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74V2G14STR

STMicroelectronics

74V2G14STR by STMicroelectronics

74V2G14STR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a propagation delay of just 10.5 ns. It operates b/w 2-5.5 V and features three functions in an 8-terminal, low-profile package. Ideal for military applications, it withstands temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,667 parts In-Stock

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5,667

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Digiode

USA . 3,151 parts In-Stock

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3,151

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Anansix

USA . 2,156 parts In-Stock

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2,156

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Prism Electronics

USA . 12 parts In-Stock

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12

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Microchip USA

USA . 118 parts In-Stock

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$1.691

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118

$1.691

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AZTECH Wire

Italy . 97 parts In-Stock

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$20.440

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97

$20.440

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IDEA Electronic Components Group

UK . 1,203 parts In-Stock

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$25.442

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$22.898

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$25.442

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$22.898

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Native Components

USA . 225 parts In-Stock

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$31.528

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$30.267

225

$31.528

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$30.267

Northwest PG Solutions

USA . 662 parts In-Stock

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$34.681

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662

$34.681

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MKK Technologies

India . 2,228 parts In-Stock

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$47.841

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2,228

$47.841

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DigiPath Technology Company

USA . 2,228 parts In-Stock

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$47.841

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$47.841

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A-Z Elektronik GmbH

Germany . 7,304 parts In-Stock

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Assy Fe

Spain . 2,729 parts In-Stock

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Corphita

USA . 2,341 parts In-Stock

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Kepictronics

USA . 441 parts In-Stock

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Parana Technologies

USA . 172 parts In-Stock

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$30.419

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Perfect Parts

USA . 13 parts In-Stock

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Overview

Unlock exceptional performance with the 74V2G14STR from STMicroelectronics, a leader in advanced semiconductor solutions. This high-quality logic gate delivers rapid response times and robust reliability for diverse applications, from automotive systems to industrial automation. With its compact design and military-grade specifications, this versatile component ensures efficiency and durability, empowering your designs to excel while minimizing energy consumption. Experience the advantage of ST's commitment to innovation and quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay enhances the speed of data processing, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier assembly on PCBs.

No. of Functions: 3

Multi-functional capabilities in a single package increase efficiency and reduce component count in designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards, facilitating easier layout and integration.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of devices and power sources.

Power Supplies (V): 2/5.5

Versatile voltage supply range accommodates various application requirements, adding flexibility to designs.

No. of Terminals: 8

Having 8 terminals allows for extensive connectivity options while still fitting into compact designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This style is ideal for space-constrained applications, enabling higher component density.

Maximum I(ol): 4 Amp

High output current capability allows the logic gate to drive larger loads, making it suitable for robust applications.

Propagation Delay (tpd): 10.5 ns

Consistent low propagation delay supports efficient data processing and reduces system bottlenecks.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in demanding conditions found in industrial applications.

Minimum Operating Temperature: -55 °C

The wide temperature range allows for use in extreme environments, enhancing the product’s versatility.

Terminal Position: DUAL

Dual terminal positioning facilitates different mounting options, providing greater design flexibility.

Maximum Seated Height: 1.45 mm

Low profile design aids in making devices thinner while maintaining performance.

Width: 1.625 mm

Compact width allows for high-density PCB designs without sacrificing performance.

Minimum Supply Voltage (Vsup): 2 V

The capability to operate at a minimum voltage of 2V expands its usability in low-power applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with modern soldering processes during assembly.

Length: 2.9 mm

Short length contributes to the compact footprint, matching the trend for smaller electronic devices.

Temperature Grade: MILITARY

Military-grade specifications ensure high reliability and performance in critical applications.

Schmitt Trigger: YES

Incorporating a Schmitt trigger enhances noise immunity and improves switching performance, critical in noisy environments.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical and electrical connections, facilitating easier soldering and assembly.

Packing Method: TR

Taped and reeled for easy handling and automated assembly, increasing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A 0.65 mm pitch provides an optimal balance between compactness and ease of soldering, enhancing design flexibility.

Maximum Supply Voltage (Vsup): 5.5 V

Ability to handle up to 5.5V allows for integration with various applications without risk of damage.

Technical Specifications

Logic Gates 74V2G14STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2G14STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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