terminal package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 2,508 parts In-Stock

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Digiode

USA . 265 parts In-Stock

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265

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Vyrian

USA . 152 parts In-Stock

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152

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Distributors (Availability)

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Native Components

USA . 286 parts In-Stock

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$0.532

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286

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Northwest PG Solutions

USA . 281 parts In-Stock

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$0.586

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IDEA Electronic Components Group

UK . 9 parts In-Stock

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$18.358

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$16.522

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$16.522

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MKK Technologies

India . 1,809 parts In-Stock

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$34.520

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DigiPath Technology Company

USA . 1,809 parts In-Stock

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$34.520

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$34.520

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Parana Technologies

USA . 753 parts In-Stock

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$21.949

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Corphita

USA . 201 parts In-Stock

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Overview

Elevate your designs with the 74V2G07CTR from STMicroelectronics, a premium logic gate solution crafted for reliability and performance. This compact, surface-mount device excels in diverse applications, delivering swift response times and robust operation across temperatures. Trust in STMicroelectronics’ legacy of innovation to enhance your projects with efficiency and precision, ensuring your systems run flawlessly while maximizing value and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures good durability and lightweight characteristics, essential for compact electronic devices.

Propagation Delay At Nominal Supply: 11 ns

This low propagation delay allows for faster signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology enables the product to occupy less space on PCBs, facilitating compact design.

No. of Functions: 3

Having multiple functions in a single product increases design flexibility and reduces component count.

Package Shape: RECTANGULAR

The rectangular shape optimizes surface area for mounting, contributing to efficient layout on circuit boards.

Nominal Supply Voltage / Vsup: 3.3 V

The compatibility with 3.3V supply makes it a popular choice for modern digital circuits, particularly in low-power applications.

Load Capacitance (CL): 50 pF

A low load capacitance minimizes signal distortion and ensures better performance in high-frequency applications.

Power Supplies (V): 2/5.5 V

The wide supply voltage range offers flexibility in diverse applications, accommodating various design requirements.

No. of Terminals: 8

With 8 terminals, the product provides multiple connectivity options while fitting into standard layouts.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to space-saving designs, ideal for compact and portable devices.

Maximum I (ol): 4 Amp

The capability to handle up to 4 A of output current makes it suitable for various power applications.

Propagation Delay (tpd): 12.5 ns

The propagation delay of 12.5 ns ensures responsive signal transitions, critical for time-sensitive electronics.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating allows the product to perform reliably in demanding thermal environments.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for easier integration into wired logic configurations and multiple device interfacing.

Minimum Operating Temperature: -55 °C

A wide operating temperature range makes this product ideal for extreme conditions, suitable for military or aerospace applications.

Terminal Position: DUAL

Dual terminal position enhances routing flexibility on PCBs, simplifying the design layout.

Maximum Seated Height: 1.1 mm

The low seated height allows for tighter packaging of components, meeting modern design requirements.

Width: 1.25 mm

The narrow width supports high-density component layouts, enabling the creation of more compact devices.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V allows for operation in battery-powered applications with minimal voltage.

Length: 2 mm

The short length contributes to a compact footprint, allowing for efficient use of PCB real estate.

Temperature Grade: MILITARY

The military temperature grade ensures reliability in critical applications, suitable for harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, essential for modern electronic circuits.

Terminal Form: GULL WING

Gull wing terminals offer excellent mechanical strength and easier soldering, enhancing production reliability.

Packing Method: TR

The tape and reel packing method facilitates automatic placement in manufacturing, improving efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for increased component density, meeting the demands of miniaturized designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V offers compatibility with a wider range of circuit designs and applications.

Technical Specifications

Logic Gates 74V2G07CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G07CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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