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74V2G04STR

STMicroelectronics

74V2G04STR by STMicroelectronics

74V2G04STR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11.5 ns, operating b/w 2-5.5 V. It features three functions in a compact 8-terminal package, ideal for military applications due to its wide temperature range (-55 °C to 125°C). Its low profile design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,624 parts In-Stock

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5,624

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Digiode

USA . 2,291 parts In-Stock

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2,291

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Anansix

USA . 2,076 parts In-Stock

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2,076

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Distributors (Availability)

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Microchip USA

USA . 264 parts In-Stock

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$0.575

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264

$0.575

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IDEA Electronic Components Group

UK . 1,057 parts In-Stock

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$10.252

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-

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$9.226

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1,057

$10.252

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$9.226

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AZTECH Wire

Italy . 849 parts In-Stock

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$17.060

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849

$17.060

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MKK Technologies

India . 1,855 parts In-Stock

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$19.277

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1,855

$19.277

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DigiPath Technology Company

USA . 1,855 parts In-Stock

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$19.277

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1,855

$19.277

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Native Components

USA . 900 parts In-Stock

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$30.638

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$29.413

900

$30.638

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$29.413

Northwest PG Solutions

USA . 1,532 parts In-Stock

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$33.702

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$33.702

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A-Z Elektronik GmbH

Germany . 7,061 parts In-Stock

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7,061

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Parana Technologies

USA . 1,127 parts In-Stock

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$12.257

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$12.257

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Corphita

USA . 997 parts In-Stock

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Overview

Unlock unparalleled performance with the 74V2G04STR from STMicroelectronics, a leader in innovation and quality. This versatile logic gate enhances your designs with swift propagation delays and robust reliability, making it ideal for both commercial and military applications. Experience the benefits of superior temperature tolerance and low power consumption that ensure longevity in diverse environments. Elevate your projects with a trusted partner in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Propagation Delay At Nominal Supply: 11.5 ns

A low propagation delay enhances the speed of operation, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

No. of Functions: 3

Offering multiple functions, this product increases versatility and reduces the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape promotes efficient space utilization on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V aligns with common digital systems, ensuring compatibility.

Load Capacitance (CL): 50 pF

A low load capacitance enhances overall performance by minimizing load effects on signal integrity.

Power Supplies (V): 2/5.5

The flexibility to operate with different supply voltages adds convenience for various applications.

No. of Terminals: 8

Eight terminals allow for diverse connections and make it easier to integrate into existing designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design is ideal for space-constrained applications.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps supports a wide range of driving and switching applications.

Propagation Delay (tpd): 11.5 ns

Consistency in propagation delay reaffirms the ability to maintain fast performance in circuits.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

A wide operational temperature range makes this product suitable for various industrial and military applications.

Terminal Finish: TIN

Tin terminal finish promotes good solderability and overall durability of connections.

Terminal Position: DUAL

Dual terminal position optimizes layout possibilities in the design and implementation of circuits.

Maximum Seated Height: 1.45 mm

A low seated height contributes to a slimmer design while maintaining strong electrical performance.

Width: 1.625 mm

A compact width allows for denser placement of components on PCBs.

Minimum Supply Voltage (Vsup): 2 V

Operates at a minimum supply voltage of 2V, making it versatile for low-power applications.

Peak Reflow Temperature °C: 260

The ability to withstand high temperatures during reflow soldering ensures robust construction.

Length: 2.9 mm

A short length aids in efficient use of board space while maintaining functional performance.

Temperature Grade: MILITARY

Military-grade components indicate high reliability and performance in critical applications.

Technology: CMOS

The use of CMOS technology enables low power consumption and high density in logic functions.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy handling and automated assembly in manufacturing.

Packing Method: TR

Tape and reel packing is ideal for automated assembly processes, reducing handling time.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for compact designs, accommodating more components in a given area.

Maximum Supply Voltage (Vsup): 5.5 V

The capacity to operate at up to 5.5V provides flexibility in various electronic applications.

Technical Specifications

Logic Gates 74V2G04STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2G04STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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